• January 18, 2025

• January 08, 2025

Advanced High-Frequency PCBs: Paving the Way for Future Applications   The high-frequency PCB market in 2025 is a hotbed of activity, with trends and opportunities emerging at a breakneck pace. Recent market research indicates a staggering 30% year-on-year growth, driven by a confluence of factors.   One of the most significant drivers is the automotive industry's shift towards electrification and autonomous driving. High-frequency PCBs are now integral to advanced driver-assistance systems (ADAS), with radar and sensor modules relying on their precision signal handling. A case in point is the new breed of electric vehicles that use high-frequency PCBs to manage battery management systems more efficiently, optimizing charging times and extending range.   In parallel, the consumer electronics sector continues to fuel demand. Smartphones, tablets, and gaming consoles are constantly evolving, demanding higher frequencies and faster data transfer rates. Manufacturers are scrambling to meet this need, and our Bicheng company has positioned itself strategically.   We are proud to announce our newly shipped PCB, the F4BTMS series. It is an upgraded version of the F4BTM series and has achieved remarkable technological breakthroughs. The material is enhanced with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth. This results in outstanding material performance and a broader range of dielectric constants, making it highly reliable and suitable for aerospace applications, capable of replacing similar foreign products.   By cleverly incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, we have minimized the negative effects of glass fiber on electromagnetic wave propagation. This leads to reduced dielectric loss, enhanced dimensional stability, and decreased X/Y/Z anisotropy of the material. It also broadens the usable frequency range, boosts electrical strength, and improves thermal conductivity. Moreover, the material shows excellent low thermal expansion coefficient and stable dielectric temperature characteristics.   The F4BTMS series laminates comes with RTF low roughness copper foil as a standard feature, reducing conductor loss and providing excellent peel strength. It can be used with either copper or aluminum bases. For example, the F4BTMS615 PCB has a dielectric constant (Dk) of 6.15 at 10GHz, a dissipation factor of.0020 at 10GHz and 0.0023 at 20GHz. It features a CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 40 ppm/°C within the temperature range of -55°C to 288°C. It also has a low thermal coefficient of Dk at -96 ppm/°C from -55°C to 150°C, a high thermal conductivity of 0.67 W/mk, and a moisture absorption of 0.1%.   Our new product is a 2-layer rigid PCB with a stackup of Copper_layer_1 - 35μm, F4BTMS615 Core - 5.08...

• December 18, 2024

Servers Drive the PCB Industry Into the Growth Stage "Bicheng's New RO4360G2 PCB 24mil: Meeting the Demands of the Growing PCB Industry in the AI Era" In recent times, with the rapid development of AI applications, the demand for servers has surged, propelling the PCB industry into a new growth cycle. Prismark data indicates that the global PCB output value is expected to grow by 5.5% annually in 2024 and further increase by 6.2% in 2025. Notably, the annual compound growth rate (CAGR) of HDI and IC substrates stands at 7.8% and 7.6% respectively, highlighting the continuous expansion of product demand. Looking ahead to 2025, it is anticipated that Intel and AMD will introduce new-generation platforms - Birch Stream and Turin. These are expected to enter small-scale production in the first half of 2025 and mass production in the second half, leading to an upgrade in CCL grade to M7 and an increase in the number of board layers to over 20. This will bring comprehensive replacement and upgrading to the PCB industry, fulfilling the high-performance requirements of new-generation servers and enhancing the product value and market competitiveness of relevant supply chain manufacturers. Against this backdrop, the continuous expansion of the market share of AI servers provides long-term growth momentum for relevant supply chain manufacturers. Bicheng is proud to introduce its new product, the RO4360G2 PCB 24mil. Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that strike an ideal balance between performance and processing capability. They are the first high dielectric constant (Dk) thermoset laminate that can be processed similarly to FR-4. These materials are lead-free process capable and offer enhanced rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO440 series prepreg and lower-Dk RO4000 laminate in multi-layer designs. The features of RO4360G2 are remarkable. It has a dielectric constant of 6.15 +/- 0.15 at 10 GHz/23°C, a dissipation factor of 0.0038 at 10 GHz/23°C, a Td > 407°C, a high Tg greater than 280°C TMA, a high thermal conductivity of 0.75 W/mK, a low Z-axis coefficient of thermal expansion at 28 ppm/°C, and copper-matched coefficients of thermal expansion (-55 to 288°C) with X axis at 13 ppm/°C and Y axis at 14 ppm/°C. It is also lead free process compatible and has a 94V-0 flammability rating. The benefits of RO4360G2 high frequency PCB are numerous. It offers design flexibility, plated through-hole reliability, compatibility with automated assembly, and is environmentally friendly as it is lead free process compatible. Its efficient supply chain and short lead times make it a cost-effective material option. The PCB stackup of the RO4360G2 24mil Rogers PCB is a 2-layer rigid PCB with a copper layer 1 of 35μm, a Rogers RO4360g2 substrate of 24mil (0.61mm), and a copper la...

