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It’s for the application of 2.4 Ghz Antenna.
It's 1.0 mm thick with through holes. Green solder mask covers both sides and
immersion gold on pads.
Item NO.:
BIC-080-v34.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysHybrid RF and Microwave 5-layer Circuit Boards Built On 10mil RO4350B and FR-4
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
The type of 5-layer PCB built on mixed RF material RO4350B and epoxy glass FR-4. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
The above drawing is the stack-up. “Layer 2” is etched off and left 5 layers of copper on board.
Features and benefits:
1) Signal integrity performance improved over the stack-ups with all FR4 board;
2) 30000 square meter month capability;
3) 8000 types of PCB per month;
4) Quick CADCAM checking and free PCB quotation;
5) No MOQ, low cost for prototypes and small runs quantity;
6) IPC Class 2 / IPC Class 3 standard.
Applications:
consumer electronics, antenna WiFi, 8 port switch, embedded computer DC transformer, inverter auto,WiFi 4G router and temperature module etc.
Parameter and data sheet:
| PCB SIZE | 159.12 x 39.78mm=1PCS |
| BOARD TYPE | Hybrid Multilayer PCB |
| Number of Layers | 5 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| RO4350B 10 mil (0.254mm) | |
| Prepreg 0.12mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.152mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 0.12mm | |
| copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.152mm | |
| copper ------- 18um(0.5oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.4 mm / 5.0 mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 81 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 Tg130℃, er<5.4; RO4350B Tg280℃, er < 3.8 |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.0 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (14.6% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | CNC Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
PCB MANUFACTURING PROCESS:

BICHENG PCB WORKSHOP:

BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:

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