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20 mil RO4003C PCB
20 mil RO4003C PCB
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  • Can You Handle High-frequency (RF/microwave) PCBs? Materials?
    • April 16. 2025

    Can You Handle High-frequency (RF/microwave) PCBs? Materials? Introduction High-frequency PCBs, particularly those used in RF (Radio Frequency) and microwave applications, require specialized materials and manufacturing expertise. Unlike standard FR-4 PCBs, these boards must maintain signal integrity, minimize dielectric losses, and withstand extreme thermal conditions. A common question we encoun...

  • What Is Your Minimum Drill Hole Size?
    • April 16. 2025

    What Is Your Minimum Drill Hole Size? A Comprehensive Guide to PCB Drilling Capabilities When designing a printed circuit board (PCB), one critical specification engineers must consider is the minimum drill hole size. This parameter determines the feasibility of vias, through-holes, and microvias, directly impacting the board’s functionality, density, and cost. In this article, we’ll explore: - St...

  • How Do You Handle PCB Panelization?
    • April 16. 2025

    How Do You Handle PCB Panelization? PCB Panelization: Optimizing Panel Size for Cost-Efficiency (V-Cut vs. Tab Routing) Introduction In PCB manufacturing, panelizationis a critical step that directly impacts production efficiency, material utilization, and overall cost. Panelization involves arranging multiple PCB designs onto a single manufacturing panel to optimize fabrication and assembly ...

  • Why Dk/Df Values Matter: Dielectric Properties' Impact on Signal Integrity in High-Frequency PCBs
    • May 21. 2025

    Why Dk/Df Values Matter: Dielectric Properties' Impact on Signal Integrity in High-Frequency PCBs Introduction In the world of high-frequency printed circuit boards(PCBs), signal integrity is paramount. As data rates increase and wireless technologies evolve, the dielectric properties of PCB materials play a critical role in ensuring reliable performance. Two key parameters—dielectric constant (Dk...

  • PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges?
    • June 12. 2025

    PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges? Introduction Polytetrafluoroethylene (PTFE), commonly known by the brand name Teflon (TFE), is a high-performance material widely used in printed circuit boards (PCBs) for high-frequency applications. Its low dielectric constant (Dk) and dissipation factor (Df) make it ideal for RF, microwave, and millimeter-w...

  • How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates?
    • June 12. 2025

    How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates? Introduction High-frequency PCBs are critical in modern RF and microwave applications, including 5G communications, radar systems, and satellite technology. Selecting the right substrate material is essential to ensure signal integrity, thermal stability, and manufacturability. Three of the most commonly used high-frequency PCB ma...

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