Rogers 6010 High Frequency PCB Built on RT/Duroid 6010 DK 10.2 for Satellite Communications Systems
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RT/duroid 6010 PCB has a dielectric
constant value of 10.2, and is available in standard tolerance dielectric
thicknesses of 0.010”, 0.025”, 0.050”, 0.075”, and 0.100”.
Rogers 6010 PCB material features tight
dielectric constant and thickness control, low moisture absorption, and good
thermal mechanical stability. Its dissipation factor, tanδ, is 0.0023 at 10 GHz, and its thermal coefficient ofεis -425 ppm/℃between
-50℃and 170℃.
The volume resistivity and surface resistivity of RT/duroid 6010.2LM are 5 x
10^5 Mohm.cm and 5 x 10^6 Mohm, respectively.
PCB Capability (RT/duroid 6010)
|
PCB Material:
|
Ceramic-PTFE
composite
|
|
Designator:
|
RT/duroid 6010LM
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|
Dielectric
constant:
|
10.2 ±0.25 (process)
|
|
10.7 (design)
|
|
Layer count:
|
1 Layer, 2 Layer
|
|
Copper weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
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10mil (0.254mm),
25mil (0.635mm)
|
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50mil (1.27mm),
75mil (1.90mm)
|
|
PCB size:
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≤400mm X 500mm
|
|
Solder mask:
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Green, Black,
Blue, Yellow, Red etc.
|
|
Surface finish:
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Bare copper,
HASL, ENIG, Immersion tin, Immersion Silver, OSP.
|
RT/duroid 6010.2LM has a moisture absorption of
0.01%, and a thermal conductivity of 0.86 W/m/k at 80℃. Its coefficient of thermal expansion is 24 ppm/℃in the X direction, 24 ppm/℃in
the Y direction, and 47 ppm/℃in
the Z direction at 23℃/50% RH.
The material is compatible with lead-free
processes and has a copper peel strength of 12.3 pli (2.1 N/mm) after solder
float. It is also flame-resistant and has a V-0 rating under UL 94. Overall,
RT/duroid 6010.2LM is an ideal material for high-frequency circuit applications
that require a high dielectric constant and excellent mechanical and thermal
properties.
Features and Benefits
|
1. High
dielectric constant for circuit size reduction
|
|
2. Low loss.
Ideal for operating at X-bank or below
|
|
3. Low moisture
absorption reducing effects of moisture on electrical loss
|
|
4. Low Z-axis
expansion providing reliable PTH in multilayer boards
|
|
4. Tight DK and
thickness control for repeatable circuit performance
|
The typical applications are aircraft collision
avoidance systems, ground radar warning systems, patch antennas, satellite
communications systems etc.
Appendix:Properties of RT/duroid 6010LM
laminates.
|
RT/duroid
6010 Typical Value
|
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Property
|
RT/duroid 6010
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Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
10.2±0.25
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped stripline
|
|
Dielectric Constant,εDesign
|
10.7
|
Z
|
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor,tanδ
|
0.0023
|
Z
|
|
10
GHz/A
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
-425
|
Z
|
ppm/℃
|
-50℃-170℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
5 x 105
|
|
Mohm.cm
|
A
|
IPC
2.5.17.1
|
|
Surface Resistivity
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5 x 106
|
|
Mohm
|
A
|
IPC
2.5.17.1
|
|
Tensile Properties
|
ASTM D638 (0.1/min. strain rate)
|
|
Young's Modulus
|
931(135) 559(81)
|
X Y
|
MPa(kpsi)
|
A
|
|
Ultimate Stress
|
17(2.4) 13(1.9)
|
X Y
|
MPa(kpsi)
|
A
|
|
Ultimate Strain
|
9
to 15 7 to 14
|
X Y
|
%
|
A
|
|
Compressive Properties
|
|
ASTM D695 (0.05/min. strain rate)
|
|
Young's Modulus
|
2144
(311)
|
Z
|
MPa(kpsi)
|
A
|
|
Ultimate Stress
|
47(6.9)
|
Z
|
MPa(kpsi)
|
A
|
|
Ultimate Strain
|
25
|
Z
|
%
|
|
|
Flexural Modulus
|
4364
(633) 3751 (544)
|
X
|
MPa(kpsi)
|
A
|
ASTM D790
|
|
Ultimate Stress
|
36
(5.2) 32 (4.4)
|
X Y
|
MPa(kpsi)
|
A
|
|
Deformation under load
|
0.26 1.3
|
Z Z
|
%
|
24hr/50℃/7MPa 24hr/150℃/7MPa
|
ASTM
D261
|
|
Moisture Absorption
|
0.01
|
|
%
|
D48/50℃0.050"(1.27mm) thick
|
IPC-TM-650
2.6.2.1
|
|
Thermal Conductivity
|
0.86
|
|
W/m/k
|
80℃
|
ASTM
C518
|
Coefficient of Thermal Expansion
|
24
24
47
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650
2.4.41
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM
D3850
|
|
Density
|
3.1
|
|
g/cm3
|
|
ASTM
D792
|
|
Specific Heat
|
1.00(0.239)
|
|
j/g/k
(BTU/ib/OF)
|
|
Calculated
|
|
Copper Peel
|
12.3 (2.1)
|
|
pli (N/mm)
|
after solder float
|
IPC-TM-650
2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
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