• April 16, 2024

  Global PCB Industry Shows Resilience Amidst Challenging Times   Despite the challenges faced by the global PCB industry, the Prismark report reveals promising trends and growth prospects. In 2023, the industry experienced a 15.0% year-on-year decrease in output value in U.S. dollars. However, experts project a steady growth trajectory in the medium to long term. The compound annual growth rate for global PCB output value from 2023 to 2028 is expected to reach 5.4%.   Regional Growth and Product Structure: The PCB industry's growth is not limited to a specific region but spans all corners of the globe. Mainland China has emerged as a significant player, with a compound growth rate of 4.1%. Looking at the product structure, packaging substrates, high-multilayer boards with 18 layers and above, and HDI boards are set to experience substantial growth in the next five years. These segments are projected to achieve compound growth rates of 8.8%, 7.8%, and 6.2%, respectively.   Driving Factors for Packaging Substrate Products: Packaging substrate products are witnessing increased demand due to two primary factors. Firstly, the technological advancements and expanding application scenarios, such as artificial intelligence, cloud computing, smart driving, and the Internet of Everything, are driving the electronics industry's need for high-end chips and advanced packaging. This sustained growth is particularly notable in high-computing power and integration scenarios. Secondly, the government's increased support for the semiconductor industry, coupled with additional investments, is accelerating the development of the domestic packaging substrate industry. As terminal manufacturers' semiconductor inventories normalize, the global semiconductor market is predicted to grow by 13.1% in 2024, according to the World Semiconductor Trade Statistics Organization (WSTS).   Growth Drivers for PCB Products:  PCB products are propelled by the demand from various markets, including servers and data storage, communications, new energy and smart driving, and consumer electronics. The rapid evolution of artificial intelligence and the increasing need for high computing power and high-speed networks in the ICT industry are fueling the demand for large-size, high-level, high-frequency, high-speed, high-end HDI, and high-heat dissipation PCB products. The application of AI in mobile phones, PCs, smart wearables, IoT, and other products is driving the explosive growth of edge computing capabilities and high-speed data exchange. Consequently, terminal electronic equipment requires high-frequency, high-speed, integrated, miniaturized, light and thin, and high heat dissipation PCB products.   Introducing the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm: To meet the growing demand for high-frequency applications,Bichengpresents the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm. This innovative product combines Tg170 FR-4 and 20mil RO4003C m...

• March 20, 2024

Analysis of the High-Speed PCB Industry Introduction: The high-speed PCB industry plays a pivotal role in meeting the increasing demand for electronic devices capable of handling high-frequency signals and data transmission. This analysis provides an in-depth exploration of the high-speed PCB industry, including its market dynamics, technological advancements, challenges, and future prospects. Market Dynamics 1)Growing Demand The demand for high-speed PCBs is driven by various factors, including the rapid growth of technologies such as 5G wireless communication, Internet of Things (IoT), cloud computing, artificial intelligence (AI), and autonomous vehicles. These applications require high-performance electronic devices that can reliably transmit and process data at high speeds. 2)Communication Infrastructure The deployment of 5G networks is a significant driver for the high-speed PCB industry. The implementation of 5G requires advanced communication infrastructure, including base stations, antennas, and network equipment, which heavily rely on high-speed PCBs. The demand for faster data rates, reduced latency, and increased bandwidth necessitates the use of high-speed PCBs to ensure reliable signal integrity. 3)Automotive Electronics The automotive industry is another key driver of the high-speed PCB market. The integration of electronic systems for advanced driver assistance systems (ADAS), infotainment systems, radar systems, and electric vehicle powertrains requires high-speed PCBs to handle the increased data processing and communication requirements. The shift towards electric vehicles and autonomous driving technologies further fuels the demand for high-speed PCBs in this sector. 4)Miniaturization and High-Density Interconnects The continuous drive for smaller and lighter electronic devices with increased functionality has led to the miniaturization of components and the need for high-density interconnects. High-speed PCBs with smaller form factors, high-density routing, and advanced technologies like microvias and high-density interconnect (HDI) are essential to accommodate the miniaturization trend while maintaining signal integrity and performance. Technological Advancements 1)Advanced Materials High-speed PCBs require materials with excellent electrical properties, such as low dielectric constant and low loss tangent, to minimize signal loss and maintain signal integrity. Materials like FR-4, PTFE (Polytetrafluoroethylene), and specialty laminates are commonly used. The development of new materials with improved electrical characteristics is an ongoing focus in the industry. 2)Controlled Impedance and Signal Integrity Maintaining controlled impedance is critical in high-speed PCB design to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Designers employ techniques like controlled trace widths, controlled dielectric thickness, differential signaling, and optimized ground planes to ensure signal integrity ...

• March 20, 2024

Advancements in PCB Manufacturing Propel Industry into New Frontiers The PCB industry is undergoing a transformative phase, driven by groundbreaking advancements and cutting-edge technologies that are propelling the industry into new frontiers. Miniaturization and High-Density Interconnects: The demand for smaller, lighter, and more powerful electronic devices continues to rise. To meet these evolving needs, PCB manufacturers are pushing the boundaries of miniaturization and high-density interconnects. Advanced fabrication techniques such as microvias, blind vias, and buried vias, along with finer trace and space requirements, enable the creation of compact PCB designs with enhanced functionality, enabling the next generation of consumer electronics, wearable devices, and IoT applications. Flexible and Rigid-Flex PCBs: Flexible and rigid-flex PCBs are witnessing a surge in popularity due to their ability to conform to complex shapes and provide greater design flexibility. With the advent of flexible substrates and advanced assembly techniques, PCB manufacturers are delivering innovative solutions for applications in industries such as automotive, aerospace, medical, and consumer electronics. The integration of flexible and rigid sections eliminates the need for connectors, reducing assembly time, improving reliability, and enabling new product form factors. High-Speed and High-Frequency PCBs: The relentless pursuit of faster data transfer rates and increased signal integrity has spurred advancements in high-speed PCB and high-frequency PCB technologies. Designers and engineers are leveraging specialized materials, controlled impedance routing, and advanced signal integrity analysis to achieve optimal performance in applications such as telecommunications, data centers, automotive radar systems, and 5G infrastructure. These advancements enable the efficient transmission of high-speed digital signals and the handling of ever-increasing frequencies. Advanced Materials and Substrates: The availability of advanced materials and substrates is revolutionizing the PCB industry. Next-generation materials, such as high-frequency laminates, high-speed digital materials, and thermally conductive substrates, offer improved electrical performance, signal integrity, thermal management, and reliability. These materials enable the design and manufacture of PCBs that can withstand demanding operating conditions, including high temperatures, high-frequency signals, and power dissipation requirements. We are thrilled to announce the global availability of 31mil TLX-8 PCB, a PTFE fiberglass laminate renowned for its unrivaled reliability and versatility. Taconic TLX-8 PCB as a game-changer in the PCB industry, offering engineers and designers an exceptional high-volume antenna material to power their RF applications. With a wide range of available thicknesses and copper cladding options, TLX-8 high frequency PCB proves itself indispensable in low layer count microwav...

• February 02, 2024

• January 16, 2024

Enhancing Industry Independence with Cutting-Edge PCB Technology   Focusing on high-end and automation PCBs (printed circuit boards) are to the electronics industry what steel is to real estate and asphalt is to roads and bridges. At the beginning of the 21st century, the dawn of China's electronics industry sounded in Shenzhen. Japanese, Korean, and Taiwanese companies expanded their territories in South China, pressing the accelerator for China's electronic manufacturing industry. At that time, the most fundamental part of the industry chain and the demand for massive PCBs made it the first entry point for Chinese electronic industry practitioners to start their own businesses.   Focusing on high-end PCBs and serving display panel companies became the path to success for Li Xiaohua in their uninterrupted 20-year entrepreneurial journey.   Targeting the high-end market "Printed circuit boards are the most fundamental components of the electronic manufacturing industry, known as the 'mother of electronic products.' Mobile phones, tablets, and other electronic consumer goods, as well as various other industries such as artificial satellites, spacecraft, airplanes, ships, and even the current new energy vehicles, cannot do without the application of electronic products. Circuit boards are the carriers for all electronic product applications. Therefore, when we chose to enter this industry, we believed that it had broad future applications and significant development potential," explained Li Xiaohua, Chairman.   At the beginning of the 21st century, lightweight electronic products such as smart wearable devices began to gain popularity, and the demand for PCBs shifted towards lighter and more flexible directions. At that time, multi-touch screens represented by the Nintendo NDS game console became a global sensation. In 2004, Apple internally initiated the "Purple2" project, shifting the company's focus from iPods and iPads to large-screen touch smartphones. The "Purple2" project eventually led to the creation of the iPhone series.   Manufacturing smartphones is like "building a dojo inside a snail's shell," and circuit boards, as basic electronic components, also started to require lightweight, flexible designs while overcoming various extreme conditions. Li Xiaohua noticed this trend and ultimately decided to focus on Flexible Printed Circuit (FPC) as PCB supplier' entrepreneurial direction. "Flexible circuit boards are used in scenarios like phone screens, laptop screens, and tablet screens. So, at that time, we conducted a detailed market analysis and ultimately determined to serve the entire display panel industry," said Li Xiaohua.   Entering the Chip-on-Film (COF) industry marked the beginning ofPCB supplier' foray into the high-end market. "Starting in 2016, FPC began to develop towards lighter, thinner, and finer lines. The flexible narrow board for driving display panels became representative of these fine lin...

• December 27, 2023