
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
Our Hybrid PCB, featuring a combination of RO4003C and S1000-2 materials, offers exceptional performance and versatility for various applications.
Item NO.:
BIC-252-v317.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Hybrid PCB with RO4003C and S1000-2 Materials Multilayer 6-layer RF Circuit Board
Introduction
Our Hybrid PCB, featuring a combination of RO4003C and S1000-2 materials, offers exceptional performance and versatility for various applications. This advanced PCB leverages the unique characteristics of each material to achieve a balance between high-frequency performance, cost-effectiveness, and reliability. With a 6-layer rigid PCB construction and precise manufacturing processes, our Hybrid PCB is designed to meet the demands of modern electronic designs.
RO4003C and S1000-2 Materials
RO4003C high frequency material is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that delivers outstanding electrical performance comparable to PTFE-based microwave materials but at a fraction of the cost. It offers a tight control on dielectric constant (Dk) and low loss, making it ideal for RF and microwave applications. Unlike PTFE-based materials,Mutilayer RO4003C PCB does not require special through-hole treatments or handling procedures.
S1000-2, on the other hand, is an epoxy glass (FR-4) laminate developed by Shengyi. It is a lead-free compatible material with high thermal resistance and a Tg (glass transition temperature) of 170°C, ensuring optimal performance even under demanding conditions. S1000-2 exhibits excellent through-hole reliability, anti-conductive anodic filament (CAF) performance, and low water absorption.
Features of RO4003C
RO4003C boasts several key features that make it an exceptional high-frequency laminate:
1)Dielectric Constant (Dk):
RO4003C offers a Dk of 3.38 +/- 0.05, ensuring accurate signal transmission and minimal signal loss.
2)Dissipation Factor:
With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal attenuation, enabling high-speed data transfer and efficient RF performance.
3)Z-Axis Coefficient of Thermal Expansion (CTE):
Z-The low Z-axis CTE of 46 ppm/°C ensures dimensional stability and reliable performance across a wide temperature range.
Features of S1000-2
S1000-2 exhibits the following notable features:
1)Lead-Free Compatible:
The FR-4.0 laminate is environmentally friendly and complies with lead-free requirements, making it suitable for modern electronics manufacturing.
2)High Thermal Resistance and Tg:
With a Tg of 170°C, S1000-2 can withstand elevated temperatures during assembly and operation, ensuring long-term reliability.
3)Low Z-Axis CTE:
The low Z-axis CTE of 45 ppm/°C (before Tg) minimizes the risk of delamination and ensures dimensional stability under varying thermal conditions.
4)Excellent Through-Hole Reliability:
S1000-2 provides robust through-hole reliability, minimizing the risk of open circuits or failure in critical interconnections.
Hybrid PCB Design
Hybrid RO4003C FR-4 PCB combines the strengths of RO4003C and S1000-2 to optimize performance and cost-effectiveness. The 6-layer rigid construction consists of alternating layers of RO4003C and S1000-2 cores, with copper layers for signal transmission and power distribution.
The stack-up of our Hybrid PCB is as follows:
Material |
Thickness (mm) |
Thickness (mil) |
Copper_layer_1 |
0.035 |
1.4 |
RO4003C Core |
0.305 |
12 |
Copper_layer_2 |
0.035 |
1.4 |
Prepreg |
0.195 |
7.6 |
Copper_layer_1 |
0.035 |
1.4 |
S1000-2 Core |
0.25 |
10 |
Copper_layer_2 |
0.035 |
1.4 |
Prepreg |
0.195 |
7.6 |
Copper_layer_1 |
0.035 |
1.4 |
RO4003C Core |
0.305 |
12 |
Copper_layer_2 |
0.035 |
1.4 |
This stack-up ensures optimal signal integrity and allows for the integration of high-frequency components while maintaining cost-effectiveness in non-critical areas.
HybridPCB Construction Details
Hybrid RF circuit board is meticulously crafted with attention to detail and adherence to industry standards. Here are the construction details:
Parameter |
Value |
Board dimensions |
82.5mm x 66mm +/- 0.15mm |
Minimum Trace/Space |
4/6 mils |
Minimum Hole Size |
0.35mm |
Blind vias |
No |
Finished board thickness |
1.1mm |
Finished Cu weight |
1oz (1.4 mils) |
Via plating thickness |
20 μm |
Surface finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Matt Green |
Bottom Solder Mask |
Matt Green |
Electrical test |
100% |
PCB Statistics
The hybrid circuit board boasts the following statistics:
Statistics |
Value |
Components |
57 |
Total Pads |
65 |
Thru Hole Pads |
41 |
Top SMT Pads |
24 |
Bottom SMT Pads |
0 |
Vias |
76 |
Nets |
6 |
Artwork and Quality Standard
The Hybrid PCB is designed and manufactured based on the Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software and manufacturing processes. The PCB adheres to the IPC-Class-2 quality standard, guaranteeing excellent workmanship, reliability, and performance.
Availability
Hybrid PCB is available worldwide, catering to the needs of customers across various industries and geographical locations. We offer efficient order processing, timely delivery, and exceptional customer support to ensure a seamless purchasing experience.
Typical Applications
The Hybrid PCB finds applications in a wide range of industries and electronic devices. Some typical applications include:
1)Point-to-Point Digital Radio Antennas:
The PCB enables high-frequency signal transmission in digital radio antennas, ensuring reliable and efficient communication.
2)Cellular Base Station Antennas and Power Amplifiers:
It supports the development of cellular base station antennas and power amplifiers, delivering enhanced signal strength and coverage.
3)RF Identification Tags:
The Hybrid PCB facilitates the manufacture of RF identification tags for tracking and identification purposes in various industries.
4)Automotive Radar and Sensors:
It enables the integration of radar systems and sensors in automotive applications, enhancing safety and driver assistance features.
5)LNBs for Direct Broadcast Satellites:
The PCB plays a crucial role in the production of low-noise block downconverters (LNBs) used in direct broadcast satellite systems, ensuring high-quality signal reception.
Conclusion
Our Hybrid PCB, featuring a combination of RO4003C and S1000-2 materials, offers exceptional performance, reliability, and cost-effectiveness. With its high-frequency capabilities, precise construction, and compatibility with various applications, this PCB provides a versatile solution for demanding electronic designs. Whether you require reliable RF transmission, efficient power distribution, or robust interconnections, our Hybrid multilayer RO4003C FR-4 PCB is the ideal choice. Experience the benefits of advanced materials and expert craftsmanship with our Hybrid PCB for your next electronic project.
Previous:
Hybrid PCB on RO3003 and High Tg FR-4 Hybrid Circuit Materials 8-Layer Rigid BoardNext:
WL-CT300 PCB 10mil 0.254 mm Wangling 2-layer Rigid High Frequency Circuit Board Immersion SilverIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates
RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board
RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board
RO3010 PCB 4-layer 2.6mm Thick Rogers 3010 Immersion Tin Blind Vias
RO4003C PCB 3-layer 1.8mm Thick Rogers 4003C ENIG Blind Via Multilayer Board
Wangling TP1020 PCB 2-Layer 6.0mm Thick DK10.2 ENIG High Frequency Board
Rogers RT/duroid 5880 RO4450F 3-layer PCB 3.3mm Immersion Gold Finish Multilayer Board
RO4830 Plus PCB 2-layer 5mil 0.127mm Rogers 4830 High Frequency Material ENIG
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported