High-Tg
PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768
PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Brief
Introduction
Soldering pads are coated with immersion gold and non-pads are
with green solder mask. The panel consists of 16 boards with a size of 320 x
280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.
Main
Applications
Consumer
Electronics
Server,
workstation
Automotive
PCB
Specifications
|
Item
|
Description
|
Requirement
|
Actual
|
Result
|
|
1. Laminate
|
Material Type
|
FR-4 TU-768
|
FR-4 TU-768
|
ACC
|
|
Tg
|
170℃
|
170℃
|
ACC
|
|
Supplier
|
Taiwan Union (TU)
|
Taiwan Union (TU)
|
ACC
|
|
Thickness
|
1.2±10% mm
|
1.18-1.21mm
|
ACC
|
|
2.Plating thickness
|
Hole Wall
|
≥25µm
|
26.15µm
|
ACC
|
|
Outer copper
|
35µm
|
37.85µm
|
ACC
|
|
Inner Copper
|
30µm
|
31.15µm
|
ACC
|
|
3.Solder mask
|
Material Type
|
TAIYO/ PSR-2000GT600D
|
PSR-2000GT600D
|
ACC
|
|
Color
|
Green
|
Green
|
ACC
|
|
Rigidity (Pencil Test)
|
≥4H or above
|
5H
|
ACC
|
|
S/M Thickness
|
≥10µm
|
19.55µm
|
ACC
|
|
Location
|
Both Sides
|
Both Sides
|
ACC
|
|
4. Component
Mark
|
Material Type
|
TAIYO/ IJR-4000 MW300
|
IJR-4000 MW300
|
ACC
|
|
Color
|
White
|
White
|
ACC
|
|
Location
|
C/S, S/S
|
C/S, S/S
|
ACC
|
|
5. Peelable Solder Mask
|
Material Type
|
|
|
|
|
Thickness
|
|
|
|
|
Location
|
|
|
|
|
6. Identification
|
UL Mark
|
YES
|
YES
|
ACC
|
|
Date Code
|
WWYY
|
0421
|
ACC
|
|
Mark Location
|
Solder Side
|
Solder Side
|
ACC
|
|
7. Surface Finish
|
Method
|
Immersion Gold
|
Immersion Gold
|
ACC
|
|
Tin Thickness
|
|
|
|
|
Nickel Thickness
|
3-6µm
|
5.27µm
|
ACC
|
|
Gold Thickness
|
0.05µm
|
0.065µm
|
ACC
|
|
8. Normativeness
|
RoHS
|
Directive 2015/863/EU
|
OK
|
ACC
|
|
REACH
|
Directive 1907 /2006
|
OK
|
ACC
|
|
9.Annular Ring
|
Min. Line Width (mil)
|
6mil
|
5.8mil
|
ACC
|
|
Min. Spacing (mil)
|
5mil
|
5.2mil
|
ACC
|
|
10.V-groove
|
Angle
|
30±5º
|
30º
|
ACC
|
|
Residual thickness
|
0.4±0.1mm
|
0.39mm
|
ACC
|
|
11. Beveling
|
Angle
|
|
|
|
|
Height
|
|
|
|
|
12. Function
|
Electrical Test
|
100% PASS
|
100% PASS
|
ACC
|
|
13. Appearance
|
IPC Class Level
|
IPC-A-600J &6012D
Class 2
|
IPC-A-600J &6012D
Class 2
|
ACC
|
|
Visual Inspection
|
IPC-A-600J &6012D Class 2
|
IPC-A-600J &6012D
Class 2
|
ACC
|
|
Warp and Twist
|
≦0.7%
|
0.32%
|
ACC
|
|
14. Reliability Test
|
Tape Test
|
No Peeling
|
OK
|
ACC
|
|
Solvent Test
|
No Peeling
|
OK
|
ACC
|
|
Solderability Test
|
265 ±5℃
|
OK
|
ACC
|
|
Thermal Stress Test
|
288 ±5℃
|
OK
|
ACC
|
|
Ionic Contamination Test
|
≦1.56µg/c㎡
|
0.58µg/c㎡
|
ACC
|
Our
Advantages
ISO9001,
ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡workshop;
30000㎡output capability per month;
Prototype
to large volume production capability
IPC
Class 2 / IPC Class 3;
Any
layer HDI PCBs;
Delivery
on time: >98%
Customer
complaint rate: <1%
Our
PCB Capability (2022)
|
Parameter
|
Value
|
|
Layer Counts
|
1-32
|
|
Substrate Material
|
RO4350B, RO4003C, RO4730G3, RO4360G2,
RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880;
RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4,
TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10,
TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2
DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15,
DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High
Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
Polyimide, PET; Metal Core etc.
|
|
Maximum Size
|
Flying test: 900*600mm, Fixture
test 460*380mm, No test 1100*600mm
|
|
Board Outline Tolerance
|
±0.0059"
(0.15mm)
|
|
PCB Thickness
|
0.0157"
- 0.3937" (0.40mm--10.00mm)
|
|
Thickness Tolerance(T≥0.8mm)
|
±8%
|
|
Thickness Tolerance(t＜0.8mm)
|
±10%
|
|
Insulation Layer Thickness
|
0.00295"
- 0.1969" (0.075mm--5.00mm)
|
|
Minimum Track
|
0.003"
(0.075mm)
|
|
Minimum Space
|
0.003" (0.075mm)
|
|
Outer Copper Thickness
|
35µm--420µm (1oz-12oz)
|
|
Inner Copper Thickness
|
17µm--350µm (0.5oz - 10oz)
|
|
Drill Hole(Mechanical)
|
0.0059"
- 0.25" (0.15mm--6.35mm)
|
|
Finished Hole(Mechanical)
|
0.0039"-0.248"
(0.10mm--6.30mm)
|
|
DiameterTolerance(Mechanical)
|
0.00295"
(0.075mm)
|
|
Registration (Mechanical)
|
0.00197"
(0.05mm)
|
|
Aspect Ratio
|
12:1
|
|
Solder Mask Type
|
LPI
|
|
Min Soldermask Bridge
|
0.00315"
(0.08mm)
|
|
Min Soldermask Clearance
|
0.00197"
(0.05mm)
|
|
Plug via Diameter
|
0.0098"
- 0.0236" (0.25mm--0.60mm)
|
|
Impedance Control Tolerance
|
±10%
|
|
Surface Finish
|
HASL,HASL
LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
|
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
