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Home Multilayer PCB Board High Tg Multi-layer PCB on IT-180ATC and IT-180GNBS Lead Free Compliance

High Tg Multi-layer PCB on IT-180ATC and IT-180GNBS Lead Free Compliance

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance.



  • Item NO.:

    BIC-506-v82.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.


Applications


Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper


IT-180 PCB


Key Features


Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability


Our PCB Capability (IT-180ATC)


PCB Material: High Tg, Lead Free High Reliability Epoxy Resin 
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.


General Properties of IT-180ATC


Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8 lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 MW-cm
Surface Resistivity 2.5.17.1 1x108 MW
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content) --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content) --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction 410-440
Thermal Stress 10 s at 288°C
A. Unetched 2.4.13.1 Pass Rating
B. Etched Pass
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1 45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C 2.7 %
Thermal Resistance
A. T260 2.4.24.1 >60 Minutes
B. T288 20 Minutes



MANUFACTURING PROCESS:


Process PTH PCB


BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


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