• May 06, 2022

Have a knowledge of the difference between copper substrate and FR-4 Copper is one of the most expensive metal substrates and conducts heat many times better than aluminum and iron substrates. Aluminum substrate is generally a single layer, is a type of PCB board. Aluminum substrate is considered to be a generic term for PCB boards used specifically in the LED industry because of their good thermal conductivity. It is suitable for high frequency circuit heat dissipation, building decoration industry, high and low temperature change area, precision communication equipment, etc. LED aluminum substrate is divided into front and back. The white side is welded with LED pins and the other side is welded with aluminum. After coated with heat-conducting paste, it is used to contact heat-conducting parts. The high-end practical design is also a double panel which is divided into circuit layer, insulation layer, aluminum, insulation layer and circuit layer structure. Rarely used in multilayer board, ordinary multilayer board can be bonded with insulation layer and aluminum alloy. Aluminum substrate good heat dissipation, good processability, dimensional stability and electrical performance make it widely used in integrated circuits, automobiles, office suite software comparison, high-power electrical equipment, power equipment and other fields. Copper substrate is also divided into single panel, double panel and multi-layer plate according to the different number of layers. Compared with aluminum plate, copper plate due to special material, heat dissipation is relatively good, the price is relatively high. Widely used in high frequency circuit, high and low temperature change, precision communication equipment heat dissipation, building decoration and other industries. There are generally gold-impregnated copper substrate, silver-plated copper substrate, tin-sprayed copper substrate, copper oxide substrate and so on. The circuit layer of copper substrate requires a large current-carrying capacity, so thicker copper foil should be selected, the thickness is generally 35μm~280μm; The thermal conductive insulating layer is the core technology of copper substrate. The core thermal conductive composition is composed of aluminum oxide and silicon powder and epoxy resin filled polymer. It has low thermal resistance (0.15), excellent viscoelasticity, thermal aging resistance, and the ability to withstand mechanical and thermal stress. The metal base of copper substrate is the supporting member of copper substrate, which needs high thermal conductivity. Generally copper plate, suitable for drilling, punching and cutting and other conventional mechanical processing. The metal layer (block) mainly plays the role of heat dissipation, shielding, covering or grounding. Due to the difference of the performance of copper and aluminum and the corresponding PCB processing technology, copper substrate has more performance advantages than aluminum substrate. Hf board is gener...

• April 21, 2022

Why High TG Materials Are Used in PCB Production? In addition to the basic FR-4 material in PCB production, some customers also indicate that high TG material should be used in the materials. Then why do they use high TG material in PCB production? Used in PCB production is the full name of the TG glass transition temperature, on behalf of the glass transition temperature. The circuit board must be flame resistant and cannot burn at a certain temperature, only to soften. This temperature point is called glass state transition temperature (Tg point), this value is related to the size stability of the PCB board. When the temperature rises to a certain area of TgPCB, the substrate will change from "glass state" to "rubber state", which is called the glass transition temperature of the sheet (TG). In other words, Tg is the substrate temperature that remains high (℃). That is to say, ordinary PCB substrate materials at high temperature, not only produce deformation, melting and other phenomena, but also on the mechanical and electrical properties of the sharp decline. Why high TG materials are used in PCB production? The increase of Tg base, the characteristics of heat resistance, moisture resistance, chemical resistance and resistance stability of Shenzhen circuit board proofing will be strengthened and improved. The higher the TG value, the better the temperature and other properties of the plate, especially in the lead-free manufacturing process, high TG is more widely used. High Tg refers to high heat resistance. With the rapid development of the electronic industry, especially the electronic products represented by computers are developing towards high functionalization and high multilayer, which requires the higher heat resistance of PCB substrate materials as an important guarantee. The appearance and development of high density installation technology represented by SMT and CMT make PCB more and more dependent on the support of high heat resistance of substrate in small aperture, fine line and thin form. This is also a big reason to use high TG materials in PCB production. Therefore, in PCB production, the difference between general FR-4 and high Tg FR-4 is that in the hot state, especially after hygroscopic heating, the material has differences in mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion and other conditions, and the high Tg product is obviously better than the common PCB substrate material.

