RO3010 PCB 4-layer 2.6mm Thick Rogers 3010 Immersion Tin Blind Vias

RO3010 PCB 4-layer 2.6mm Thick Rogers 3010Immersion Tin Blind Vias

Introduction

The 4-layer RO3010 PCB is a high-performance, 4-layer rigid printed circuit board designed for demanding RF and microwave applications. Built with Rogers RO3010 advanced ceramic-filled PTFE composite material, this RO3010 High Frequency PCB offers exceptional electrical stability, thermal performance, and mechanical reliability. With a finished thickness of 2.7mm, immersion tin surface finish, and blind vias (L1-L2), this Rogers 3010 board is optimized for high-frequency designs such as automotive radar, satellite communications, and wireless infrastructure.

This product description provides a detailed technical breakdown of the PCB’s construction, stackup, material properties, and key benefits, ensuring engineers and procurement specialists have all the necessary information for integration into their projects.

PCB Construction Details

PCB Stackup: 4-Layer Rigid PCB

The PCB stackup consists of two Rogers RO3010 substrate core layers with prepreg bonding, providing a symmetrical and stable structure for high-frequency signal integrity.

PCB Statistics

This multilayer RO3010 PCB features:

Introduction to RO3010

Rogers RO3010 material is a ceramic-filled PTFE composite engineered for high-frequency applications. Its dielectric constant (Dk) of 10.2±0.30 at 10 GHz ensures stable signal propagation, while its low dissipation factor (0.0022) minimizes signal loss. The material’s thermal stability and low moisture absorption (0.05%) make it ideal for harsh environments.

Key Features of RO3010

• Dielectric Constant (Dk): 10.2±0.30 @ 10 GHz / 23°C
• Dissipation Factor (Df): 0.0022 @ 10 GHz / 23°C
• Thermal Expansion (CTE):
• -X-axis: 13 ppm/°C
• -Y-axis: 11 ppm/°C
• -Z-axis: 16 ppm/°C
• Decomposition Temperature (Td): >500°C
• Thermal Conductivity: 0.95 W/mK
• Moisture Absorption: 0.05%
• Operating Temperature Range: -40°C to +85°C

Advantages of Using RO3010 PCB

✔Dimensional Stability–CTE closely matched to copper, reducing warping risks.

✔High-Frequency Performance–Excellent signal integrity for RF/microwave circuits.

✔Thermal Reliability–Withstands high-power and high-temperature environments.

✔Cost-Effective for Volume Production–Optimized for mass manufacturing.

✔ISO 9001 Certified–Ensures consistent quality and reliability.

Typical Applications

Due to its superior high-frequency characteristics, the RO3010 PCB is widely used in:

• -Automotive Radar Systems (77 GHz ADAS applications)
• -Satellite & GPS Antennas
• -5G & Cellular Base Stations (Power amplifiers, antennas)
• -Wireless Patch Antennas
• -Direct Broadcast Satellite (DBS) Systems
• -High-Speed Data Links
• -Industrial & IoT Remote Sensors

Conclusion

The RO3010 4-layer blind via PCB is a high-performance, high-frequency solution for demanding RF applications. With its 2.7mm thickness, blind vias, and Rogers RO3010 laminate, it ensures low loss, thermal stability, and excellent signal integrity. Whether for automotive radar, 5G infrastructure, or satellite communications, this PCB delivers reliability, precision, and cost-efficiency for advanced electronic designs.

For global availability, IPC-Class-2 compliance, and high-volume production, this custom RO3010 PCB is an ideal choice for engineers seeking a robust high-frequency solution.