Rogers
RO3203 High Frequency PCB 2-Layer Rogers 3203 10mil Circuit Board DK3.02 DF
0.0016 Microwave PCB
RO3203
High Frequency Circuit Materials of Rogers Corporation are ceramic-filled
laminates reinforced with woven fiberglass. This material is engineered to
offer exceptional electrical performance and mechanical stability at
competitive prices. The dielectric constant of RO3203 High Frequency Circuit
Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the
useful frequency range beyond 40 GHz.
Standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1
or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These
laminates are manufactured under an ISO 9002 certified quality system.
Features:
1.
Woven glass reinforcement improves rigidity for easier handling.
2.
Uniform electrical and mechanical performance is ideal for complex multilayer
high frequency structures.
3.
Low dielectric loss for high frequency performance can be used in applications
exceeding 20 GHz.
4.
Excellent mechanical properties over a wide range of dielectric constants are
ideal for multilayer board designs.
5.
Low in-plane expansion coefficient (matched to copper) is suitable for use with
epoxy glass multilayer board hybrid designs
and
reliable surface mounted assemblies.
6.
Excellent dimensional stability for high production yields.
7.
Economically priced for volume manufacturing.
8.
Surface smoothness allows for finer line etching tolerances
Typical
Applications:
1.
Automotive Collision Avoidance Systems
2.
Automotive Global Positioning Satellite Antennas
3.
Base Station Infrastructure
4.
Datalink on Cable Systems
5.
Direct Broadcast Satellites
6.
LMDS and Wireless Broadband
7.
Microstrip Patch Antennas
8.
Power Backplanes
9.
Remote Meter Readers
10. Wireless
Telecommunications Systems
PCB
Capability (RO3203):
|
PCB
Material:
|
Ceramic-filled
Laminates Reinforced with Woven Fiberglass
|
|
Designation:
|
RO3203
|
|
Dielectric constant:
|
3.02±0.04
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Data
Sheet of RO3203:
|
RO3203
Typical Value
|
|
Property
|
RO3203
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.02±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Dissipation Factor,tanδ
|
0.0016
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Conductivity
|
0.47 (3.2)
|
|
W/mK
|
Float
100℃
|
ASTM C518
|
|
Volume Resistivity
|
107
|
|
MΩ.cm
|
A
|
ASTM D257
|
|
Surface Resistivity
|
107
|
|
MΩ
|
A
|
ASTM D257
|
|
Dimensional Stability
|
0.08
|
X, Y
|
mm/m
+E2/150
|
after etch
|
IPC-TM-650 2.4.3.9
|
|
Tensile Modulus
|
|
X Y
|
kpsi
|
RT
|
ASTM D638
|
|
Flexural Modulus
|
400 300
|
X Y
|
kpsi
|
A
|
ASTM D790
|
|
Tensile Strength
|
12.5 13
|
X Y
|
kpsi
|
RT
|
ASTM D638
|
|
Flexural Strength
|
9 8
|
X Y
|
kpsi
|
A
|
ASTM D790
|
|
Moisure Absorption
|
<0.1
|
|
%
|
D24/23
|
IPC-TM-650 2.6.2.1
|
Coefficient of Thermal Expansion
|
58 13
|
Z X,Y
|
ppm/℃
|
-50℃to
288℃
|
ASTM D3386
|
|
Td
|
500
|
|
℃
|
TGA
|
ASTM D3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D792
|
|
Copper Peel Stength
|
10 (1.74)
|
|
lbs/in (N/mm)
|
After solder
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-Free Process Compatible
|
Yes
|
|
|
|
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