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Home High Frequency PCB Rogers High Frequency PCB RT/Duroid 6010 DK 10.2 50mil Immersion Gold

Rogers High Frequency PCB RT/Duroid 6010 DK 10.2 50mil Immersion Gold

RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. 


  • Item NO.:

    BIC-061-v54.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers High Frequency PCB Built on RT/Duroid 6010 DK 10.2 50mil With Immersion Gold for Satellite Communications Systems


(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Hi Guys,

Today we’re going to talk about Rogers 6010 PCB.


Rogers RT/duroid 6010LM microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. It's available with a dielectric constant value of 10.2.


RT duroid 6010 PCB Board


PCB Capability (RT/duroid 6010):


PCB Material:

Ceramic-PTFE composite

Designator:

RT/duroid 6010LM

Dielectric constant:

10.2 ±0.25 (process)

10.7 (design)

Layer count:

1 Layer, 2 Layer

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 25mil (0.635mm)

50mil (1.27mm), 75mil (1.90mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP.


RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.  It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.


RT-duroid 6010 PCB 50 MIL


Features and Benefits:


1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Low moisture absorption reducing effects of moisture on electrical loss

4. Low Z-axis expansion providing reliable PTH in multilayer boards

4. Tight DK and thickness control for repeatable circuit performance


The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.


Appendix: Properties of RT/duroid 6010LM laminates. Thank you for your reading.


RT/duroid 6010 Typical Value
Property RT/duroid 6010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.25 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 10.7 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0023 Z 10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -425 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 105 Mohm.cm A IPC 2.5.17.1
Surface Resistivity 5 x 106 Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 931(135)        559(81) X                           Y MPa(kpsi) A
Ultimate Stress 17(2.4)         13(1.9) X                    Y MPa(kpsi) A
Ultimate Strain 9 to 15                   7 to 14 X                    Y % A
Compressive Properties ASTM D695 (0.05/min. strain rate)
Young's Modulus 2144 (311) Z MPa(kpsi) A
Ultimate Stress 47(6.9) Z MPa(kpsi) A
Ultimate Strain 25 Z %
Flexural Modulus 4364 (633)      3751 (544) X MPa(kpsi) A ASTM D790
Ultimate Stress 36 (5.2)               32 (4.4) X                    Y                MPa(kpsi) A
Deformation under load 0.26                     1.3 Z                    Z % 24hr/50℃/7MPa   24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.01 % D48/50℃0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.86 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
24
24
47
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃TGA ASTM D3850
Density 3.1 g/cm3 ASTM D792
Specific Heat 1.00(0.239) j/g/k
(BTU/ib/OF)
Calculated
Copper Peel 12.3 (2.1) pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes



MANUFACTURING PROCESS:


Manufacturing Process of Dual Layer PTH PCB


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION



BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

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