Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Multilayer PCB Board Via Filled PCB Via in Pad 0.6mm Multilayer 6 Layer With Blind Via for GPS Tracking

Via Filled PCB Via in Pad 0.6mm Multilayer 6 Layer With Blind Via for GPS Tracking

This is a type of 6 layer ultrathin printed circuit board built on FR-4 substrate with Tg 135°C for the application of GPS Tracking.



  • Item NO.:

    BIC-460-v95.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's only 0.6 mm thick without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm areresin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.


1.2 Features and benefits


1. Via in pad design reduced the inductive reactance and capacitive reactance of the transmission line;

2. Immersion gold finish has high solderability, no stressing of circuit boards and less contamination of PCB surface;

3. Products and manufacturing are certified by authorized organizations;

4. Eligible products rate of first production: >95%;

5. Prototype PCB capability to volume production capability;

6. Delivery on time: >98%;

7. More than 18+ years of PCB experience;

8. IPC Class 2 / IPC Class 3;


Via in Pad PCB


1.3 Applications


Led Lighting

Intercom System

Portable WiFi Router

GSM Tracker

Commercial Led Lighting

Modem WiFi 4G

Honeywell Access Control

Electronic Access Control

Audio Frequency Amplifier

File servers         


1.4 PCB Specifications


PCB SIZE 100 x 103mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 6 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP CS
4mil prepreg
copper ------- 18um(0.5oz) GND Plane
4mil FR-4
copper ------- 18um(0.5oz) PWR Plane
4mil prepreg
copper ------- 18um(0.5oz) PWR Plane
4mil FR-4
copper ------- 18um(0.5oz) SIG
4mil prepreg
copper ------- 18um(0.5oz) BOT PS
TECHNOLOGY
Minimum Trace and Space: 3mil/3mil
Minimum / Maximum Holes: 0.22/3.50mm
Number of Different Holes: 25
Number of Drill Holes: 2315
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy:  FR-4, ITEQ IT140 TG>135, er<5.4
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  0.6mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold 0.025µm over 3µm Nickel (14.4% area)
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, TAIYO PSR-2000 GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend No silkscreen requried.
Colour of Component Legend No silkscreen requried.
Manufacturer Name or Logo:  No silkscreen requried.
VIA Plated through hole(PTH), Blind via and  via capping on CS and PS, vias not be visible.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Via in Pad PCB


1.5 via in pad (VIP)


At present, the circuit board is becoming more and more dense and interconnected, and there is no more room for these wires and pads connecting the holes. Therefore, so in this context, the process of punching the holes on the pads arises at the historic moment. In brief, the via holes which have been plated through are plugged or filled by insulating resin through the method of screen leakage, and then drying, grinding, and then electroplating, so that the whole surface of the PCB is coated with copper, and no longer via holes can be seen.


The effect of via in pad is also very obvious: such as improved the electrical performance and reliability of electronic products, shorten the signal transmission wire, reduced the inductive reactance and capacitive reactance of the transmission line, and reduced internal and external electromagnetic interference.


Let’s see the basic process of via in pad.

Process of VIP


BICHENG PCB WORKSHOP:




BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
3 Layer RO4350B PCB
3 Layer High Frequency PCB Built On 60mil RO4350B 6.6mil ENIG

Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive.

Rogers High Frequency PCB Board
5 Layer High Frequency PCB Board Rogers 20mil RO4003C

5 layer PCB is fabricated on 3 cores of RO4003C and etched 1 layer copper off to achieve 5 layers.

Rogers RO4360 Multi PCB
Rogers RO4360 High Frequency PCB 6-layer with 8mil Core Coating

RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

M6 Multilayer Printed Circuit Board
M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc.

M6 High Speed Multilayer PCB
M6 High Speed PCB Panasonic R-5775 Low Loss Multilayer Circuit Board

This type of 4-layer circuit board is built on Panasonic Megtron6 (M6) R-5775G high speed low loss material.

High Tg TU-768 Multi-layer PCB
High Tg Lead Free Multi-layer PCB Built on TU-768 Core and TU-768P Prepreg

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process.

High Tg Multi-layer PCB
High Tg Multi-layer PCB on IT-180ATC and IT-180GNBS Lead Free Compliance

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance.

Multilayer FR-4 PCB
Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

This is a type of 8-layer printed circuit board built on FR-4 Tg175℃ substrate for the application of Satellite Radio.

© Copyright: 2022 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #