5
Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C with Immersion
Gold
Viewing from the stack up, we can see 3 sheets
of 20 mil cores achieve the basic layer structure, 2 layers of dielectric
material (prepreg) bond the 3 cores which result in 5-layer board. Copper
weight in inner-layer is half ounce, outer-layer 1 ounce. Final height of the
board is 2.1mm thick.
Following is the picture of micro-section, which
can more intuitively reflect the structure of the board. No solder mask is
applied on the surface, pads are immersion gold plated.
Actually the stack up of multilayer PCBs can be
done in many different ways according to the different requirements or applications
for controlled impedances, signal transmission etc. There’re many types of
cores for our designer to choose in RO4003C family, such as 8mil, 12mil, 16mil,
20mil, 32mil and 60mil etc.
The core has fixed thickness, it is very
important to the electrical length of RF lines on the circuit board.
We have a variety of high frequency materials
for customers to choose from, the main are Rogers 4000 series, 3000 series,
5000 series and 6000 series, Taconic TLX series, TLY series etc. and Chinese
F4B series etc.
Appendix: Our PCB Capability 2021:
|
Parameter
|
Value
|
|
Layer Counts
|
1-32
|
|
Substrate Material
|
FR-4(including
High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006,
RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002,
RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon
AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
|
|
Maximum Size
|
Flying test: 900*600mm, Fixture
test 460*380mm, No test 1100*600mm
|
|
Board Outline Tolerance
|
±0.0059"
(0.15mm)
|
|
PCB Thickness
|
0.0157"
- 0.3937" (0.40mm--10.00mm)
|
|
Thickness Tolerance(T≥0.8mm)
|
±8%
|
|
Thickness Tolerance(t＜0.8mm)
|
±10%
|
|
Insulation Layer Thickness
|
0.00295"
- 0.1969" (0.075mm--5.00mm)
|
|
Minimum Track
|
0.003"
(0.075mm)
|
|
Minimum Space
|
0.003" (0.075mm)
|
|
Outer Copper Thickness
|
35µm--420µm (1oz-12oz)
|
|
Inner Copper Thickness
|
17µm--350µm (0.5oz - 10oz)
|
|
Drill Hole(Mechanical)
|
0.0059"
- 0.25" (0.15mm--6.35mm)
|
|
Finished Hole(Mechanical)
|
0.0039"-0.248"
(0.10mm--6.30mm)
|
|
DiameterTolerance(Mechanical)
|
0.00295"
(0.075mm)
|
|
Registration (Mechanical)
|
0.00197"
(0.05mm)
|
|
Aspect Ratio
|
12:1
|
|
Solder Mask Type
|
LPI
|
|
Min Soldermask Bridge
|
0.00315"
(0.08mm)
|
|
Min Soldermask Clearance
|
0.00197"
(0.05mm)
|
|
Plug via Diameter
|
0.0098"
- 0.0236" (0.25mm--0.60mm)
|
|
Impedance Control Tolerance
|
±10%
|
|
Surface Finish
|
HASL,HASL
LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
|
PCB MANUFACTURING PROCESS:
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BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
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Tel : +86 755 27374946
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Email : info@bichengpcb.com
