RO4003C PCB3-layer 1.8mm ThickRogers 4003CENIG Blind Via Multilayer Board
Product Overview
Our newly shipped RO4003C 3-layer PCB is engineered for high-frequency RF and microwave applications, offering superior electrical performance, thermal stability, and reliability. Designed with Rogers’advanced hydrocarbon/ceramic laminate, this Rogers 4003C PCB ensures low signal loss, tight dielectric constant control, and excellent dimensional stability. With a 1.82mm thickness, immersion gold surface finish, and 5/4 mil trace/space capability, thismultilayerboard is ideal for demanding wireless communication, automotive radar, and aerospace applications.
PCB Construction Details
Below is a detailed breakdown of the Rogers RO4003C PCB’s construction, stackup, and statistical data in a structured table format.
|
Parameter
|
Specification
|
|
Base Material
|
RO4003C / RO4450F
|
|
Layer Count
|
3 Layers
|
|
Board Dimensions
|
291mm x 155mm =2 Types=2PCS, ±0.15mm tolerance
|
|
Minimum Trace/Space
|
5/4 mils
|
|
Minimum Hole Size
|
0.3mm
|
|
Blind Vias
|
Top Layer to Inner Layer 1
|
|
Finished Board Thickness
|
1.82mm
|
|
Finished Cu Weight
|
1oz (35μm) Outer Layers / 1oz Inner Layers
|
|
Via Plating Thickness
|
20 μm
|
|
Surface Finish
|
Immersion Gold (ENIG)
|
|
Top Silkscreen
|
White
|
|
Bottom Silkscreen
|
No
|
|
Top Solder Mask
|
Black
|
|
Bottom Solder Mask
|
No
|
|
Electrical Testing
|
100% Tested Prior to Shipment
|
PCB Stackup (3-Layer Rigid Construction)
The stackup is optimized for controlled impedance and thermal stability, utilizing RO4003C Substrate core and RO4450F prepreg for interlayer bonding.
|
Layer
|
Material
|
Thickness
|
|
Copper Layer 1
|
1oz (35μm) Cu
|
35 μm
|
|
Core
|
Rogers RO4003C
|
0.813mm (32mil)
|
|
Copper Layer 2
|
1oz (35μm) Cu
|
35 μm
|
|
Bonding Ply
|
RO4450F Prepreg
|
0.102mm (4mil)
|
|
Core
|
Rogers RO4003C
|
0.813mm (32mil)
|
|
Copper Layer 3
|
1oz (35μm) Cu
|
35 μm
|
PCB Statistics
|
Parameter
|
Value
|
|
Components
|
32
|
|
Total Pads
|
141
|
|
Thru-Hole Pads
|
73
|
|
Top SMT Pads
|
68
|
|
Bottom SMT Pads
|
0
|
|
Vias
|
37
|
|
Nets
|
5
|
Key Features of RO4003C Material
Rogers RO4003C is a high-frequency laminate combining woven glass-reinforced hydrocarbon/ceramic for superior RF performance. Unlike traditional PTFE-based materials, it processes like FR-4 while offering microwave-grade electrical properties.
Technical Advantages:
-
Dielectric Constant (Dk): 3.38±0.05 @ 10GHz
-
Low Loss Tangent (Df): 0.0027 @ 10GHz
-
Thermal Conductivity: 0.71 W/m/°K
-
CTE (X/Y/Z): 11/14/46 ppm/°C (matches copper for reliability)
-
Moisture Absorption: 0.06% (enhances stability in humid environments)
-
High Tg (>280°C): Ensures thermal stability in harsh conditions
Manufacturing & Cost Benefits
✔FR-4-like processing–No special handling or via treatments required
✔Lower fabrication cost vs. PTFE-based RF laminates
✔Compatible with multi-layer designs (mixed dielectric constructions)
✔Excellent plated through-hole reliability due to low Z-axis CTE
Typical Applications
This RO4003C multilayer PCB is optimized for high-frequency and high-speed digital applications, including:
-
5G & Cellular Base Station Antennas
-
Automotive Radar & ADAS Sensors
-
RFID Tags & IoT Wireless Modules
-
Satellite Communication (LNB, DBS)
-
Military & Aerospace RF Systems
Quality Assurance & Global Availability
-
100% Electrical Testing before shipment
-
IPC-Class-2 compliance for high reliability
-
Worldwide shipping with fast lead times
Why Choose This RO4003C PCB?
This 3-layer RO4003C blind via PCB delivers exceptional RF performance, thermal stability, and cost efficiency, making it a top choice for engineers developing wireless and high-speed digital systems. Whether for prototyping or mass production, this Rogers RO4003C High Frequency PCB ensures consistent performance, durability, and manufacturability.
Contact us today for pricing and customization options!
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