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Home Multilayer PCB Board Via Filled PCB Via in Pad 0.6mm Multilayer 6 Layer With Blind Via for GPS Tracking

Via Filled PCB Via in Pad 0.6mm Multilayer 6 Layer With Blind Via for GPS Tracking

This is a type of 6 layer ultrathin printed circuit board built on FR-4 substrate with Tg 135°C for the application of GPS Tracking.

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  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
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    7-10 days
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Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

It's only 0.6 mm thick without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm areresin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.

1.2 Features and benefits

1. Via in pad design reduced the inductive reactance and capacitive reactance of the transmission line;

2. Immersion gold finish has high solderability, no stressing of circuit boards and less contamination of PCB surface;

3. Products and manufacturing are certified by authorized organizations;

4. Eligible products rate of first production: >95%;

5. Prototype PCB capability to volume production capability;

6. Delivery on time: >98%;

7. More than 18+ years of PCB experience;

8. IPC Class 2 / IPC Class 3;

Via in Pad PCB

1.3 Applications

Led Lighting

Intercom System

Portable WiFi Router

GSM Tracker

Commercial Led Lighting

Modem WiFi 4G

Honeywell Access Control

Electronic Access Control

Audio Frequency Amplifier

File servers         

1.4 PCB Specifications

PCB SIZE 100 x 103mm=1PCS
Number of Layers 6 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP CS
4mil prepreg
copper ------- 18um(0.5oz) GND Plane
4mil FR-4
copper ------- 18um(0.5oz) PWR Plane
4mil prepreg
copper ------- 18um(0.5oz) PWR Plane
4mil FR-4
copper ------- 18um(0.5oz) SIG
4mil prepreg
copper ------- 18um(0.5oz) BOT PS
Minimum Trace and Space: 3mil/3mil
Minimum / Maximum Holes: 0.22/3.50mm
Number of Different Holes: 25
Number of Drill Holes: 2315
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
Glass Epoxy:  FR-4, ITEQ IT140 TG>135, er<5.4
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  0.6mm ±0.1
Surface Finish Immersion gold 0.025µm over 3µm Nickel (14.4% area)
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, TAIYO PSR-2000 GT600D
Solder Mask Type: LPSM
Side of Component Legend No silkscreen requried.
Colour of Component Legend No silkscreen requried.
Manufacturer Name or Logo:  No silkscreen requried.
VIA Plated through hole(PTH), Blind via and  via capping on CS and PS, vias not be visible.
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Via in Pad PCB

1.5 via in pad (VIP)

At present, the circuit board is becoming more and more dense and interconnected, and there is no more room for these wires and pads connecting the holes. Therefore, so in this context, the process of punching the holes on the pads arises at the historic moment. In brief, the via holes which have been plated through are plugged or filled by insulating resin through the method of screen leakage, and then drying, grinding, and then electroplating, so that the whole surface of the PCB is coated with copper, and no longer via holes can be seen.

The effect of via in pad is also very obvious: such as improved the electrical performance and reliability of electronic products, shorten the signal transmission wire, reduced the inductive reactance and capacitive reactance of the transmission line, and reduced internal and external electromagnetic interference.

Let’s see the basic process of via in pad.

Process of VIP




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IPv6 network supported

IPv6 network supported


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