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Home High Frequency PCB Rogers RO3203 High Frequency 2-Layer 10mil Circuit Board Microwave PCB

Rogers RO3203 High Frequency 2-Layer 10mil Circuit Board Microwave PCB

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using

  • Item NO.:

    BIC-121-v23.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers RO3203 High Frequency PCB 2-Layer Rogers 3203 10mil Circuit Board DK3.02 DF 0.0016 Microwave PCB


RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.


RO3203 PCB board


Standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.


RO3203 10mil PCB


Features:


1. Woven glass reinforcement improves rigidity for easier handling.

2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.

3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.

4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.

5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs

and reliable surface mounted assemblies.

6. Excellent dimensional stability for high production yields.

7. Economically priced for volume manufacturing.

8. Surface smoothness allows for finer line etching tolerances


Typical Applications:


1. Automotive Collision Avoidance Systems

2. Automotive Global Positioning Satellite Antennas

3. Base Station Infrastructure

4. Datalink on Cable Systems

5. Direct Broadcast Satellites

6. LMDS and Wireless Broadband

7. Microstrip Patch Antennas

8. Power Backplanes

9. Remote Meter Readers

10. Wireless Telecommunications Systems


PCB Capability (RO3203):


PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Data Sheet of RO3203:


RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2) W/mK Float 100℃ ASTM C518
Volume Resistivity 107 MΩ.cm A ASTM D257
Surface Resistivity 107 A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650  2.4.3.9
Tensile Modulus X                 Y kpsi RT ASTM D638
Flexural Modulus 400                 300 X                 Y kpsi A ASTM D790
Tensile Strength 12.5                   13 X                 Y kpsi RT ASTM D638
Flexural Strength 9                            8 X                 Y kpsi A ASTM D790
Moisure Absorption <0.1 % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion
58                     13 Z                            X,Y                  ppm/℃ -50℃to 288℃ ASTM D3386
Td 500 TGA ASTM D3850
Density 2.1 gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74) lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes


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