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Home HDI PCB Board High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. 



  • Item NO.:

    BIC-503-v79.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction


Soldering pads are coated with immersion gold and non-pads are with green solder mask. The panel consists of 16 boards with a size of 320 x 280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.


Main Applications


Consumer Electronics

Server, workstation

Automotive


TU-768 PCB


PCB Specifications


Item  Description  Requirement Actual Result
1. Laminate           Material Type  FR-4 TU-768 FR-4 TU-768 ACC
Tg 170℃ 170℃ ACC
Supplier Taiwan Union (TU) Taiwan Union (TU) ACC
Thickness 1.2±10% mm 1.18-1.21mm ACC
2.Plating thickness       Hole Wall ≥25µm 26.15µm ACC
Outer copper 35µm 37.85µm ACC
Inner Copper 30µm 31.15µm ACC
3.Solder mask                   Material Type TAIYO/ PSR-2000GT600D PSR-2000GT600D ACC
Color  Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10µm 19.55µm ACC
Location Both Sides Both Sides ACC
4. Component Mark  Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S, S/S C/S, S/S ACC
5. Peelable Solder Mask  Material Type
Thickness
Location
6. Identification        UL Mark  YES YES ACC
Date Code WWYY 0421  ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness
Nickel Thickness 3-6µm 5.27µm ACC
Gold Thickness 0.05µm 0.065µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring  Min. Line Width (mil) 6mil 5.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove  Angle 30±5º 30º ACC
Residual thickness 0.4±0.1mm 0.39mm ACC
11. Beveling  Angle
Height
12. Function                 Electrical Test 100% PASS 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.32% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦1.56µg/c㎡ 0.58µg/c㎡ ACC


Our Advantages


ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡workshop;

30000㎡output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98% 

Customer complaint rate: <1%


Our PCB Capability (2022)


Parameter Value
 Layer Counts  1-32
 Substrate Material  RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger


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