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The F4BTMS high frequency PCB is a high-performance, ceramic-reinforced PTFE circuit board designed for demanding RF, aerospace, and military applications.
Item NO.:
BIC-326-v405.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
F4BTMS430DK4.3 F4BPCB 2-layer 125mil 3.175mm Thick F4BTMS Series Substrate Circuit Board
Product Overview
The F4BTMS430 PCB is a high-reliability, 2-layer printed circuit board constructed using F4BTMS430 F4B substrate, a ceramic-filled PTFE (Polytetrafluoroethylene) laminate designed for aerospace, RF, microwave, and radar applications. With a thickness of 3.175mm (125 mil), this 125mil F4BTMS PCB offers exceptional thermal stability, low dielectric loss, and superior signal integrity in high-frequency environments.
Engineered to meet IPC-Class-2 standards, this DK4.3 PCB features a black solder mask, white silkscreen, and HASL (Hot Air Solder Leveling) surface finish, ensuring durability and reliable solderability. The low CTE (Coefficient of Thermal Expansion), high thermal conductivity (0.63 W/mK), and ultra-low moisture absorption (0.08%) make it ideal for harsh environments, including space, military radar, and satellite communication systems.
Key Features & Specifications
1. PCB Construction & Material Properties
Item |
Specification |
Base Material |
F4BTMS430 |
Layers |
2 |
Board Size |
89.59×70.83mm (±0.15mm) |
Board Thickness |
3.2mm |
Min Trace/Space |
5/6 mils |
Min Hole Size |
0.4mm |
Via Type |
Through-hole only |
Copper Weight |
1oz (outer layers) |
Via Plating Thickness |
20μm |
Surface Finish |
HASL |
Top Silkscreen |
White |
Bottom Silkscreen |
None |
Top Solder Mask |
Black |
Bottom Solder Mask |
None |
Electrical Test |
100% tested |
2. Advanced F4BTMS430 Material Benefits
The F4BTMS430 is an upgraded version of the F4BTM series PCBs, incorporating nano-ceramic reinforcement and ultra-thin glass fiber cloth for enhanced performance:
- Dielectric constant (Dk) of 4.3 at 10GHz
- Dissipation factor of .0015 at 10GHz, 0.0019 at 20GHz
- CTE x-axis of 13 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 47 ppm/°C, -55°C to 288°C
- Low Thermal coefficient of Dk at-60 ppm/°C, -55°C to 150°C
- High Thermal conductivity of 0.63 W/mk
- Low Moisture absorption of 0.08%
3. PCB Stackup
Layer |
Material |
Thickness |
Top Layer |
Copper (1oz) |
35µm |
Core |
F4BTMS430 |
3.175mm (125 mils) |
Bottom Layer |
Copper (1oz) |
35µm |
4.PCB Statistics
PCB Statistics |
Quantity |
Components |
18 |
Total Pads |
51 |
Thru Hole Pads |
27 |
Top SMT Pads |
24 |
Bottom SMT Pads |
0 |
Vias |
31 |
Nets |
2 |
F4BTMS Introduction
Built upon the successful F4BTM series, the F4BTMS430 high frequency PCB represents a significant technological breakthrough in material formulation and manufacturing processes. The base material, F4BTMS430, is enriched with ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth. This novel composition enhances material performance, expands the range of dielectric constants, and positions the PCB as a superior alternative to similar foreign products.
The unique mixture of ultra-thin glass fiber cloth, polytetrafluoroethylene resin, and special nano-ceramics drastically minimizes the negative effects of glass fiber on electromagnetic wave propagation. This results in reduced dielectric loss, improved dimensional stability, decreased X/Y/Z anisotropy, and enhanced electrical strength and thermal conductivity. Moreover, the F4B PCB supplier’sF4BTMS430 PCB exhibits exceptional low thermal expansion coefficient and stable dielectric temperature characteristics, allowing it to excel in demanding applications.
Why Choose F4BTMS430 PCB?
1. Superior High-Frequency Performance
The low Dk (4.3) and ultra-low Df (0.0015) ensure minimal signal loss in microwave, RF, and millimeter-wave applications, making it ideal for:
2. Exceptional Thermal & Mechanical Stability
3. Aerospace-Grade Reliability
4. Cost-Effective Alternative to Foreign Substrates
The F4BTMS430 PCB serves as a high-performance replacement for Rogers, Taconic, and Arlon PTFE-based PCBs, offering similar electrical properties at a competitive price.
Typical Applications
The 2-layer F4BTMS430 PCB is widely used in:
✅Aerospace & Avionics Equipment
✅Military & Defense Radar Systems
✅Microwave & RF Communication Devices
✅Satellite & Spacecraft Electronics
✅Phased Array & High-Frequency Antennas
✅5G & mmWave Infrastructure
Conclusion
The F4BTMS high frequency PCB is a high-performance, ceramic-reinforced PTFE circuit board designed for demanding RF, aerospace, and military applications. With exceptional thermal stability, low signal loss, and high reliability, it is the ideal choice for engineers requiring superior material performance in extreme environments.
Available worldwide and compliant with IPC-Class-2 standards, this Wangling PCB ensures consistent quality and durability. For custom orders, bulk pricing, or technical support, contact our sales team today!
Ready to Order? Contact us forcustom PCB solutions tailored to your high-frequency needs!
Worldwide shipping available.
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Wangling F4BM220 DK2.2 F4B PCB 2-layer 1.575mm Thick F4BM Series High Frequency SubstrateNext:
F4BTMS1000 PCB 2-layer 20mil 0.508mm Thick DK 10.0 F4BTMS Series High Frequency substratesIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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