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Home High Frequency PCB Rogers 6010 High Frequency PCB Built on RT/Duroid 6010 DK 10.2 for Satellite Communications Systems

Rogers 6010 High Frequency PCB Built on RT/Duroid 6010 DK 10.2 for Satellite Communications Systems

Bicheng PCB has strict quality control procedures in place to ensure that each Rogers 6010 PCB that they produce meets the highest standards of quality and reliability.

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Rogers 6010 High Frequency PCB Built on RT/Duroid 6010 DK 10.2 for Satellite Communications Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 6010 PCB has a dielectric constant value of 10.2, and is available in standard tolerance dielectric thicknesses of 0.010”, 0.025”, 0.050”, 0.075”, and 0.100”.

Rogers 6010 PCB material features tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability. Its dissipation factor, tanδ, is 0.0023 at 10 GHz, and its thermal coefficient ofεis -425 ppm/℃between -50℃and 170℃. The volume resistivity and surface resistivity of RT/duroid 6010.2LM are 5 x 10^5 and 5 x 10^6 Mohm, respectively.

PCB Capability (RT/duroid 6010)

PCB Material:

Ceramic-PTFE composite


RT/duroid 6010LM

Dielectric constant:

10.2 ±0.25 (process)

10.7 (design)

Layer count:

1 Layer, 2 Layer

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 25mil (0.635mm)

50mil (1.27mm), 75mil (1.90mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP.

RT/duroid 6010.2LM has a moisture absorption of 0.01%, and a thermal conductivity of 0.86 W/m/k at 80℃. Its coefficient of thermal expansion is 24 ppm/℃in the X direction, 24 ppm/℃in the Y direction, and 47 ppm/℃in the Z direction at 23℃/50% RH.

The material is compatible with lead-free processes and has a copper peel strength of 12.3 pli (2.1 N/mm) after solder float. It is also flame-resistant and has a V-0 rating under UL 94. Overall, RT/duroid 6010.2LM is an ideal material for high-frequency circuit applications that require a high dielectric constant and excellent mechanical and thermal properties.

50mil RT-duroid 6010 PCB

Features and Benefits

1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Low moisture absorption reducing effects of moisture on electrical loss

4. Low Z-axis expansion providing reliable PTH in multilayer boards

4. Tight DK and thickness control for repeatable circuit performance

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.

Appendix:Properties of RT/duroid 6010LM laminates.

RT/duroid 6010 Typical Value
Property RT/duroid 6010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.25 Z 10 GHz/23℃ IPC-TM-650 Clamped stripline
Dielectric Constant,εDesign 10.7 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0023 Z 10 GHz/A IPC-TM-650
Thermal Coefficient of ε -425 Z ppm/℃ -50℃-170℃ IPC-TM-650
Volume Resistivity 5 x 105 A IPC
Surface Resistivity 5 x 106 Mohm A IPC
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 931(135)        559(81) X                           Y MPa(kpsi) A
Ultimate Stress 17(2.4)         13(1.9) X                    Y MPa(kpsi) A
Ultimate Strain 9 to 15                   7 to 14 X                    Y % A
Compressive Properties ASTM D695 (0.05/min. strain rate)
Young's Modulus 2144 (311) Z MPa(kpsi) A
Ultimate Stress 47(6.9) Z MPa(kpsi) A
Ultimate Strain 25 Z %
Flexural Modulus 4364 (633)      3751 (544) X MPa(kpsi) A ASTM D790
Ultimate Stress 36 (5.2)               32 (4.4) X                    Y                MPa(kpsi) A
Deformation under load 0.26                     1.3 Z                    Z % 24hr/50℃/7MPa   24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.01 % D48/50℃0.050"(1.27mm) thick IPC-TM-650
Thermal Conductivity 0.86 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃TGA ASTM D3850
Density 3.1 g/cm3 ASTM D792
Specific Heat 1.00(0.239) j/g/k
Copper Peel 12.3 (2.1) pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes




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