RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board

RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board

Product Overview

The RO3006 2-layer 10 mil PCB is a high-performance RF/microwave circuit board designed for applications requiring stable dielectric properties, low signal loss, and excellent thermal stability. Manufactured usingRogers RO3006 ceramic-filled PTFE material, this RO3006 10 mil PCB ensures consistent electrical performance across varying temperatures, making it ideal for automotive radar, satellite communications, and wireless systems.

With a 2-layer rigid construction, this Rogers 3006 PCB features a 0.3mm thickness, 5/5 mil trace/space capability, and immersion gold surface finish for superior conductivity and corrosion resistance. The board is 100% electrically tested, ensuring reliability for high-frequency applications.

PCB Construction Details

The following table summarizes the key structural and material properties of the RO3006 2-layer PCB:

PCB Stackup (2-Layer Rigid PCB)

The stackup consists of two conductive layers with 0.254 mm Rogers RO3006 as the core dielectric, ensuring stable high-frequency performance.

PCB Statistics

The Rogers board supports a compact yet functional RF design with the following component and connectivity details:

Introduction to Rogers RO3006 Material

Rogers RO3006 is a ceramic-filled PTFE (Polytetrafluoroethylene) composite engineered for high-frequency RF/microwave applications. Unlike traditional FR4 materials, RO3006 provides exceptional dielectric constant (Dk) stability over a wide temperature range, eliminating the Dk variations seen in PTFE-glass laminates near room temperature.

Key characteristics of RO3006:

• Dielectric Constant (Dk): 6.15±0.15 @ 10 GHz/23°C
• Dissipation Factor (Df): 0.002 @ 10 GHz/23°C
• Thermal Decomposition (Td): >500°C
• Thermal Conductivity: 0.79 W/mK
• Moisture Absorption: 0.02% (extremely low)
• CTE (Coefficient of Thermal Expansion):
• -X/Y-axis: 17 ppm/°C
• -Z-axis: 24 ppm/°C

These properties make RO3006 ideal for high-frequency circuits where signal integrity and thermal stability are critical.

Benefits of Using RO3006 PCB

✔Stable Electrical Performance–Minimal Dk variation ensures consistent RF signal integrity.

✔Low CTE Matched to Copper–Reduces risk of delamination and improves reliability.

✔Excellent Thermal Management–Suitable for high-power RF applications.

✔Cost-Effective for Volume Production–Rogers RO3006 is optimized for manufacturability.

✔Compatibility with Hybrid Designs–Can be used with epoxy-glass multilayer boards.

Typical Applications

This RO3006 high frequency PCB is widely used in:

• Automotive Radar Systems (77 GHz ADAS)
• Satellite & GPS Antennas
• 5G Power Amplifiers & Base Stations
• Wireless Patch Antennas
• Direct Broadcast Satellite (DBS) Systems
• High-Speed Data Links

Manufacturing & Quality Assurance

• Artwork Format: Gerber RS-274-X
• Compliance Standard: IPC-Class-2
• Global Availability
• 100% Electrical Testing Before Shipment

Conclusion

The RO3006 2-layer 10mil PCB is a high-reliability RF circuit board designed for demanding microwave applications. With its low-loss dielectric properties, fine-line trace capability, and robust construction, it is an excellent choice for automotive, aerospace, and telecommunications industries.

For custom configurations or bulk orders, contact our sales team for competitive pricing and fast lead times.