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Home Newly Shipped RF PCB F4BTMS1000 PCB 2-layer 20mil 0.508mm Thick DK 10.0 F4BTMS Series High Frequency substrates

F4BTMS1000 PCB 2-layer 20mil 0.508mm Thick DK 10.0 F4BTMS Series High Frequency substrates

The F4BTMS1000 high DK 10.0 PCB material is a cutting-edge,high-frequency circuit board designed for aerospace, defense, and RF applications.

  • Item NO.:

    BIC-327-v406.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


F4BTMS1000 PCB 2-layer 20mil 0.508mm Thick DK 10.0 F4BTMS Series High Frequency substrates

 

F4BTMS1000 PCB Introduction

In the realm of PCB technology, the F4BTMS1000 PCB stands as a true embodiment of excellence. Designed with utmost precision and incorporating cutting-edge advancements, this 2-layer rigid PCB is set to the way we approach electronic circuitry. With its superior construction, remarkable material properties, and extensive range of applications, the F4BTMS1000 20mil substrate PCB is poised to meet the demands of modern industries. Let us delve deeper into itsmore details.

 

F4BTMS Introduction

The F4BTMS series represents a breakthrough in material technology and has elevated the standards of high-performance PCBs. By infusing the F4BTMS1000 with ultra-thin glass fiber cloth and a generous proportion of specially formulated nano-ceramics blended with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. Consequently, this minimizes dielectric loss, ensures dimensional stability, reduces X/Y/Z anisotropy, expands the usable frequency range, enhances electrical strength, and improves thermal conductivity. Moreover, the F4BTMS1000 DK10.0 PCB material exhibits an exceptional low thermal expansion coefficient and stable dielectric temperature characteristics.

 

F4BTMS1000 Material Properties

Dielectric Constant (Dk): 10.2 @ 10GHz

Dissipation Factor (Df): 0.0020 @ 10GHz, 0.0023 @ 20GHz

Coefficient of Thermal Expansion (CTE):

X-axis: 16 ppm/°C

Y-axis: 18 ppm/°C

Z-axis: 32 ppm/°C (from -55°C to 288°C)

 

Thermal Conductivity: 0.81 W/mK

Moisture Absorption: 0.03% (extremely low)

Thermal Coefficient of Dk: -320 ppm/°C (-55°C to 150°C)


F4BTMS1000 PCB

 

PCB Construction

Parameter

Specification

Base Material

F4BTMS1000 (Ceramic-Filled PTFE)

Layer Count

2 layers

Board Dimensions

85mm x 40mm (±0.15mm tolerance)

Board Thickness

0.6mm (0.508mm core + 35μm Cu layers)

Copper Weight

1oz (35μm) on outer layers

Minimum Trace/Space

4/4 mils

Minimum Hole Size

0.3mm

Via Plating Thickness

20μm

Surface Finish

OSP (Organic Solderability Preservative)

Solder Mask

None (Bare copper)

Silkscreen

None

Blind/Buried Vias

No

Electrical Testing

100% tested before shipment

 

PCB Statistic

Category

Count

Components

21

Total Pads

60

Thru Hole Pads

33

Top SMT Pads

27

Bottom SMT Pads

0

Vias

41

Nets

2

 

PCBStack-up

Top Layer Copper–35μm (1oz)

F4BTMS1000 Core–0.508mm (20 mil)

Bottom Layer Copper–35μm (1oz)

 

Why Choose F4BTMS1000 PCB?

1. Superior High-Frequency Performance

  • TheF4BTMS1000 materialis engineered for RF, microwave, and millimeter-wave applications, offering:
  • Stable Dk (10.2) across a wide frequency range (up to 20GHz+)
  • Ultra-low loss tangent (0.0020), minimizing signal attenuation
  • Reduced dielectric anisotropy, ensuring consistent signal integrity 

2. Enhanced Thermal & Mechanical Stability

  • Low CTE (16-32 ppm/°C) prevents warping under thermal stress
  • High thermal conductivity (0.81 W/mK) improves heat dissipation
  • Excellent peel strength due to RTF (Reverse-Treated Foil) copper 

3. Aerospace & Military-Grade Reliability

  • Moisture-resistant (0.03% absorption) for harsh environments
  • Compatible with extreme temperatures (-55°C to 288°C)
  • Ideal for phased-array antennas, radar, and satellite communications

4. Cost-Effective Alternative to Foreign PCB Materials

The F4BTMS1000 is a domestically produced high-performance PCB material that can replace imported solutions like Rogers, Taconic, or Arlon in many applications, offering similar performance at a competitive price.

 

Typical Applications

The F4BTMS1000 F4B substratePCB is ideal for:


✔Aerospace & Avionics Systems (on-board radar, satellite comms)

✔Military & Defense Electronics (phased array radar, missile guidance)

✔RF & Microwave Circuits (power amplifiers, filters, couplers)

✔Satellite Communication (SATCOM) Equipment

✔Phase-Sensitive Antennas & Feed Networks

✔High-Frequency Test & Measurement Devices

 

Manufacturing & Quality Assurance

Artwork Format: Gerber RS-274-X

100% Electrical Testing before shipment

Global Availability (fast lead times for prototyping & production)

 

Conclusion

The F4BTMS1000 high DK 10.0 PCB material is a cutting-edge, high-frequency circuit board designed for aerospace, defense, and RF applications. With ceramic-enhanced PTFE material, ultra-low loss characteristics, and exceptional thermal stability, it outperforms conventional PCBs in demanding environments.

 

Whether for radar systems, satellite communications, or phased array antennas, this 2-layer PCB delivers reliability, precision, and high-speed performance.

 

Order today for high-performance PCBs built for mission-critical applications!




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