M6 High Speed Low Loss Multilayer Printed
Circuit Board Megtron 6 PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
The main properties of
Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors
(DF), low transmission loss and high heat resistance.
Part Numbers：
Low
Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard
E Glass Cloth - Laminate R-5775 / PrepregR-5670
Main Features：
Low
Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)
Excellent
through-hole reliability (5x better than our conventional high Tg FR4 material)
Lead-free,
ROHS-compliant soldering
High
heat resistance
M6
also provides excellent high-density interconnect (HDI) and thermal
performance.
Our PCB Capabilities (Megtron 6)：
|
PCB Material:
|
Low DK Glass Cloth
|
|
Designation:
|
Laminate R-5775(G), Prepreg R-5670(G)
|
|
Dielectric constant:
|
3.61 at 10GHz
|
|
Dissipation Factor
|
0.004 at 10GHz
|
|
Layer count:
|
Multilayer PCB, Hybrid PCB
|
|
Copper weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm,
1.8mm, 2.0mm
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue, Yellow, Red etc.
|
|
Surface finish:
|
Bare copper, HASL, ENIG, Immersion
silver, Immersion tin, OSP etc..
|
Main Applications：
Antenna
(Automotive millimeter wave radar, Base station)
ICT
infrastructure equipment,
Measuring
instrument,
Super
computer,
Typical Value of R-5775：
|
Property
|
Units
|
Test Method
|
Condition
|
Typical Value
|
|
THERMAL
|
Glass Transition Temp ( Tg )
|
C
|
DSC
|
As received
|
185
|
|
|
DMA
|
As received
|
210
|
|
Thermal
Decomposition Temp
|
C
|
TGA
|
As received
|
410
|
|
Time to Delam (T288)
|
Without Cu
|
Min
|
IPC TM-650 2.4.24.1
|
As received
|
> 120
|
|
With Cu
|
Min
|
IPC TM-650 2.4.24.1
|
As received
|
> 120
|
|
CTE
: α1
|
X - axis ppm / C
|
ppm / C
|
IPC TM-650 2.4.24
|
< Tg
|
14 - 16
|
|
Y - axis ppm / C
|
ppm / C
|
IPC TM-650 2.4.24
|
< Tg
|
14 - 16
|
|
Z - axis ppm / C
|
ppm / C
|
IPC TM-650 2.4.24
|
< Tg
|
45
|
|
CTE : α2
|
Z - axis ppm / C
|
ppm / C
|
IPC TM-650 2.4.24
|
> Tg 260
|
260
|
|
ELECTRICAL
|
Volume Resistivity
|
MΩ - cm
|
IPC TM-650 2.5.17.1
|
C-96/35/90
|
1 x 109
|
|
Surface
Resistivity
|
MΩ
|
IPC TM-650 2.5.17.1
|
C-96/35/90
|
1 x 108
|
|
Dielectric Constant ( Dk )
|
@ 1GHz
|
/
|
IPC TM-650 2.5.5.9
|
C-24/23/50
|
3.71
|
|
@ 10GHz
|
/
|
IPC TM-650 2.5.5.5
|
C-24/23/50
|
3.61
|
|
Dissipation Factor ( Df )
|
@ 1GHz
|
/
|
IPC TM-650 2.5.5.9
|
C-24/23/50
|
0.002
|
|
@ 10GHz
|
/
|
IPC TM-650 2.5.5.5
|
C-24/23/50
|
0.004
|
|
PHYSICAL
|
Water Absorption
|
%
|
IPC TM-650 2.6.2.1
|
D-24/23
|
0.14
|
|
Peel Strength
|
1oz ( H-VLP )
|
kN / m
|
IPC TM-650 2.4.8
|
As Received 0.8
|
0.8
|
|
Flammability
|
/
|
UL
|
C-48/23/50
|
94V-0
|
Megtron 6 Material List in stock (as of
September 2021)：
|
Item
|
Thickness (mil)
|
Thickness(mm)
|
Structure
|
Copper weight(oz)
|
Type of copper
|
|
R5775G
|
2.0
|
0.050
|
1035*1
|
H/H
|
HVLP
|
|
R5775G
|
2.6
|
0.065
|
1080*1
|
H/H
|
HVLP
|
|
R5775G
|
3.0
|
0.075
|
1078*1
|
1.0/1.0
|
RTF
|
|
R5775G
|
3.0
|
0.075
|
1078*1
|
H/H
|
RTF
|
|
R5775G
|
3.0
|
0.075
|
1078*1
|
1.0/1.0
|
HVLP
|
|
R5775G
|
3.0
|
0.075
|
1078*1
|
H/H
|
HVLP
|
|
R5775G
|
3.9
|
0.100
|
3313*1
|
H/H
|
RTF
|
|
R5775G
|
3.9
|
0.100
|
3313*1
|
1.0/1.0
|
RTF
|
|
R5775G
|
5.9
|
0.150
|
1080*2
|
2.0/2.0
|
RTF
|
|
R5775G
|
9.8
|
0.250
|
2116*2
|
H/H
|
RTF
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
We
can provide you with prototypes, small batches and mass production PCB’s. Any
questions, please feel free to contact us.
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