• November 23, 2024

Advancements in High-Frequency PCBs Drive Innovation in the Electronics Industry   Introduction: The rapid evolution of technology has led to increased demand for high-frequency printed circuit boards (PCBs) in various applications such as telecommunications, aerospace, defense, and wireless communication systems. High-frequency PCBs play a crucial role in enabling the transmission of high-speed and high-frequency signals with minimal losses. In recent years, significant advancements in high-frequency PCB manufacturing techniques, materials, and design practices have been driving innovation and pushing the boundaries of what is possible in the electronics industry.   Material Innovations: One of the key factors influencing the performance of high-frequency PCBs is the choice of materials. Traditional PCB materials such as FR-4 have limitations when it comes to high-frequency applications due to their relatively high dielectric constant and loss tangent. To overcome these limitations, new materials with improved electrical properties have been developed. For instance, specialized materials like Rogers material, Teflon, and polyimide offer low dielectric loss, low moisture absorption, and excellent dimensional stability, making them ideal choices for high-frequency PCBs.   Design Techniques: Designing a high-frequency PCB requires careful consideration of various factors such as trace widths, spacing, and impedance matching. Advances in design software and simulation tools have made it easier for engineers to optimize their high-frequency PCB designs. With the help of electromagnetic simulation software, designers can predict and mitigate signal integrity issues, reduce electromagnetic interference (EMI), and optimize the performance of their high-frequency circuits. Techniques like controlled impedance routing, differential signaling, and microstrip/stripline configurations are commonly employed to achieve high-frequency performance.   Miniaturization and Integration: The demand for smaller and more compact electronic devices has driven the need for miniaturization and integration of components. High-frequency PCBs have played a significant role in enabling this trend. With advancements in manufacturing processes, it is now possible to print finer lines and spaces, allowing for denser component placement and reduced signal propagation lengths. This, in turn, leads to improved signal integrity, reduced EMI, and increased overall performance of high-frequency circuits.   RF and Microwave Applications: High-frequency PCBs find extensive use in RF and microwave applications, where the ability to transmit and receive signals accurately at high frequencies is critical. These PCBs are used in radar systems, satellite communication, wireless networks, and cellular base stations, among other applications. The advancements in high-frequency PCB technology have enabled the development of advanced RF and microwave systems with enhance...

