High Tg PCB Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

This is a type of low DK/DF FR-4 PCB which is built on TU-872 SLK Sp material.

Item NO.:
BIC-501-v77.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$2.9
Price Range:1 - 50/$99
Product Origin:
China
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

High Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

It is made on 4 layers copper with 1oz each layer, coating immersion gold and green solder mask. Final finished thickness is 1.6mm +/- 10%. A panel consists of 16 pieces.

Typical Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

4-Layer TU-872 PCB

PCB Specifications

Item	Description	Requirement	Actual	Result
1. Laminate	Material Type	FR-4 TU-872 SLK Sp	FR-4 TU-872 SLK Sp	ACC
	Tg	170℃	170℃	ACC
	Supplier	TU	TU	ACC
	Thickness	1.6±10% mm	1.61-1.62mm	ACC
2.Plating thickness	Hole Wall	≥25µm	26.51µm	ACC
	Outer copper	35µm	40.21µm	ACC
	Inner Copper	30µm	31.15µm	ACC
3.Solder mask	Material Type	Kuangshun	Kuangshun	ACC
	Color	Green	Green	ACC
	Rigidity (Pencil Test)	≥4H or above	5H	ACC
	S/M Thickness	≥10 µm	19.55µm	ACC
	Location	Both Sides	Both Sides	ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300	IJR-4000 MW300	ACC
	Color	White	White	ACC
	Location	C/S, S/S	C/S, S/S	ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES	YES	ACC
	Date Code	WWYY	0421	ACC
	Mark Location	Solder Side	Solder Side	ACC
7. Surface Finish	Method	Immersion Gold	Immersion Gold	ACC
	Tin Thickness
	Nickel Thickness	3-6µm	5.27µm	ACC
	Gold Thickness	0.05µm	0.065µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU	OK	ACC
8. Normativeness	REACH	Directive 1907 /2006	OK	ACC
9.Annular Ring	Min. Line Width (mil)	7mil	6.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	6mil	6.2mil	ACC
10.V-groove	Angle	30±5º	30º	ACC
10.V-groove	Residual thickness	0.4±0.1mm	0.38mm	ACC
11. Beveling	Angle
11. Beveling	Height
12. Function	Electrical Test	100% PASS	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	≦0.7%	0.32%	ACC
14. Reliability Test	Tape Test	No Peeling	OK	ACC
	Solvent Test	No Peeling	OK	ACC
	Solderability Test	265 ±5℃	OK	ACC
	Thermal Stress Test	288 ±5℃	OK	ACC
	Ionic Contamination Test	≦1.56µg/c㎡	0.58µg/c㎡	ACC

High Tg PCB

The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.

For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.

The Tg of general board is above 130 celsius degrees, high Tg is generally greater than 170 celsius degrees, medium Tg is about greater than 150 celsius degrees.

PCB boards with Tg ≥ 170 ° C are usually called high Tg PCBs.

Partial High Tg Material in House

Material	Tg (℃)	Manufacturer
S1000-2M	180	Shengyi
TU-768	170	TU
TU-872 SLK Sp	170	TU
TU-883	170	TU
IT-180ATC	175	ITEQ
KB-6167F	170	KB
M6	185	Panasonic
Kappa 438	280	Rogers
RO4350B	280	Rogers
RO4003C	280	Rogers
RO4730G3	280	Rogers
RO4360G2	280	Rogers

MANUFACTURING PROCESS:

Process PTH PCB

BICHENG PCB WORKSHOP:

BICHENG PCB CERTIFICATE:

BICHENG MAIN COURIERS:

Hot Tags :

High Tg Printed Circuit Board High Tg FR-4 Material PCB TU-872 SLK Sp PCB Low DK FR-4 PCB Board High Tg TU-872 SLK Sp PCB High Temperature PCB Immersion Gold

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Subject : High Tg PCB Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

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