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Megtron 6 is an ultra-low loss, highly heat
resistant circuit board material designed for mobile, networking, and wireless
applications etc.
Item NO.:
BIC-173-v37.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysM6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.
Part Numbers:
Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670
Main Features:
Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)
Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)
Lead-free, ROHS-compliant soldering
High heat resistance
M6 also provides excellent high-density interconnect (HDI) and thermal performance.
Our PCB Capabilities (Megtron 6):
PCB Material: |
Low DK Glass Cloth |
Designation: |
Laminate R-5775(G), Prepreg R-5670(G) |
Dielectric constant: |
3.61 at 10GHz |
Dissipation Factor |
0.004 at 10GHz |
Layer count: |
Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Main Applications:
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment,
Measuring instrument,
Super computer,
Typical Value of R-5775:
Property | Units | Test Method | Condition | Typical Value | ||
THERMAL | Glass Transition Temp ( Tg ) | C | DSC | As received | 185 | |
DMA | As received | 210 | ||||
Thermal Decomposition Temp | C | TGA | As received | 410 | ||
Time to Delam (T288) | Without Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | |
With Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | ||
CTE : α1 | X - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | |
Y - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | ||
Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 45 | ||
CTE : α2 | Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | > Tg 260 | 260 | |
ELECTRICAL | Volume Resistivity | MΩ - cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 109 | |
Surface Resistivity | MΩ | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 108 | ||
Dielectric Constant ( Dk ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.71 | |
@ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 3.61 | ||
Dissipation Factor ( Df ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 0.002 | |
@ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 0.004 | ||
PHYSICAL | Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
Peel Strength | 1oz ( H-VLP ) | kN / m | IPC TM-650 2.4.8 | As Received 0.8 | 0.8 | |
Flammability | / | UL | C-48/23/50 | 94V-0 |
Megtron 6 Material List in stock (as of September 2021):
Item |
Thickness (mil) |
Thickness(mm) |
Structure |
Copper weight(oz) |
Type of copper |
R5775G |
2.0 |
0.050 |
1035*1 |
H/H |
HVLP |
R5775G |
2.6 |
0.065 |
1080*1 |
H/H |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
HVLP |
R5775G |
3.9 |
0.100 |
3313*1 |
H/H |
RTF |
R5775G |
3.9 |
0.100 |
3313*1 |
1.0/1.0 |
RTF |
R5775G |
5.9 |
0.150 |
1080*2 |
2.0/2.0 |
RTF |
R5775G |
9.8 |
0.250 |
2116*2 |
H/H |
RTF |
We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.
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