Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
Taconic TLY laminates are a type of low loss
laminates. They are manufactured with very light weight woven fiberglass and
are more dimensionally stable than chopped fiber reinforced PTFE composites.
Item NO.:
BIC-035-v12.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysTaconic High Frequency PCB Made on TLY-5 7.5mil 0.191mm With DK2.2 for Automotive Radar
The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.
Benefits:
Dimensionally stable
Lowest DF
Low moisture absorption
High copper peel strength
Uniform & consistent DK
Laser ablatable
Applications:
Automotive radar
Satellite/cellular communications
Power amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band applications
PCB Specifications:
| PCB SIZE | 76 x 51mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| TLY-5 0.191mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10 mil / 10 mil |
| Minimum / Maximum Holes: | 0.4mm / 2.0mm |
| Number of Different Holes: | 0 |
| Number of Drill Holes: | 0 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | TLY-5 |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.25 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | OSP |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | N/A |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Taconic TLY Material:
| TLY TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
| Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | 0.01 | 0.01 | |||
| NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
| NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
MANUFACTURING PROCESS:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:

BICHENG PCB MAIN COURIERS:

Previous:
Rogers RO3203 High Frequency 2-Layer 10mil Circuit Board Microwave PCBNext:
Rogers TMM4 PCB Immersion Gold TMM3 TMM6 TMM10 TMM10i TMM13iIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
20-Layer Panasonic TU872 HDI PCB ENEPIG 3.0mm Finished Thick Laser-drilled Blind Vias
10-Layer Rogers RO4003C + 370HR FR4 Hybrid Laminate PCB ENIG Impedance Control
8-Layer 10oz Heavy Copper TU-865 Substrate PCB With ENIG Blind &Buried Via
4-Layer Rogers RO3210 + RO4450F PCB ISIG Surface Finish 1.321mm With Blind Via
4-Layer Rogers RO3003+TG170 FR-4 Hybrid PCB Immersion Silver Green Solder Mask
WL-CT440 PCB 30mil 0.762mm Wangling Laminate ENIG Finish No Solder Mask
TP1600 PCB 31.49mil High DK16 Wangling Laminate Pure Gold Plating
TLX-9 PCB 10mil 0.254mm Taconic High Frequency Laminate EPIG Nickle-free
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported