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Home Newly Shipped RF PCB RO3003 PCB Rogers 3003 30mil High Frequency Material 2-layer

RO3003 PCB Rogers 3003 30mil High Frequency Material 2-layer


Introducing RO3003 PCB: Delivering High Performance and Reliability













  • Item NO.:

    BIC-235-v258.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



RO3003 PCB Rogers 3003 30mil High Frequency Material 2-layers

 

We are excited to present the newly shipped RO3003 PCB, a cutting-edge solution that combines advanced technology with exceptional performance. Designed to meet the demands of high-frequency applications, the RO3003 PCB offers outstanding electrical properties, dimensional stability, and ease of manufacturing. In this article, we will delve deep into the features, specifications, and applications of this remarkable PCB.

 

PCB Substrates: Unmatched Material Properties

The RO3003 30mil PCB is constructed using Rogers RO3003 ceramic-filled PTFE composites, ensuring superior performance across a wide range of applications. With a dielectric constant of 3.0+/- 0.04 at 10 GHz/23°C and a dissipation factor of 0.001 at 10 GHz/23°C, this PCB enables low dielectric loss, making it suitable for use in applications up to 77 GHz. Additionally, the RO3003 substrate exhibits a Td> 500°C, ensuring excellent thermal stability. Its thermal conductivity of 0.5 W/mK facilitates efficient heat dissipation, further enhancing the reliability of the PCB. With a moisture absorption rate of just 0.04%, the RO3003 PCB offers exceptional resistance to environmental factors. The coefficient of thermal expansion (-55 to 288 °C) ensures dimensional stability, with values of X axis 17 ppm/°C, Y axis 16 ppm/°C, and Z axis 25 ppm/°C.

 

RO3003 30mil PCB


Features & Benefits: Unmatched Performance and Versatility

The Rogers RO3003 PCB offers numerous features and benefits that make it an ideal choice for a wide range of applications:

 

1.Low dielectric loss: The RO3003 PCB's low dielectric loss allows for applications up to 77 GHz, making it perfect for high-frequency designs.

 

2.Uniform mechanical properties:With its diverse range of dielectric constants, this PCB is suitable for multi-layer board designs requiring varying dielectric constants.

 

3.Stable dielectric constant: The RO3003 PCB maintains a stable dielectric constant over temperature and frequency variations, making it ideal for band pass filters, microstrip patch antennas, and voltage-controlled oscillators.

 

4.Low in-plane expansion coefficient: The PCB's low in-plane expansion coefficient, matching that of copper, ensures reliable surface-mounted assemblies, making it suitable for applications sensitive to temperature fluctuations.

 

5.Volume manufacturing process: The RO3003 0.762mm substrate PCB benefits from an economical laminate pricing structure, allowing for cost-effective production.

 

Stackup: Simplified Design and Manufacturing Process

The 2-layer Rogers RO3003 PCB is a rigid board with the following stackup:

 

Copper_layer_1: 35 μm

Rogers RO3003 Substrate: 30mil (0.762mm)

Copper_layer_2: 35 μm

Construction Details: Precision and Reliability

 

RO3003 PCB typical values:

 RO3003 Typical Value

Property

RO3003

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.0±0.04

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.001

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-3

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Dimensional Stability

0.06
0.07

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Volume Resistivity

107

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

107

 

COND A

IPC 2.5.17.1

Tensile Modulus

930
823

X
Y

MPa

23℃

ASTM D 638

Moisture Absorption

0.04

 

%

D48/50

IPC-TM-650 2.6.2.1

Specific Heat

0.9

 

j/g/k

 

Calculated

Thermal Conductivity

0.5

 

W/M/K

50℃

ASTM D 5470

Coefficient of Thermal Expansion
(-55 to 288℃)

17
16
25

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Td

500

 

℃ TGA

 

ASTM D 3850

Density

2.1

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

12.7

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 

 

 

 

The construction details of the RO3003 PCB are as follows:

 

Construction Details

Value

Board dimensions

45mm x 54.3 mm

Minimum Trace/Space

5/6 mils

Minimum Hole Size

0.3mm

Blind vias

No

Finished board thickness

0.88mm

Finished Cu weight

1 oz (1.4 mils)

Via plating thickness

20 μm

Surface finish

Immersion Gold

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Electrical test

100% prior to shipment

 

 

 

To provide you with an overview of the PCB's specifications, here are the statistics for the RO3003 PCB:

 

PCB Statistics

Value

Components

27

Total Pads

61

Thru Hole Pads

35

Top SMT Pads

26

Bottom SMT Pads

0

Vias

41

Nets

3

 

 Rogers 3003 PCB

 

Artwork Format and Standards

The Rogers 3003 PCB is supplied in Gerber RS-274-X format and adheres to the IPC-Class-2 standard, ensuring compatibility and reliability in your designs.

 

Availability: Worldwide

We are pleased to offer the RO3003 PCB worldwide, enabling our customers to access this high-performance solution regardless of their location.

 

Typical Applications: Unleash the Potential

The RO3003 PCB finds its application in various industries and scenarios, enabling high-performance solutions across multiple domains:

 

1.Automotive radar applications: Perfect for automotive radar operating at 77 GHz, supporting advanced driver assistance systems (ADAS) in modern vehicles.

 

2.Global positioning satellite antennas: Ensures reliable signal transmission for GPS antennas, guaranteeing accurate positioning.

 

3.Cellular telecommunications systems: Ideal for power amplifiers and antennas in cellular communication systems, ensuring seamless connectivity.

 

4.Patch antenna for wireless communications: Enables efficient wireless communication in varioussettings, supporting the development of patch antennas for improved signal transmission.

 

5.Direct broadcast satellites: Ensures reliable data transmission in direct broadcast satellite systems, providing a seamless viewing experience.

 

6.Datalink on cable systems: Facilitates efficient data transmission in cable systems, ensuring fast and reliable communication.

 

7.Remote meter readers: Enables accurate and reliable remote meter reading systems, enhancing efficiency and convenience.

 

8.Power backplanes: Supports the development of power backplanes, ensuring efficient power distribution in electronic systems.

 

Technical Support: Contact Us for Expert Assistance

If you have any technical questions or require further information about the RO3003 PCB, our dedicated team is ready to assist you. Please feel free to reach out to us at sales20@bichengpcb.com, and our experienced sales representatives will provide you with the necessary support.

 

In conclusion, the newly shipped RO3003 high frequency PCB offers exceptional performance, reliability, and versatility. With its advanced material properties, stable dielectric constant, and low in-plane expansion coefficient, this PCB is perfect for high-frequency applications requiring precise and reliable signal transmission. Its simplified stackup and construction details further enhance its usability, while its availability worldwide ensures accessibility for customers across the globe. Explore the possibilities with the RO3003 PCB and unlock the potential for innovation in your designs.

 


 







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