F4BTME320 PCB 2-layer 1.524mm 60mil Thick Wangling F4BTME Series Immersion Tin

F4BTME320 PCB 2-layer1.524mm60mil Thick Wangling F4BTME SeriesImmersion Tin

Product Overview

The F4BTME320 PCB is a high-performance, double-layer printed circuit board designed for demanding RF, microwave, and aerospace applications. Built with DK3.2 F4B PCB, this Wangling F4BTME PCB offers exceptional electrical stability, low signal loss, and superior thermal performance. With a 60mil (1.524mm) core thickness, 1oz copper weight, and immersion tin surface finish, it ensures reliable signal integrity in high-frequency environments.

This F4B High Frequency PCB is IPC-Class-2 compliant, undergoes 100% electrical testing, and is supplied in Gerber RS-274-X format, making it ideal for precision applications such as radar systems, satellite communications, and phased array antennas.

PCB Construction Details

Below is a detailed breakdown of the PCB’s construction, stackup, and statistical data in tabular format for clarity.

PCB Stackup (2-Layer Configuration)

The stackup consists of a 60mil F4BTME320 core with 35μm copper layers on both sides.

PCB Statistics

The board includes 31 components, 105 total pads, and 28 vias, with no bottom-side SMT components.

F4BTME Introduction

The Wangling F4BTME Series PCB laminates boast a meticulous manufacturing process, harnessing the synergistic potential of glass fiber cloth, nano-ceramic fillers, and PTFE resin. By leveraging the F4BM dielectric layer, these substrates achieve an optimal blend of high dielectric constant, low loss nano-ceramics, superior heat resistance, reduced thermal expansion coefficient, enhanced insulation resistance, and improved thermal conductivity, while retaining low loss characteristics.

Moreover, the F4BTME substrates synergize seamlessly with reverse-treated RTF copper foil, ensuring outstanding performance metrics in terms of PIM, precise line control, and minimized conductor loss.

F4BTME320 Laminate–Key Features & Benefits

The F4BTME320 material is a PTFE-based, ceramic-filled laminate engineered for high-frequency, low-loss applications. Its unique formulation ensures:

• Ultra-Low Dielectric Loss–Dissipation factor of 0.002 @ 10GHz, minimizing signal degradation.
• Stable Dk (3.2±0.06 @ 10GHz)–Ensures consistent impedance control.
• Excellent Thermal Stability–CTE of 13-15 ppm/°C (x/y-axis), preventing warping under thermal stress.
• Low PIM (<-160 dBc)–Critical for RF and antenna applications.
• Moisture Resistance (0.05% absorption)–Enhances reliability in harsh environments.
• Optimized for High-Frequency RF:
• Low conductor loss
• Superior PIM performance
• Excellent dimensional stability

Typical Applications

The F4BTME320 high frequency PCB is ideal for high-frequency, high-reliability applications, including:

✔Aerospace & Avionics (radar, cabin electronics)

✔Military & Defense Radar Systems

✔Microwave & RF Circuits

✔Satellite Communication (SATCOM) Antennas

✔Phased Array & Beamforming Antennas

✔5G & mmWave Infrastructure

Quality & Compliance

• IPC-Class-2 Standard–Ensures high reliability for commercial and industrial use.
• 100% Electrical Tested–Guarantees functionality before shipment.
• Gerber RS-274-X Files–Industry-standard for fabrication.

Conclusion

The F4BTME320 2-layer PCB is a high-performance solution for RF, aerospace, and telecom applications. With its ultra-low loss, stable Dk, and superior thermal properties, it ensures long-term reliability in demanding environments. Whether for radar systems, satellite communications, or phased array antennas, this Wangling PCB delivers exceptional signal integrity and durability.

For custom configurations or bulk orders, contact our sales team for tailored solutions!