• April 16. 2025

Can You Handle High-frequency (RF/microwave) PCBs? Materials? Introduction High-frequency PCBs, particularly those used in RF (Radio Frequency) and microwave applications, require specialized materials and manufacturing expertise. Unlike standard FR-4 PCBs, these boards must maintain signal integrity, minimize dielectric losses, and withstand extreme thermal conditions. A common question we encoun...

• April 16. 2025

What Is Your Minimum Drill Hole Size? A Comprehensive Guide to PCB Drilling Capabilities When designing a printed circuit board (PCB), one critical specification engineers must consider is the minimum drill hole size. This parameter determines the feasibility of vias, through-holes, and microvias, directly impacting the board’s functionality, density, and cost. In this article, we’ll explore: - St...

• April 16. 2025

How Do You Handle PCB Panelization? PCB Panelization: Optimizing Panel Size for Cost-Efficiency (V-Cut vs. Tab Routing) Introduction In PCB manufacturing, panelizationis a critical step that directly impacts production efficiency, material utilization, and overall cost. Panelization involves arranging multiple PCB designs onto a single manufacturing panel to optimize fabrication and assembly ...

• May 21. 2025

How to Choose the Right PCB Substrate for High-Frequency Applications? (Rogers vs. FR4 Comparison) Introduction In today's rapidly advancing electronics industry, selecting the right printed circuit board (PCB) substrate material has become increasingly critical—especially for high-frequency applications. Whether you're designing cellular base stations, automotive radar systems, or satellite commu...

• May 21. 2025

Why Dk/Df Values Matter: Dielectric Properties' Impact on Signal Integrity in High-Frequency PCBs Introduction In the world of high-frequency printed circuit boards(PCBs), signal integrity is paramount. As data rates increase and wireless technologies evolve, the dielectric properties of PCB materials play a critical role in ensuring reliable performance. Two key parameters—dielectric constant (Dk...

• May 21. 2025

Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...