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The RO4830 Plus high frequency PCB is a high-performance, cost-effective solution for millimeter-wave RF applications, particularly in automotive radar systems.
Item NO.:
BIC-367-v50.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RT/duroid 5880 RO4450F 3-layer PCB 3.3mm Thick Immersion Gold Finish Multilayer Board
Product Overview
Our newly shipped RT/duroid 5880 3-layer PCB is engineered for high-frequency applications requiring exceptional signal integrity, low loss, and superior dielectric stability. Designed with a 3.3mm thickness, this PCB features a 3-layer construction using RT/duroid 5880 and RO4450F bonding ply, ensuring uniform electrical performance across a wide frequency range. The immersion gold (ENIG) surface finish enhances corrosion resistance and provides a reliable surface for soldering and connectivity.
With a finished thickness of 3.3mm, immersion gold surface finish, and strict IPC-Class-2 compliance, this Rogers duroid 5880 PCB ensures reliability in high-frequency environments. The low dissipation factor (0.0009 at 10 GHz) and tight dielectric constant tolerance (±0.02) make it suitable for Ku-band and beyond.
PCB Construction Details
Below is a summary of the key construction parameters of the Rogers 5880 PCB, followed by a detailed table:
Parameter |
Specification |
Base Material |
RT/duroid 5880 / RO4450F |
Layer Count |
3 layers |
Board Dimensions |
49.1mm x 43.2mm (±0.15mm) |
Minimum Trace/Space |
5/7 mils |
Minimum Hole Size |
0.4mm |
Blind Vias |
No |
Finished Thickness |
3.3mm |
Copper Weight (Finished) |
1oz (35μm) outer & inner layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold (ENIG) |
Top/Bottom Silkscreen |
No |
Top/Bottom Solder Mask |
No |
Electrical Testing |
100% tested prior to shipment |
PCB Stackup: 3-Layer Rigid PCB
The stackup is optimized for high-frequency signal integrity, utilizing duroid 5880 for low loss and RO4450F bonding ply for structural stability.
Layer |
Material |
Thickness |
Copper Layer 1 |
Electro-deposited Cu |
35 μm (1 oz) |
Core |
RT/duroid 5880 |
1.575 mm (62 mil) |
Copper Layer 2 |
Electro-deposited Cu |
35 μm (1 oz) |
Bonding Ply |
RO4450F |
0.102 mm (4 mil) |
Core |
RT/duroid 5880 |
1.575 mm (62 mil) |
Copper Layer 3 |
Electro-deposited Cu |
35 μm (1 oz) |
PCB Statistics
Parameter |
Count |
Components |
8 |
Total Pads |
29 |
Thru-Hole Pads |
17 |
Top SMT Pads |
12 |
Bottom SMT Pads |
0 |
Vias |
8 |
Nets |
4 |
Additional Specifications
RT/duroid 5880 Material Introduction
Rogers RT/duroid 5880 is a PTFE-based laminate reinforced with glass microfibers, offering exceptional dielectric constant uniformity (2.20±0.02) and ultra-low loss (Df = 0.0009 at 10 GHz). Its isotropic properties and resistance to solvents make it ideal for high-frequency stripline and microstrip circuits.
Key Features of RT/duroid 5880
✔Dielectric Constant (Dk): 2.20±0.02 (10 GHz, 23°C)
✔Dissipation Factor (Df): 0.0009 (10 GHz)
✔Temperature Coefficient of Dk (TCDk): -125 ppm/°C
✔Moisture Absorption: 0.02% (extremely low)
✔CTE (Coefficient of Thermal Expansion):
✔Isotropic: Uniform electrical properties in all directions
Benefits of RT/duroid 5880
✅Stable electrical performance across frequency bands
✅Easy to machine, cut, and process
✅Resistant to chemicals used in PCB etching/plating
✅Lowest loss among reinforced PTFE materials
✅Ideal for high-moisture environments
Typical Applications
Conclusion
This 3-layer Rogers substrate 5880 PCB is a high-performance solution for demanding RF and microwave applications. With its ultra-low loss, stable Dk, and robust construction, it is an excellent choice for engineers working on aerospace, defense, and high-speed digital designs.
For inquiries, customization options, or bulk orders, contact our sales team today!
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