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Home Newly Shipped RF PCB RT/duroid 6035HTC PCB 30mil Rogers Substrate High Frequency 2-layer Printed Circuit Board

RT/duroid 6035HTC PCB 30mil Rogers Substrate High Frequency 2-layer Printed Circuit Board

Introducing RT/duroid 6035HTC PCB: Superior Thermal Performance for High Power Applications

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RT/duroid 6035HTC PCB 30mil Rogers Substrate High Frequency 2-layer Printed Circuit Board


We are excited to introduce our newly shipped PCB, the RT/duroid 6035HTC 30mil PCB. This advanced printed circuit board offers exceptional thermal conductivity and low loss tangent, making it an ideal choice for high power applications in the RF and microwave industry. With its innovative features and reliable construction, the RT/duroid 6035HTC PCB provides superior performance and reliability.


PCB Substrates:

The Rogers RT/duroid 6035HTC is constructed using Rogers' ceramic filled PTFE composites. With a dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.0013 at the same frequency and temperature, this PCB substrate ensures excellent high frequency performance. Its thermal coefficient of er of -66 ppm/°C and moisture absorption of 0.06% guarantee thermal stability and reliability in various environments. Additionally, the RT/duroid 6035HTC boasts a thermal conductivity of 1.44 W/m/K at 80°C, allowing for efficient heat dissipation.



1. High Thermal Conductivity:

The RT/duroid 6035HTC PCB excels in dielectric heat dissipation, enabling lower operating temperatures for high power applications. This feature ensures the longevity and reliability of your electronic devices.

2. Low Loss Tangent:

With its low loss tangent, this PCB provides excellent high frequency performance, minimizing signal loss and distortion. This characteristic is crucial in maintaining signal integrity and achieving optimal system performance.

3. Thermally Stable Low Profile and Reverse Treat Copper Foil:

The thermally stable low profile and reverse treat copper foil used in the Rogers RT/duroid 6035HTC PCB offer multiple benefits. It reduces insertion loss, enhances thermal stability of traces, and ensures superior signal transmission.

4. Advanced Filler System:

The advanced filler system employed in this PCB enhances drillability and extends tool life compared to circuit materials containing alumina. This feature not only improves manufacturing efficiency but also contributes to overall cost savings.


RT/duroid 6035HTC 2-layerStackup:

TheRT/duroid 6035HTC 30milPCB is a 2-layer rigid board with a finished thickness of 0.8mm. It features copper layers of 35 μm on both sides, with the RT/duroid 6035HTC 0.762mm substrate measuring 0.762 mm (30 mil) in thickness.


Rogers RT/duroid 6035HTC PCB


RT/duroid 6035HTC Construction details:

Construction Details


Board Dimensions

39.86mm x 43mm (+/- 0.15mm)

Minimum Trace/Space

4/6 mils

Minimum Hole Size


Blind Vias


Finished Board Thickness


Finished Cu Weight

1oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Top Silkscreen


Bottom Silkscreen


Top Solder Mask


Bottom Solder Mask


Via Filled and Capped


100% Electrical Test



RT/duroid 6035HTC Statistics:

PCB Statistics




Total Pads


Thru Hole Pads


Top SMT Pads


Bottom SMT Pads







Typical Applications:

The exceptional thermal conductivity and stability of RT/duroid 6035HTC 30mil laminates make them an ideal choice for high power applications. Some typical applications include:


High power RF and microwave amplifiers

Power amplifiers




Power dividers


For any technical inquiries or further information, please contact our dedicated team at Our knowledgeable sales representatives are ready to assist you and provide the support you need.


Choose the RT/duroid 6035HTC high frequency PCB for your high power applications and experience the unparalleled performance and reliability it offers. Upgrade your electronic designs with confidence and unlock new possibilities with our advanced PCB solution.


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