6-layer Hybrid PCB 0.305mm RO4003C + 3.0mm FR-4 Depth-Controlled Slot Multilayer Board

6-layer Hybrid PCB 0.305mm RO4003C + 3.0mm FR-4 MixedDielectricMultilayerBoardDepth-Controlled Slot 

Product Overview

Our newly shipped 6-layer hybrid PCB combines Rogers RO4003C and Tg170 FR-4 materials to deliver superior RF/microwave performance while maintaining structural rigidity. Designed for high-frequency, high-power applications, this hybrid PCB features a depth-controlled slot for precision mechanical integration, making it ideal for base stations, automotive radar, and satellite communications.

With a 6.8mm finished thickness, immersion gold surface finish, and strict IPC-Class-2 compliance, thisMixed Dielectric Multilayer PCB ensures reliable signal integrity, thermal stability, and manufacturability at a competitive cost.

PCB Construction Details

Below is a consolidated summary of the PCB’s structural and material properties:

PCB Stackup (6-Layer Hybrid Construction)

The stackup is engineered for optimal RF performance and mechanical stability:

PCB Statistics

The hybrid circuit board supports complex circuitry with the following component and connectivity metrics:

Key Features & Benefits

1. Rogers RO4003C Material Advantages

Low Loss & High-Frequency Performance:

• -Dielectric Constant (Dk): 3.38±0.05 @ 10GHz
• -Dissipation Factor (Df): 0.0027 @ 10GHz (0.0021 @ 2.5GHz)
• -Thermal Conductivity: 0.71 W/m/°K

Excellent Thermal Stability:

• Tg >280°C (prevents deformation under high heat)
• CTE Matched to Copper: X/Y: 11/14 ppm/°C, Z: 46 ppm/°C (reduces via stress)
• Moisture Resistance: Only 0.06% absorption, ideal for harsh environments.

2. Hybrid Construction Benefits

• FR-4 Core for Rigidity: 3.0mm thick FR-4 provides mechanical strength.
• RO4003C for RF Performance: 0.305mmRogers layer ensures minimal signal loss.
• Cost-Effective Processing: No special handling required (unlike PTFE-based materials).
• Designed for performance sensitive, high volume applications

3. Depth-Controlled Slots

• Precision-machined slots on top & bottom layers for mechanical integration.
• Ensures compatibility with connectors, heat sinks, and shielding.

Typical Applications

This Hybrid PCB Board is optimized for high-frequency, high-reliability applications, including:

✔Cellular Base Stations (Antennas & Power Amplifiers)

✔Automotive Radar & Sensors (77GHz mmWave, ADAS)

✔RFID Tags & IoT Devices

✔Satellite LNB (Low-Noise Block) Systems

✔Military & Aerospace RF Modules

Why Choose This PCB?

✅Superior RF Performance–RO4003C high frequency PCB ensures low signal loss and stable Dk for high-frequency designs.

✅Robust Mechanical Design–FR-4 reinforcement prevents warping and enhances durability.

✅Cost-Effective Hybrid Solution–Combines high-frequency laminates with standard FR-4 processing.

✅Strict Quality Compliance–Manufactured to IPC-Class-2 standards with 100% electrical testing.

Ordering & Availability

• Artwork Format: Gerber RS-274-X
• Quality Standard: IPC-Class-2
• Global Shipping: Available worldwide

Conclusion

This 6-layer hybrid PCB combines Rogers 4003C’s RF performance with FR-4’s structural integrity, making it ideal for high-frequency, high-power applications. With depth-controlled slots, immersion gold finish, and strict IPC-Class-2 compliance, it ensures reliability in demanding environments.

Available worldwide–Contact us today for customization and volume pricing!