Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home HDI PCB Board Low Loss PCB on TU-883 Substrate and TU-883P Prepreg Multi-layer PCB

Low Loss PCB on TU-883 Substrate and TU-883P Prepreg Multi-layer PCB

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin.


  • Item NO.:

    BIC-508-v84.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Low Loss Printed Circuit Board (PCB) onTU-883 SubstrateandTU-883P Prepreg Multi-layer TU-883 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description


This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.


Applications


Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers


TU-883 Multilayer PCB


Performance and Processing Advantages


Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.005

Stable and flat Dk/Df performance over frequency and temperature

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Excellent through-hole and soldering reliability

Halogen Free


Our PCB Capabilities (TU-883)


PCB Material: High Temperature Resin 
Designation: TU-883
Dielectric constant: 3.60 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.


Typical Properties of TU-883


Typical Values Test Condition SPEC
Thermal
Tg (DMA) 220 °C
Tg (TMA) 170 °C E-2/105+des N/A
Td (TGA) 420 °C
CTE z-axis α1 35 ppm/°C Pre-Tg < 60 ppm/°C
CTE z-axis α2 240 ppm/°C Post-Tg < 300 ppm/°C
CTE z-axis 2.50% 50 to 260°C < 3.0%
Thermal Stress, Solder Float, 288°C > 60 sec A > 10 sec
T-260 > 60 min > 30 min
T-288 > 60 min E-2/105+des > 15 min
T-300 > 60 min
Flammability 94V-0 E-24/125+des 94V-0
Electrical
Permittivity (RC63%)
       1GHz (SPC method) 3.60
       5GHz (SPC method) 3.58 C-24/23/50 N/A
       10GHz (SPC method) 3.57
Loss Tangent (RC63%)
        1GHz (SPC method) 0.0030
        5GHz (SPC method) 0.0037 C-24/23/50 N/A
        10GHz (SPC method) 0.0046
Volume Resistivity > 1010MΩ•cm C-96/35/90 > 106MΩ•cm
Surface Resistivity > 108MΩ C-96/35/90 > 104MΩ
Electric Strength > 40 KV/mm - > 30 KV/mm
Dielectric Breakdown Voltage > 50 KV - > 40 KV
Mechanical
Young’s Modulus
Warp Direction 28 GPa A N/A
Fill Direction 26 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz. Cu foil 4~6 lb/in A > 4 lb/in
Water Absorption 0.08% E-1/105+des+D-24/23 < 0.8 %


BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
Hybrid 4-layer PCB
Hybrid 4-layer PCB 20 mil RO4350B + FR4 Blind Via

Base material: RO4350B 0.508 mm + FR4 0.6mm + PP 0.306mm

HDI RF PCB
Hybrid RF 5-layer Circuit Boards 10mil RO4350B and FR-4

It’s for the application of 2.4 Ghz Antenna. It's 1.0 mm thick with through holes. Green solder mask covers both sides and immersion gold on pads.

High Frequency PCB 10mil
Hybrid High Frequency 6-layer PCB 10mil RO4350B and FR-4 Blind Via

This type is more complex. The 10mil RO4350B core is the same. The main difference is that it contains 3 types blind via.

High Density Interconnect FR-4 PCB
High Density Interconnect (HDI) PCB Circuit Board 14-Layer FR-4 Tg170℃ With Immersion Gold

This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. 

High-Tg TU-768 HDI PCB
High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. 

Taconic TLY-5 PCB
Taconic High Frequency Made on TLY-5 7.5mil 0.191mm DK2.2 PCB

Taconic TLY laminates are a type of low loss laminates. They are manufactured with very light weight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites.

30mil RO4350B PCB
High Frequency PCB On DK2.65 PTFE Double Sided With OSP and Green Mask

Polytetrafluoroethylene (Short for PTFE), commonly known as "plastic king ", is a polymer compound made of tetrafluoroethylene by polymerization. It has excellent chemical stability, corrosion resistance, sealing, high lubrication and non-viscosity, electrical insulation and good aging resistance.

TC350 RF PCB
TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

© Copyright: 2022 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #