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Home High Temperature PCB Kappa 438 High Frequency Printed Circuit Board Rogers 20mil PCB ENIG

Kappa 438 High Frequency Printed Circuit Board Rogers 20mil PCB ENIG

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.

  • Item NO.:

    BIC-162-v41.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Kappa 438 High Frequency Printed Circuit Board Rogers 20mil 0.508mm DK 4.38 PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.


Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.


kappa 438 20mil PCB


Features:


1. Glass reinforced hydrocarbon thermoset platform

2. Dk of 4.38 is tailored to FR-4 industry standard norms

3. Tighter Dk and thickness tolerance than FR-4

4. Low Z Axis CTE of 42 ppm/°C

5. High Tg of > 280°C TMA

6. Meets UL 94-V0 requirements


kappa 438 20mil PCB Board


Benefits:


1. Ease of PCB manufacturing and assembly in Line with FR-4

2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

3. Consistent circuit performance

4. Improved design flexibility and plated through-hole reliability

5. Automated assembly compatible


Typical Applications:


1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

4. Internet of Things (IoT)

Segments: Smart Home and Wireless Meters


DK vs Frrequency 438

DF vs frequency 438


Our PCB Capability (Kappa 438):


PCB Material: Glass Reinforced Hydrocarbon Ceramic
Designation: Kappa 438
Dielectric constant: 4.38
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm),  60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Data Sheet of Kappa 438 Laminate:


Property Typical Value Kappa 438 Direction Units Condition Test Method
Dielectric Constant, er Design 4.38 Z - 2.5 GHz Differential Phase Length Method
Dissipation Factor tan, d 0.005 Z - 10 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e -21 - ppm/°C 10 GHz (-50 to 150°C)
Modified IPC-TM-650 2.5.5.5
Volume Resistivity 2.9 x 109 - MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 6.2 x 107 - MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 675 Z V/mil - IPC-TM-650 2.5.6.2
Tensile Strength 16   12 MD CMD kpsi - ASTM D3039/D3039-14
Flexural Strength 25  19 MD CMD kpsi - IPC-TM-650 2.4.4
Dimensional Stability  -0.48-0.59 MD CMD mm/m - IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion 13 X ppm/°C -55 to 288°C IPC-TM-650 2.4.41
16 Y
42 Z
Thermal Conductivity 0.64 Z W/(m.K) 80°C ASTM D5470
Time to Delamination (T288) >60 - minutes 288°C IPC-TM-650 2.4.24.1
Tg >280 - °C TMA - IPC-TM-650 2.4.24.3
Td 414 - °C - IPC-TM-650 2.3.40
Moisture Absorption 0.07 - % 24/23 IPC-TM-650 2.6.2.1
Young’s Modulus 2264 2098 MD CMD kpsi - ASTM D3039/D3039-14
Flex Modulus 2337 2123 MD CMD kpsi - IPC-TM-650 2.4.4
Bow 0.03 - % - IPC-TM-650 2.4.22C
Twist 0.08 - % - IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress
5.8 - lbs/in 1 oz (35 µm) foil IPC-TM-650 2.4.8
Flammability V-0 - - - UL 94
Specific Gravity 1.99 - g/cm3 - ASTM D792
Lead-Free Process Compatible Yes - - -


PCB MANUFACTURING PROCESS:



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