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Home HDI PCB Board Low Loss PCB on TU-883 Substrate and TU-883P Prepreg Multi-layer PCB

Low Loss PCB on TU-883 Substrate and TU-883P Prepreg Multi-layer PCB

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin.

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Low Loss Printed Circuit Board (PCB) onTU-883 SubstrateandTU-883P Prepreg Multi-layer TU-883 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.


Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

TU-883 Multilayer PCB

Performance and Processing Advantages

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.005

Stable and flat Dk/Df performance over frequency and temperature

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Excellent through-hole and soldering reliability

Halogen Free

Our PCB Capabilities (TU-883)

PCB Material: High Temperature Resin 
Designation: TU-883
Dielectric constant: 3.60 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Typical Properties of TU-883

Typical Values Test Condition SPEC
Tg (DMA) 220 °C
Tg (TMA) 170 °C E-2/105+des N/A
Td (TGA) 420 °C
CTE z-axis α1 35 ppm/°C Pre-Tg < 60 ppm/°C
CTE z-axis α2 240 ppm/°C Post-Tg < 300 ppm/°C
CTE z-axis 2.50% 50 to 260°C < 3.0%
Thermal Stress, Solder Float, 288°C > 60 sec A > 10 sec
T-260 > 60 min > 30 min
T-288 > 60 min E-2/105+des > 15 min
T-300 > 60 min
Flammability 94V-0 E-24/125+des 94V-0
Permittivity (RC63%)
       1GHz (SPC method) 3.60
       5GHz (SPC method) 3.58 C-24/23/50 N/A
       10GHz (SPC method) 3.57
Loss Tangent (RC63%)
        1GHz (SPC method) 0.0030
        5GHz (SPC method) 0.0037 C-24/23/50 N/A
        10GHz (SPC method) 0.0046
Volume Resistivity > 1010MΩ•cm C-96/35/90 > 106MΩ•cm
Surface Resistivity > 108MΩ C-96/35/90 > 104MΩ
Electric Strength > 40 KV/mm - > 30 KV/mm
Dielectric Breakdown Voltage > 50 KV - > 40 KV
Young’s Modulus
Warp Direction 28 GPa A N/A
Fill Direction 26 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz. Cu foil 4~6 lb/in A > 4 lb/in
Water Absorption 0.08% E-1/105+des+D-24/23 < 0.8 %




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