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Home High Frequency PCB RT/Duroid 5880 10mil Double Sided Rogers High Frequency PCB Sided RF PCB

RT/Duroid 5880 10mil Double Sided Rogers High Frequency PCB Sided RF PCB

Rogers RT/duroid 5880 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. 

  • Item NO.:

    BIC-019-v104.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RT/Duroid 5880 10mil 0.254mm Rogers High Frequency PCB for Microstrip and Stripline Circuits

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5880 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 to Ku-band and above. RT/duroid 5880 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.


The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems and point to point digital radio antennas etc.


RT 5880 PCB 10mil


PCB Specifications


PCB SIZE 130 x 100mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RT/duroid 5880 0.254mm
copper ------- 18um(0.5oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5 mil / 4 mil
Minimum / Maximum Holes: 0.2 mm / 0.2mm
Number of Different Holes: 1
Number of Drill Holes: 15
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  RT/duroid 5880 0.254mm
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  0.3 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.22mm. Via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

RT duroid 5880 PCB DK DF


Data sheet of Rogers RT/duroid 5880


RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel  31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A



MANUFACTURING PROCESS:


Manufacturing Process of Dual Layer PTH PCB


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

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