High
Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead
Free Compliance
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description
It’s suitable for various
applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to
3.2mm, copper weight 0.5oz to 3oz.
Applications
Automotive
(Engine room ECU)
Multilayer
and HDI PCB
Backplanes
Data
Storage
Server
and Networking
Telecommunications
Heavy
Copper
Key
Features
Low
CTE
High
heat resistance
Excellent
CAF resistance
Good
through-hole reliability
Our
PCB Capability (IT-180ATC)
|
PCB
Material:
|
High Tg, Lead
Free High Reliability Epoxy Resin
|
|
Designation:
|
IT-180ATC
|
|
Dielectric constant:
|
4.4
at 1GHz
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid
PCB
|
|
Copper
weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm), 3oz (105µm)
|
|
PCB thickness:
|
0.6mm,
0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green,
Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
|
|
Technology:
|
HDI, Via in pad, Impedance
Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.
|
General
Properties of IT-180ATC
|
Items
|
IPC TM-650
|
Typical Value
|
Unit
|
|
Peel Strength, minimum
|
2.4.8
|
|
lb/inch
|
|
A. Low
profile copper foil
|
5
|
|
B.
Standard profile copper foil
|
8
|
|
Volume Resistivity
|
2.5.17.1
|
1x109
|
MW-cm
|
|
Surface Resistivity
|
2.5.17.1
|
1x108
|
MW
|
|
Moisture Absorption, maximum
|
2.6.2.1
|
0.1
|
%
|
|
Permittivity (Dk, 50% resin content)
|
|
|
--
|
|
A. 1MHz
|
2.5.5.9
|
4.5
|
|
B. 1GHz
|
2.5.5.9
|
4.4
|
|
Loss Tangent (Df, 50% resin content)
|
|
|
--
|
|
A. 1MHz
|
2.5.5.9
|
0.014
|
|
B. 1GHz
|
2.5.5.9
|
0.015
|
|
Flexural Strength, minimum
|
|
|
N/mm2
|
|
A.
Length direction
|
2.4.4
|
500-530
|
|
B.
Cross direction
|
|
410-440
|
|
Thermal Stress 10 s at 288°C
|
|
|
|
|
A.
Unetched
|
2.4.13.1
|
Pass
|
Rating
|
|
B.
Etched
|
|
Pass
|
|
|
Flammability
|
UL94
|
V-0
|
Rating
|
|
Comparative Tracking Index (CTI)
|
IEC
60112 / UL 746
|
CTI
3 (175-249)
|
Class
(Volts)
|
|
Glass Transition Temperature(DSC)
|
2.4.25
|
175
|
˚C
|
|
Decomposition Temperature
|
2.4.24.6
|
345
|
˚C
|
|
X/Y Axis CTE (40℃ to 125℃)
|
2.4.41
|
11-13
/ 13-15
|
ppm/˚C
|
|
Z-Axis CTE
|
|
|
|
|
A.
Alpha 1
|
|
45
|
ppm/˚C
|
|
B.
Alpha 2
|
2.4.24
|
210
|
ppm/˚C
|
|
C. 50
to 260 Degrees C
|
|
2.7
|
%
|
|
Thermal Resistance
|
|
|
|
|
A. T260
|
2.4.24.1
|
>60
|
Minutes
|
|
B. T288
|
|
20
|
Minutes
|
MANUFACTURING PROCESS:
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