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Home High Temperature PCB PCB with Ball Grid Array 10-Layer BGA Built On High Tg FR-4 With Immersion Gold

PCB with Ball Grid Array 10-Layer BGA Built On High Tg FR-4 With Immersion Gold

This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. 


  • Item NO.:

    BIC-462-v97.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on the top of the circuit board, high pin-count on a 0.5mm pitch. The base material is from Shengyi and supplying 1 up board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.


1.2 Features and benefits 

    

1. High Tg industrial standard material shows excellent thermal reliability;

2. Immersion gold ensure excellent wetting during component soldering and avoid copper corrosion;

3. In house, engineering design prevents problems from occurring in pre-production;

4. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

5. Customer complaint rate: <1%

6. Delivery on time: >98%

7. Prototype PCB capability to Volume Production capability;

8. Multilayer and Any Layer HDI PCBs;

9. More than 18+ years of PCB experience.

      

PCB with BGA package


1.3 Applications


Converter

USB Wireless Adapter

12V Inverter

Wireless Router Reviews

Ladder Logic

Battery Inverter

CCTV Security

Wireless G Router

Programmable Controllers

Backplanes


1.4 PCB Specifications


Item Description Value
Layer count 10 Layers PCB 10 Layers Board
Board type Multilayer PCB Multilayer PCB Board
Board size 168.38 x 273.34mm=1up 168.38 x 273.34mm=1up
Laminate Laminate Type FR4
Supplier SHENGYI
Tg TG≧170
Finished thickness 2.0+/-10% MM
Plating Thickness PTH Cu thickness >20um
Inner layer Cu Thickness 1/1 OZ
Surface Cu thickness 35 um
Solder  Mask Material type LP-4G G-05
Supplier Nan Ya
Color Green
Single / both sides Both Sides
S/M thickness >=10.0 um
3M tape test NOPeel  Off
Legend Material type S-380W
Supplier Tai yo
Color White
Location Both Sides
3M tape test No peel off
Circuit Trace Width (mm) 0.203+/-20%mm
Spacing (mm) 0.203+/- 20%mm
Identification UL mark 94V-0
Company Logo QM2
Date code 1017
Mark location CS
Immersion Gold Nickel 100u''
Gold ≧2u''
Reliabilty Tests Thermal shock test 288±5℃, 10sec ,3 cycles
solder abllity test 245±5℃
Function Electrioal Test 233+/-5℃
Standard IPC-A 600H class 2, IPC_6012C CLASS 2 100%
Appearance Visual inspection 100%
warp and twist <= 0.75%


1.5 BGA and via plug


The full name of the BGA is Ball Grid Array, which is a type of surface mount package used for integrated circuit (IC). It has the characteristics of: ① packaging area reduced ② function increased and the number of pins increased ③ solder can be self-centered when dissolved soldering, easy to put on tin ④ reliability is high ⑤ electric performance is good and low cost etc. PCB board with BGA generally have more small holes. Mostly, via holes under BGA are designed to be 8~12mil in diameter by customers. Vias under BGA have to be plugged by resin, soldering ink is not allowed to be onto pads and no drilling on BGA pads. The plugged vias are 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm and 0.55mm.


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