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Home High Temperature PCB Gold Finger Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

Gold Finger Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

This is a type of 8-layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of Mobile Broadband.



  • Item NO.:

    BIC-459-v94.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and Immersion gold on pads. 80 strips of gold fingers are on edge for inserting usage.The base material is from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.


1.2 Features and benefits 

    

1. High Tg material shows excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application;

2. Gold fingers reduce contact resistance;

3. 16000㎡workshop;

4. Meeting your PCB needs from prototype to mass production.

5. Strict WIP inspection and monitoring as well as working instruction;

6. IPC Class 2 / IPC Class 3;

7. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;

8. Diversified shipping method: FedEx, DHL, TNT, EMS;

9. No MOQ, low cost for prototypes and small runs quantity.


Gold-plated Edge Connectors


1.3 PCB Specifications


PCB SIZE 150 x 141mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 8 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628(43%) 0.195mm
copper ------- 35um(1oz) MidLayer 1
FR-4 0.2mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628(43%) 0.195mm
copper ------- 35um(1oz) MidLayer 3
FR-4 0.2mm
copper ------- 35um(1oz) MidLayer 4
Prepreg 7628(43%) 0.195mm
copper ------- 35um(1oz) MidLayer 5
FR-4 0.2mm
copper ------- 35um(1oz) MidLayer 6
Prepreg 7628(43%) 0.195mm
copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4mil/4mil
Minimum / Maximum Holes: 0.35/3.5mm
Number of Different Holes: 23
Number of Drill Holes: 183
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
Number of Gold finger 39
BOARD MATERIAL
Glass Epoxy:  FR-4, ITEQ IT-180 TG170℃  er<5.4
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING
Surface Finish Immersion gold on pad, electroplated gold on edge connectors
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, Taiyo IJR-4000 MW300
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH)
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


1.4 Applications


Bluetooth Transmitter

HDMI Splitters

CCTV Systems

Led Street Lights

Low Noise Amplifier

Door Access Control System

5G Mobile Hotspot

Multicoupler

Embedded Systems Development

Smart Phone and Cell Phone          


Gold finger PCB


1.5 Gold finger PCB


The Purpose is to establish electrical connection to the board without using a two-part connector system. Plating of nickel and gold is carried out in essentially the same way as plating copper and tin/lead, i.e., by electrolytic deposition. Plating can be carried out either manually or automatically. In the manual process, boards are more or less stationary in the gold plating bath, which causes a varying gold deposition along the row of contact fingers. The result will frequently be a thickness distribution with the outermost contact fingers having perhaps twice as much deposited gold as the center contact fingers. In the automatic process, gold plating takes place while the boards slide through the plating cell. The method offers a gold thickness variation that can be controlled within±5% or better. This is because all contact fingers will be dealt with in exactly the same way when the board moves through the process cell.


Edge connectors are frequently provided with a slot that serves to guide the board with respect to the receptacle (locating slot) and/or to prevent incorrect insertion of the board (polarization slot). Usually, the PCB manufacturer prefers to route the slot simultaneously with the contouring of the board. Obviously, this requires that the slot be slightly wider than the router bit used.


In order to ease the insertion of the board into the receptacle, the edge along the connector should be bevelled. The bevelling also has the advantage of reducing the scraping of the contacts of the receptacle when the board is inserted in the receptacle.


Bevelling of Connector Edge


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