• April 15, 2022

Introduce the Development and Application of Radar for You With the rapid development of science and technology, lidar technology has been constantly developed and upgraded. With the advent of the era of artificial intelligence, radar has been widely used in high-tech fields such as autonomous driving, robotics, security monitoring, unmanned aerial vehicles, mapping, Internet of things, and smart cities. There are various forms of lidar. With the update of device level and manufacturing level, the technical indexes and methods of radar are constantly upgraded. Radar technology can be divided into spaceborne, airborne, vehicle-borne and stationary radar systems according to different carriers. The satellite-borne and airborne lidar systems, combined with satellite positioning, inertial navigation, photography and remote sensing technologies, can acquire a large range of digital surface model data. The vehicle-mounted system can be used to acquire 3d data on roads, Bridges, tunnels and large buildings. Stationary lidar system is often used for accurate scanning and measurement of small area and 3d model data acquisition. First, the development of laser radar sensing technology The research and development of foreign lidar technology started earlier, as early as the 1960s, people began to carry out laser ranging test; In the 1970s, laser altimeter technology was used in the Apollo moon landing program of the United States. In the 1980s, lidar technology developed rapidly, and a reliable lidar measurement sensor was developed to obtain high-resolution geographic information on the surface of the planet. In short, the emergence of lidar technology provides a new technical means for the acquisition of spatial information, which makes the acquisition of spatial information more automatic and more efficient. The development of this technology also brings a revolutionary challenge to the traditional measurement technology. Second, the application of laser radar sensing technology According to the survey, most companies are focusing on unmanned vehicles, robots and laser radar in the field of unmanned vehicles. However, the traditional mechanical lidar has gradually changed to the solid-state lidar. In terms of price, the lidar in the unmanned field is less than tens of thousands of yuan, more than hundreds of thousands of yuan, generally higher than the price of robots and AGV and other fields. In the future, solid state, small, low cost lidar will be the focus of enterprises. With the in-depth study of lidar technology in the international community, the superiority of this new technology is more and more obvious, and has its unique advantages in various industries. The leading technologies in the main application areas are listed below. 1. Autonomous driving Lidar and cameras have been regarded as the core sensors for autonomous driving due to their excellent imaging capabilities. The advantage of lidar compared to a camera is that it can get accurate t...

• April 08, 2022

Let's get to know the High Frequency Boards in 5G Era. We provide high frequency plate of various technologies With the development of electronic technology. The production of electronic products requires more and more materials, such as high-frequency materials. ROGERS PCB, for example, is a type of high-frequency board produced by ROGERS Company. Unlike conventional PCB board epoxies, it has no glass fiber in the middle and is a ceramic based high-frequency material. When the circuit operates at frequencies above 500MHz, the range of materials available to the design engineer is greatly reduced. Rogers RO4350B materials allow RF engineers to easily design circuits, such as network matching, impedance control of transmission lines, etc. Due to its low dielectric loss, R04350B has an advantage over ordinary circuit materials in high frequency applications. Its dielectric constant fluctuation with temperature is almost the lowest among similar materials. In a wide frequency range, its dielectric constant is quite stable 3.48, and the design recommended value 3.66. LoPra copper foil reduces insertion loss. This makes the material suitable for broadband applications. Rogers PCB materials ceramic hf plate series classification: Rogers RO3000 series: PTFE circuit materials based on ceramic filling, Rogers models are: RO3003, RO3006, RO3010, RO3035 high frequency laminate. Rogers RT6000 series: Based on ceramic filled PTFE circuit material, designed for electronic and microwave circuits requiring high dielectric constant, Rogers models are: RT6006 dielectric constant 6.15, RT6010 dielectric constant 10.2. Rogers TMM series: based on ceramic, hydrocarbon, thermosetting polymer composite materials, Rogers models: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i. , etc. At present, the global 5G layout is accelerating. The traditional 3G/4G base station distributed architecture can be mainly divided into BBU, RRU and antenna feed system, among which RRU and antenna feed system are connected through feeders. Due to the increased risk of transmission loss under high frequency, the architecture of integrated RRU and antenna feed system can reduce signal loss on feeders and improve transmission efficiency. Highly integrated, a large number of scattered parts are replaced by PCB boards, which ultimately increases the unit usage of PCB. In the 5G era, high frequency bands must be used (3GPP has specified that 5GNR supports a frequency range of 450MHz to 52.6ghz) for the following reasons: 1) After the iteration of the first 4 generations of communication technology, the resources of low frequency band have been occupied, and the resources that can be used for 5G development are few; 2) The higher the frequency is, the more information can be loaded, the more resources are richer, and thus the transmission rate can be higher (for example, in 100MHz, only 5 channels of 20MHz can be divided, while 1GHz can be divided into 50 channels of 20MHz). Resonance phenomenon caused ...

