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Home High Temperature PCB High Tg PCB Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

High Tg PCB Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

This is a type of low DK/DF FR-4 PCB which is built on TU-872 SLK Sp material.



  • Item NO.:

    BIC-501-v77.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


High Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction


It is made on 4 layers copper with 1oz each layer, coating immersion gold and green solder mask. Final finished thickness is 1.6mm +/- 10%. A panel consists of 16 pieces.


Typical Applications


1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers


4-Layer TU-872 PCB


PCB Specifications


Item  Description  Requirement Actual Result
1. Laminate           Material Type  FR-4 TU-872 SLK Sp FR-4 TU-872 SLK Sp ACC
Tg 170℃ 170℃ ACC
Supplier TU TU ACC
Thickness 1.6±10% mm 1.61-1.62mm ACC
2.Plating thickness       Hole Wall ≥25µm 26.51µm ACC
Outer copper 35µm 40.21µm ACC
Inner Copper 30µm 31.15µm ACC
3.Solder mask                   Material Type Kuangshun Kuangshun ACC
Color  Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 19.55µm ACC
Location Both Sides Both Sides ACC
4. Component Mark    Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S, S/S C/S, S/S ACC
5. Peelable Solder Mask  Material Type
Thickness
Location
6. Identification        UL Mark  YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness
Nickel Thickness 3-6µm 5.27µm ACC
Gold Thickness 0.05µm 0.065µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring  Min. Line Width (mil) 7mil 6.8mil ACC
Min. Spacing (mil) 6mil 6.2mil ACC
10.V-groove  Angle 30±5º 30º ACC
Residual thickness 0.4±0.1mm 0.38mm ACC
11. Beveling  Angle
Height
12. Function                 Electrical Test 100% PASS 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.32% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦1.56µg/c㎡ 0.58µg/c㎡ ACC


High Tg PCB


The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.


For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.


The Tg of general board is above 130 celsius degrees, high Tg is generally greater than 170 celsius degrees, medium Tg is about greater than 150 celsius degrees.

PCB boards with Tg ≥ 170 ° C are usually called high Tg PCBs.


Partial High Tg Material in House


Material

Tg (℃)

Manufacturer

S1000-2M

180

Shengyi

TU-768

170

TU

TU-872 SLK Sp

170

TU

TU-883

170

TU

IT-180ATC

175

ITEQ

KB-6167F

170

KB

M6

185

Panasonic

Kappa 438

280

Rogers

RO4350B

280

Rogers

RO4003C

280

Rogers

RO4730G3

280

Rogers

RO4360G2

280

Rogers



MANUFACTURING PROCESS:


Process PTH PCB


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