• September 30, 2024

How Is National Day celebrated in China?   Bicheng Company Celebrates National Day in China with Cutting-Edge Hybrid PCB Innovation   On the occasion of China's National Day, which falls on October 1st each year, Bicheng Company, a pioneer in advanced PCB supplier, is proud to unveil a groundbreaking hybrid PCB featuring a fusion of Rogers RT/duroid 5880 and RO4003C materials. This innovative 4-layer PCBs is designed to cater to high-frequency applications with unparalleled performance characteristics.   National Day Celebrations in China   National Day in China, also known as Chinese National Day, is a day of immense significance, commemorating the founding of the People's Republic of China in 1949. The celebrations are marked by various activities that showcase patriotism, unity, and the rich history of the nation.   The day typically begins with an official flag-raising ceremony at Tiananmen Square in Beijing, attended by prominent government officials and dignitaries. Elaborate military parades exhibiting China's military prowess and technological advancements are a highlight of the celebrations. Spectacular fireworks displays illuminate the skies across major cities, creating a festive atmosphere.   Public events such as cultural performances, art exhibitions, and concerts are organized nationwide to engage citizens in the spirit of celebration. Streets and buildings are adorned with national flags and patriotic decorations, symbolizing unity and pride. Families come together for gatherings, feasting, and quality time, while many people travel domestically during the Golden Week holiday.   Television channels broadcast special programs and documentaries that delve into China's rich culture, history, and achievements, fostering a sense of national identity and pride. Educational institutions conduct activities to educate students about the significance of National Day, instilling a deep appreciation for the country's heritage.   Bicheng's Revolutionary Hybrid PCB: RT/duroid 5880 and RO4003C Bicheng Company's latest innovation combines the exceptional properties of RT/duroid 5880 and RO4003C materials, setting new benchmarks in PCB technology. RT/duroid 5880, a high-frequency laminate by Rogers, boasts a low dielectric constant and minimal dielectric loss, making it ideal for high-frequency and broadband applications. The reinforced PTFE composites with glass microfibers ensure uniform Dk across the board.   On the other hand, Rogers 4003C materials offer a cost-effective solution with tight control over dielectric constant and low loss characteristics. The proprietary woven glass reinforced hydrocarbon/ceramic blend provides performance akin to PTFE/woven glass while simplifying manufacturing processes. Notably, RO4003C materials do not require special treatments, enhancing efficiency and reducing costs.   Key Features and Specifications   RT/duroid 5880: Dielectric constant of 2.2 with t...

• August 22, 2024

The Evolving Landscape of PCB Manufacturing: Trends and Innovations in 2024   The Printed Circuit Board (PCB) industry has been undergoing rapid advancements and transformations in recent years, driven by technological innovations, changing consumer demands, and environmental considerations. As we delve into 2024, several key trends are reshaping the landscape of PCB manufacturing, promising enhanced performance, sustainability, and efficiency across various sectors.   1. Miniaturization and High-Density Interconnects One of the prevailing trends in the PCB industry is the relentless drive towards miniaturization and the development of high-density interconnects. As electronic devices continue to shrink in size while expanding in functionality, there is a growing demand for PCBs that can accommodate more components in a smaller footprint. Manufacturers are leveraging advanced fabrication techniques such as microvia drilling, sequential lamination, and embedded components to achieve higher circuit density without compromising performance.   2. 5G and Internet of Things (IoT) Integration The widespread deployment of 5G networks and the proliferation of IoT devices are catalyzing a surge in demand for PCBs optimized for high-speed data transmission and connectivity. PCB manufacturers are focusing on designing boards with enhanced signal integrity, impedance control, and electromagnetic compatibility to support the seamless integration of 5G and IoT technologies. Advanced materials like Rogers materials and high-frequency laminates are being increasingly utilized to meet the stringent performance requirements of next-generation communication systems.   3. Environmental Sustainability and Green Initiatives In response to growing environmental concerns and regulatory pressures, the PCB industry is embracing sustainability practices and green initiatives. Companies are prioritizing the adoption of eco-friendly materials, such as lead-free solder and recyclable substrates, to reduce their carbon footprint and minimize electronic waste. Additionally, the implementation of energy-efficient manufacturing processes and waste management strategies is becoming integral to promoting a more sustainable PCB ecosystem.   4. Automation and Industry 4.0 Integration Automation and digitalization are revolutionizing PCB manufacturing processes, enabling greater precision, efficiency, and cost-effectiveness. Industry 4.0 technologies, including Artificial Intelligence (AI), Machine Learning, and Internet of Things (IoT), are being leveraged to optimize production workflows, enhance quality control, and enable predictive maintenance in PCB fabrication facilities. Automated optical inspection systems, robotic assembly lines, and smart manufacturing solutions are streamlining operations and driving productivity gains across the industry.   5. Flexible and Rigid-Flex PCBs The demand for flexible and rigid-flex PCBs is on the ris...