• April 01, 2022

A Brief Analysis of the Future Trend from the PCB/Copper Clad Market in 2021 2021 will be a roller-coaster year for the PCB and copper clad markets. In 2020, all countries except the Chinese mainland experienced a sharp decline in the economy due to the impact of COVID-19. Governments in order to save the economy, in 2021 took a variety of powerful economic stimulus policies, under the policy to promote national economy all has the different degrees of recovery, notably the world's two largest economies of China and the United States (regardless of cause) the performance of the most bright eye, GDP growth of 8.1% and 5.7% respectively, Europe toward positive growth 5.2%, Japan has also climbed out of the trough and southeast Asian economies have turned positive. The year of 2021 will go down in history Under the influence of such a macro economy, the electronics industry will fully recover in 2021, which also drives the explosive growth of PCB demand. Prismark expects global PCB production to grow 22.6 per cent -- a double-digit increase rarely seen in years -- to more than $80bn. The main PCB producing areas in Asia are not only Mainland China (more than 40 billion US dollars), Taiwan (up 17.5% with an output value of 817.8 billion NT dollars), but even Japan (19.2% with an output value of 14.06 billion US dollars), which has been declining for several years. In such PCB market strong demand, copper-clad board is also hard to find, a time "where are the copper-clad board" in the supply chain boiling. The hard demand of economic recovery and supply chain obstruction, plus inflation, plus the instantaneous shortage of production capacity, plus inventory depletion and other reasons, the supply chain as a whole is difficult to bear, all materials of copper clad plate have risen sharply, the general increase of more than 50%. Some materials, for example, have nearly doubled in value since their lows in 2020. Due to the rapid and dramatic rise in cost and the instantaneous shortage of supply, the price increase of copper-clad plate became the only choice. Back then, people didn't ask what went up, they asked what didn't go up. Therefore, "shortage", "increase" almost noisy for a whole year. For most of the year, there was a rush to buy, stock up and adjust prices, but in the fourth quarter of 2021, the market began to adjust. 2021 is sure to go down in history for the entire PCB/ copper-clad industry, with many experiences that will be talked about for years to come. Although the final full-year operating statistics are not yet available, a 20 per cent increase in mainland China's copper clad industry output is not a problem. Although the overall production expansion incremental effect in 2021 has not been fully shown, but because the operating rate in previous years is about 75%, and it is believed that the vast majority of enterprises have full or close to full production in 2021, therefore, production and sales will have a large increase. With the ...

• March 22, 2022

PCB Technology Is Facing New Challenges in 5G Era, What Should We Do? 5G communication has more and more influence on people's life, and new mobile phones will step into the 5G era bit by bit. Today, let's take a look at what challenges 5G communication brings to PCB industry. Material requirements: A very clear direction of 5G PCB is high frequency and high speed material and plate making. In terms of high frequency materials, it is obvious that leading materials manufacturers in the field of traditional high speed, such as Lianmao and Panasonic, have begun to lay out high frequency plates and launched a series of new materials. This will break the current situation of Rogers alone in the field of high-frequency sheet metal. After healthy competition, the performance, convenience and availability of materials will be greatly enhanced. Therefore, high-frequency materials localization is an inevitable trend. Requirements for quality monitoring: Due to the improvement of 5G signal rate, plate making deviation has a greater impact on signal performance, which requires more stringent production deviation control of plate making. However, the existing mainstream plate making process and equipment are not updated much, which will become a bottleneck for future technological development. How PCB manufacturers break the situation is very important. Requirements for manufacturing process: The enhancement of functions of 5G-related application products will increase the demand for high-density PCB, and HDI will also become an important technology area. Multi-stage HDI products and even arbitrary sequential interconnect products will be promoted, and new technologies such as buried resistance and buried capacity will be applied more and more. The uniformity of copper thickness, precision of line width, alignment between layers, thickness of interlayer medium, control precision of back drilling depth and plasma drilling ability of PCB are all worthy of further study. Requirements for PCB design: panel selection should meet the requirements of high frequency and high speed, impedance matching, cascade planning, wiring spacing/holes should meet the requirements of signal integrity, which can be started from six aspects: loss, embedding, high frequency phase/amplitude, mixed voltage, heat dissipation and PIM. Requirements for equipment and instruments: high-precision equipment and pretreatment line with less coarsening of copper surface are ideal processing equipment at present; And the test equipment has no source intermodulation tester, flying needle impedance tester, loss test equipment. Precision graphic transfer and vacuum etching equipment, real-time monitoring and feedback data changes in line width and coupling spacing detection equipment; Electroplating equipment with good uniformity and high-precision lamination equipment can also meet the production requirements of 5G PCB.