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Home Multilayer PCB Board Rogers RO4360 High Frequency PCB 6-layer with 8mil Core Coating

Rogers RO4360 High Frequency PCB 6-layer with 8mil Core Coating

RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

  • Item NO.:

    BIC-120-v29.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers RO4360 High Frequency PCB Based on 6-layer with 8mil Core Coating Immersion Gold for Small Cell Transceivers


RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. 


RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.


RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.

6L RO4360G2 PCB


Features and benefits:


1. Thermoset resin system specially formulated to meet 6.15 Dk

1). Ease of fabrication / processes similar to FR-4

2). Material repeatability

3). Low loss

4). High thermal conductivity

5). Lower total PCB cost solution than competing PTFE products,


2. Low Z-axis CTE / High Tg

1). Design flexibility

2). Plated through-hole reliability

3). Automated assembly compatible


3. Environmentally friendly

1.) Lead free process compatible


4. Regional finished goods inventory

1). Short lead times / quick inventory turns

2). Efficient supply chain


6L RO4360G2 PCB Board


Some Typical Applications:


1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar


PCB Capability:


PCB Capability (RO4360G2) 
PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Stack up:


6-layer Stack up of RO4360G2 RF PCB


Data Sheet of RO4360G2:


RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75 W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013 Ω.cm Elevated T IPC-TM-650  2.5.17.1
Surface Resistivity 9.0 X 1012 Ω Elevated T IPC-TM-650  2.5.17.1
Electrical Strength 784 Z V/mil IPC-TM-650  2.5.6.2
Tensile Strength 131 (19)     97(14) X                 Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31)     145(21) X                 Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion
13                     14                              28 X                      Y                         Z ppm/℃ -50℃to 288℃  After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280 ℃ TMA IPC-TM-650 2.4.24.3
Td 407 ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08 % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃to 150℃  IPC-TM-650, 2.5.5.5
Density 2.16 gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91) pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0 UL 94 File QMTS2. E102765


PCB MANUFACTURING PROCESS:



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