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Home HDI PCB Board High Density Interconnect (HDI) PCB Circuit Board 14-Layer FR-4 Tg170℃ With Immersion Gold

High Density Interconnect (HDI) PCB Circuit Board 14-Layer FR-4 Tg170℃ With Immersion Gold

This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. 

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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃With Immersion Gold

1.1 General description

It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

HDI 14-Layer PCB

1.2 Our Advantages 

ISO9001, ISO14001, IATF16949, UL Certified;

Prototype to volume Production Capability;


30000㎡output capability per month;

8000 types of PCB's per month;

IPC Class 2 / IPC Class 3;

Eligible products rate of first production: >95% 

1.3 Applications of HDI PCBs

Automotive, GPS Trackers

5G WiFi, Embedded Systems Basics

Smartphones and tablets

Wearable technology and Healthcare

Access Control Solutions and Aerospace

1.4 Parameter and data sheet

Number of Layers 14-Layer
Board Type Multilayer PCB
Board size 220mm x 170mm=4PCS
Board Thickness 2.0 mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material  170℃
PTH Cu thickness ≥20 um
Inner Iayer Cu thicknes 18 um (0.5oz)
Surface Cu thickness 35 um (1oz)
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAIYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 14 um
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
Mininum Trace (mil) 5.8 mil
Minimum Gap(mil) 6.2 mil
Surface Finish Immersion Gold
RoHS Required Yes
Warpage  0.25%
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2
Drill Table (mm)
T1 0.300
T2 0.450
T3 0.580
T4 0.590
T5 0.690
T6 0.650
T7 1.000
T8 1.150
T9 1.200
T10 1.300
T11 1.400
T12 1.500
T13 1.600
T14 1.700
T15 2.050
T16 2.550
T17 3.000
T18 3.200
T19 3.450

14-Layer Stackup & Vias

1.5 Different Types of HDI PCBs

To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:

1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.

I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.

Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.

8+N+8 HDI microsection




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