RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board

RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board

Product Overview

The 4-layer RO3210 PCB is a high-performance 4-layer rigid printed circuit board designed for demanding RF and microwave applications. Manufactured using Rogers RO3210 high-frequency laminate, this Rogers 3210 PCB offers exceptional electrical performance, thermal stability, and mechanical rigidity. With a finished thickness of 1.24mm, thismultilayerboard is optimized for high-frequency signal integrity, making it ideal for automotive radar, wireless communications, and satellite systems.

This Rogers RO3210 PCB features immersion gold surface finish for excellent oxidation resistance and solderability, 1oz copper weight (35μm), and strict IPC-Class-2 quality standards. The board is 100% electrically tested before shipment, ensuring reliability in mission-critical applications.

PCB Construction Details

The following table summarizes the key construction parameters of the RO3210 4-layer PCB:

PCB Stackup: 4-Layer Rigid PCB

The stackup configuration is optimized for signal integrity and thermal management. Below is the detailed layer structure:

PCB Statistics

The RO3210 substrate PCB includes 12 components, 38 pads, and 32 vias, optimized for efficient signal routing.

Additional Specifications

• Artwork Format: Gerber RS-274-X
• Quality Standard: IPC-Class-2
• Availability: Worldwide

Introduction to Rogers RO3210 Material

Rogers RO3210 is a ceramic-filled, woven fiberglass-reinforced laminate designed for high-frequency applications. It combines PTFE-based smoothness for precise etching with the rigidity of woven glass, making it ideal for multi-layer RF structures.

Key Features of RO3210

• Dielectric Constant (Dk): 10.2±0.5
• Dissipation Factor (Df): 0.0027 @ 10GHz
• Thermal Conductivity: 0.81 W/mK
• CTE Matched to Copper: X/Y/Z = 13/13/34 ppm/°C
• Decomposition Temp (Td): 500°C (TGA)
• Flammability Rating: UL 94 V0

Benefits of RO3210 PCB

✅Woven glass reinforcement→Improved rigidity for handling

✅Low CTE (matched to copper)→Reliable SMT assembly

✅Excellent dimensional stability→High production yields

✅Smooth surface finish→Supports fine-line etching

Typical Applications

• -Automotive Radar & Collision Avoidance Systems
• -5G/Wireless Base Stations & Antennas
• -Satellite Communication (DBS, LMDS)
• -Power Backplanes & RF Modules
• -Remote Meter Readers & IoT Devices

Conclusion

The RO3210 4-layer multilayer PCB is a high-performance solution for RF and microwave applications, offering superior signal integrity, thermal stability, and mechanical strength. With strict manufacturing tolerances, immersion gold finish, and 100% electrical testing, this PCB is ideal for mission-critical RF designs.

For global availability and IPC-Class-2 compliance, this RO3210 high frequency PCB ensures reliability in high-frequency environments. Contact us today for customized high-frequency PCB solutions.