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Home High Frequency PCB Rogers TMM4 PCB Immersion Gold TMM3 TMM6 TMM10 TMM10i TMM13i

Rogers TMM4 PCB Immersion Gold TMM3 TMM6 TMM10 TMM10i TMM13i

Rogers TMM4 thermoset microwave material is ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability stripline and microstrip applications.

  • Item NO.:

    BIC-103-v9.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i


It's available with dielectric constant at 4.70. The electrical and mechanical properties of TMM4 combine many of the benefits of both ceramic and traditional PTFE microwave circuit materials, without requiring the specialized production techniques. It does not require a sodium napthanate treatment prior to electroless plating.


TMM4 DK4.5 PCB


TMM4 has an exceptionally low thermal coefficient of dielectric constant, typically less than 30 PPM/°C. The material’s isotropic coefficient of thermal expansion, very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic materials, facilitating heat removal.


 TMM4 RF PCB 1.6mm


TMM4 is based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation. 


Our PCB Capability (TMM4):


PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designator: TMM4
Dielectric constant: 4.5  ±0.045 (process);                                                               4.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm) etc.
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP.


Main Applications are as follows:



  1. Chip testers
  2. Dielectric polarizers and lenses
  3. Filters and coupler
  4. Global Positioning Systems Antennas
  5. Patch Antennas
  6. Power amplifiers and combiners
  7. RF and microwave circuitry
  8. Satellite communication systems



Data Sheet of TMM4:


Property TMM4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z 10 GHz IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +15 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 16 X ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
3.18mm (0.125") 0.18
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

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