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Rogers RT/duroid 5880 high frequency material is
glass microfiber reinforced PTFE composites which is designed for exacting
stripline and microstrip circuit applications.
Item NO.:
BIC-019-v104.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
RT/Duroid 5880 10mil 0.254mm Rogers High Frequency PCB for Microstrip and Stripline Circuits
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5880 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 to Ku-band and above. RT/duroid 5880 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.
The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems and point to point digital radio antennas etc.
PCB Specifications
PCB SIZE | 130 x 100mm=1PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
RT/duroid 5880 0.254mm | |
copper ------- 18um(0.5oz) + plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 5 mil / 4 mil |
Minimum / Maximum Holes: | 0.2 mm / 0.2mm |
Number of Different Holes: | 1 |
Number of Drill Holes: | 15 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RT/duroid 5880 0.254mm |
Final foil external: | 1.0 oz |
Final foil internal: | N/A |
Final height of PCB: | 0.3 mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion gold |
Solder Mask Apply To: | N/A |
Solder Mask Color: | N/A |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.22mm. Via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Data sheet of Rogers RT/duroid 5880
RT/duroid 5880 Typical Value | ||||||
Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess |
2.20 2.20±0.02 spec. |
Z | N/A |
C24/23/50 C24/23/50 |
1 MHz
IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ |
0.0004 0.0009 |
Z | N/A |
C24/23/50 C24/23/50 |
1
MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
Specific Heat | 0.96(0.23) | N/A |
j/g/k (cal/g/c) |
N/A | Calculated | |
Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
1070(156) | 450(65) | X | ||||
860(125) | 380(55) | Y | ||||
Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
27(3.9) | 18(2.6) | Y | ||||
Ultimate Strain | 6 | 7.2 | X | % | ||
4.9 | 5.8 | Y | ||||
Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
710(103) | 500(73) | Y | ||||
940(136) | 670(97) | Z | ||||
Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
29(5.3) | 21(3.1) | Y | ||||
52(7.5) | 43(6.3) | Z | ||||
Ultimate Strain | 8.5 | 8.4 | X | % | ||
7.7 | 7.8 | Y | ||||
12.5 | 17.6 | Z | ||||
Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
Coefficient of Thermal Expansion |
31 48 237 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
Td | 500 | N/A | ℃TGA | N/A | ASTM D 3850 | |
Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) |
1oz(35mm)EDC
foil after solder float |
IPC-TM-650 2.4.8 | |
Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
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