PCB
with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
(Printed
circuits boards are custom-made products, the picture and parameters shown are
just for reference)
1.1
General description
It's 2.0 mm thick with white silkscreen on
green solder mask and immersion gold on pads. A BGA package is placed on the
top of the circuit board, high pin-count on a 0.5mm pitch. The base material is
from Shengyi and supplying 1 up board. They're fabricated per IPC 6012 Class 2
using supplied Gerber data. Each 20 boards are packed for shipment.
1.2
Features and benefits
1.
High Tg industrial standard material shows excellent thermal reliability;
2.
Immersion gold ensure excellent wetting during component soldering and avoid
copper corrosion;
3.
In house, engineering design prevents problems from occurring in pre-production;
4.
ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
5. Customer
complaint rate: <1%
6.
Delivery on time: >98%
7.
Prototype PCB capability to Volume Production capability;
8.
Multilayer and Any Layer HDI PCBs;
9.
More than 18+ years of PCB experience.
1.3
Applications
Converter
USB
Wireless Adapter
12V
Inverter
Wireless
Router Reviews
Ladder
Logic
Battery
Inverter
CCTV
Security
Wireless
G Router
Programmable
Controllers
Backplanes
1.4
PCB Specifications
|
Item
|
Description
|
Value
|
|
Layer count
|
10 Layers PCB
|
10 Layers Board
|
|
Board type
|
Multilayer PCB
|
Multilayer PCB
Board
|
|
Board size
|
168.38 x 273.34mm=1up
|
168.38 x 273.34mm=1up
|
|
Laminate
|
Laminate Type
|
FR4
|
|
Supplier
|
SHENGYI
|
|
Tg
|
TG≧170
|
|
Finished thickness
|
2.0+/-10%
MM
|
|
Plating Thickness
|
PTH Cu thickness
|
>20um
|
|
Inner layer Cu Thickness
|
1/1 OZ
|
|
Surface Cu thickness
|
35 um
|
|
Solder
Mask
|
Material type
|
LP-4G G-05
|
|
Supplier
|
Nan Ya
|
|
Color
|
Green
|
|
Single / both sides
|
Both Sides
|
|
S/M thickness
|
>=10.0
um
|
|
3M tape test
|
NOPeel Off
|
|
Legend
|
Material type
|
S-380W
|
|
Supplier
|
Tai yo
|
|
Color
|
White
|
|
Location
|
Both
Sides
|
|
3M tape test
|
No
peel off
|
|
Circuit
|
Trace
Width (mm)
|
0.203+/-20%mm
|
|
Spacing (mm)
|
0.203+/-
20%mm
|
|
Identification
|
UL
mark
|
94V-0
|
|
Company Logo
|
QM2
|
|
Date code
|
1017
|
|
Mark location
|
CS
|
|
Immersion Gold
|
Nickel
|
100u''
|
|
Gold
|
≧2u''
|
|
Reliabilty Tests
|
Thermal shock test
|
288±5℃,
10sec ,3 cycles
|
|
solder abllity test
|
245±5℃
|
|
Function
|
Electrioal Test
|
233+/-5℃
|
|
Standard
|
IPC-A
600H class 2, IPC_6012C CLASS 2
|
100%
|
|
Appearance
|
Visual inspection
|
100%
|
|
warp and twist
|
<= 0.75%
|
1.5
BGA and via plug
The
full name of the BGA is Ball Grid Array, which is a type of surface mount
package used for integrated circuit (IC). It has the characteristics of: ① packaging
area reduced ② function increased and the number of pins increased ③ solder can
be self-centered when dissolved soldering, easy to put on tin ④ reliability is
high ⑤ electric performance is good and low cost etc. PCB board with BGA
generally have more small holes. Mostly, via holes under BGA are designed to be
8~12mil in diameter by customers. Vias under BGA have to be plugged by resin,
soldering ink is not allowed to be onto pads and no drilling on BGA pads. The
plugged vias are 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm and 0.55mm.
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