Hybrid PCB on RO3003 and High Tg FR-4 Hybrid Circuit Materials 8-Layer Rigid Board

Hybrid PCB on RO3003 and High Tg FR-4 Hybrid Circuit Materials 8-Layer Rigid Board

Introduction

The Hybrid PCB on RO3003 and High Tg FR-4 is a cutting-edge printed circuit board that combines the exceptional performance of Rogers RO3003 high-frequency laminates and Shengyi S1000-2M (UL ANSI: FR-4.0) High Tg epoxy glass circuit materials. This hybrid construction offers a unique blend of stability, reliability, and manufacturability, making it ideal for high-frequency applications such as automotive radar, advanced driver assistance systems (ADAS), 5G wireless infrastructure, and more.

RO3003 High-Frequency Laminates:

RO3003 laminates are ceramic-filled polytetrafluoroethylene (PTFE) composites designed specifically for commercial microwave and RF applications. They exhibit excellent stability of dielectric constant (Dk) over various temperatures and frequencies, eliminating the step change in Dk often observed with PTFE glass materials near room temperature. This stability is crucial for maintaining signal integrity and performance in high-frequency circuits. Rogers RO3003 laminates are widely used in automotive radar systems operating at 77 GHz, ADAS, and 5G wireless infrastructure, particularly in mmWave technologies.

High Tg FR-4:

The High Tg FR-4 material used in this hybrid PCB is Shengyi S1000-2M. This high-performance epoxy glass circuit material offers a range of impressive features that enhance its performance and manufacturability.FR4 circuit board exhibits a high glass transition temperature (Tg) of greater than 180°C, ensuring excellent thermal stability and reliability even under high-temperature conditions. The material also demonstrates low coefficient of thermal expansion (CTE) values, which contribute to its dimensional stability and reliability in various environmental conditions.

Key Features of RO3003:

1)Dielectric constant (Dk) of 3.00 +/- 0.04

2)Low dissipation factor of 0.0010 at 10 GHz, ensuring minimal signal loss

3)Low X, Y, and Z axis CTE values of 17, 16, and 25 ppm/°C, respectively, for4)reliable stripline and multilayer board constructions

5)Excellent mechanical properties over a wide temperature range, enabling reliable performance in hybrid designs

Key Features of High Tg FR-4:

1)High Tg of greater than 180°C, ensuring superior thermal stability

2)Low CTE (Z-axis) of 41 ppm/°C before Tg, enhancing dimensional stability and reliability

3)Permittivity (1 GHz) of 4.6, making it suitable for high multilayer PCB designs

4)Excellent mechanical processability, allowing for ease of manufacturing processes such as drilling, routing, and component assembly

Hybrid PCB on RO3003 and High Tg FR-4 Stackup

The hybrid circuit board features an 8-layer rigid PCB design with a carefully selected stackup to optimize performance and reliability:

Hybrid PCB Construction Details

The hybrid circuit materials PCB has the following construction details:

Hybrid PCB Statistics

The Hybrid PCB exhibits the following statistics:

Type of Artwork Supplied

The Hybrid PCB is accompanied by Gerber RS-274-X files, ensuring compatibility and ease of manufacturing.

PCB Quality Standard

The Hybrid PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality and reliable performance.

Availability

The Hybrid PCB is available worldwide, allowing customers from various regions to benefit from its exceptional features and performance.

Some Typical Applications

The Hybrid PCB on RO3003 and High Tg FR-4 finds application in a wide range of industries and technologies, including:

1)Patch antennas for wireless communications, delivering reliable and high-performance signal transmission

2)Automotive radar applications, enabling precise detection and assistance systems

3)Direct broadcast satellites, ensuring efficient and reliable communication in satellite-based broadcasting systems

4)Cellular telecommunications systems, including power amplifiers and antennas, guaranteeing superior connectivity and signal strength

5)Datalink on cable systems, providing robust and efficient data transmission capabilities

Conclusion

In conclusion, the Hybrid PCB on RO3003 and High Tg FR-4 is a state-of-the-art solution for high-frequency applications. With its exceptional stability, reliability, and manufacturability, it caters to the demands of industries such as automotive, telecommunications, and satellite communications. The combination of RO3003 high-frequency laminates and High Tg FR-4 materials ensures optimal signal integrity, thermal stability, and dimensional accuracy. This Hybrid PCB offers a comprehensive solution for high-performance and high-quality electronic designs, meeting the stringent demands of modern technologies.