Rigid Polyimide 4-Layer PCB 1.8mm Thick HASL Lead-Free Vias Resin-filled and Capped

Rigid Polyimide 4-Layer PCB 1.8mm Thick HASL Lead-Free Vias Resin-filled and Capped

Product Overview

The Rigid Polyimide 4-Layer PCB is engineered for high-performance applications requiring exceptional thermal stability, mechanical strength, and electrical reliability. With a 1.8mm thickness, HASL lead-free surface finish, and black solder mask, this Rigid Polyimide PCB is designed for demanding environments such as aerospace, military, and high-temperature industrial applications.

Featuring 5/5 mil trace/space, 0.3mm minimum hole size, and resin-filled vias, this 4-Layer board ensures high-density interconnects with superior durability. The polyimide material provides outstanding thermal resistance (Tg 257°C), excellent dielectric properties, and moisture resistance, making it ideal for mission-critical electronics.

PCB Construction Details

Below is a detailed breakdown of the PCB’s construction, including material specifications, dimensions, and manufacturing tolerances.

PCB Stackup (4-Layer Rigid Polyimide)

The stackup is optimized for signal integrity and thermal performance, with polyimide cores and prepreg ensuring stability under high temperatures.

PCB Statistics

The multilayer board supports 68 components with a mix of through-hole and SMT pads, ensuring flexibility in assembly.

Additional Specifications

• Artwork Format: Gerber RS-274-X
• Quality Standard: IPC-Class-2
• Availability: Worldwide

Introduction to Rigid Polyimide Material

Polyimide is a high-performance polymer known for its exceptional thermal stability, mechanical strength, and electrical insulation properties. Key advantages include:

Thermal Resistance:

• Tg (Glass Transition Temp): 257°C
• Passes 288°C thermal stress test (no delamination)

Mechanical Strength:

• Peel strength: 1.42 N/mm (after thermal stress)
• Bending strength: 410.2 N/mm²(machine direction)

Electrical Properties:

• Volume resistivity: 6.6×10⁶MΩ·cm (C-96/35/90 conditions)
• Surface resistivity: 3.4×10⁶MΩ
• Dielectric constant: 4.12 @ 1MHz
• Dissipation factor: 0.0072 @ 1MHz

Moisture Resistance:

• 0.11% absorption rate
• High dielectric strength (44.3 kV breakdown voltage)

These properties make polyimide ideal for aerospace, military, and downhole oil extraction electronics, where reliability under extreme conditions is critical.

Key Properties of Rigid Polyimide PCB

✔Excellent high-frequency performance

✔Outstanding thermal resistance (up to 257°C Tg)

✔High mechanical strength & durability

✔Superior electrical insulation

✔Low moisture absorption (0.11%)

✔Radiation-resistant for aerospace applications

Applications

This Rigid Polyimide PCB is designed for high-reliability applications, including:

• -Aerospace & Avionics (flight control systems, satellite electronics)
• -Military & Defense (radar, communication systems)
• -Oil & Gas Downhole Electronics (high-temperature drilling equipment)
• -High-Frequency Circuits (RF/microwave applications)
• -Medical & Industrial Electronics (harsh environment sensors)

Conclusion

Our Rigid Polyimide 4-Layer PCB delivers unmatched thermal stability, electrical performance, and mechanical strength, making it the ideal choice for high-reliability applications. With HASL lead-free finish, resin-filled vias, and IPC-Class-2 compliance, this PCB ensures long-term durability in extreme conditions.

For custom requirements or bulk orders, contact our sales team for further assistance. Worldwide shipping available.