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Home Multilayer PCB Board M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc.

  • Item NO.:

    BIC-173-v37.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$1.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.


M6 High Speed PCB Board


Part Numbers:


Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)

Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670


Main Features:


Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)

Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)

Lead-free, ROHS-compliant soldering

High heat resistance

M6 also provides excellent high-density interconnect (HDI) and thermal performance.


M6 High Speed PCB


Our PCB Capabilities (Megtron 6):


PCB Material:

Low DK Glass Cloth

Designation:

Laminate R-5775(G), Prepreg R-5670(G)

Dielectric constant:

3.61 at 10GHz

Dissipation Factor

0.004 at 10GHz

Layer count:

Multilayer PCB, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..


Main Applications:


Antenna (Automotive millimeter wave radar, Base station)

ICT infrastructure equipment,

Measuring instrument,

Super computer,


Typical Value of R-5775:


Property Units Test Method Condition Typical Value
THERMAL Glass Transition Temp ( Tg ) C DSC As received 185
DMA As received 210
Thermal Decomposition Temp C TGA As received 410
Time to Delam (T288) Without Cu Min IPC TM-650 2.4.24.1 As received > 120
With Cu Min IPC TM-650 2.4.24.1 As received > 120
CTE : α1 X - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Y - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Z - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 45
CTE : α2 Z - axis ppm / C ppm / C IPC TM-650 2.4.24 > Tg 260 260
ELECTRICAL Volume Resistivity MΩ - cm IPC TM-650 2.5.17.1 C-96/35/90 1 x 109
Surface Resistivity MΩ IPC TM-650 2.5.17.1 C-96/35/90 1 x 108
Dielectric Constant ( Dk ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 3.71
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 3.61
Dissipation Factor ( Df ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 0.002
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 0.004
PHYSICAL Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1oz ( H-VLP ) kN / m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability / UL C-48/23/50 94V-0


Megtron 6 Material List in stock (as of September 2021):


Item

Thickness (mil)

Thickness(mm)

Structure

Copper weight(oz)

Type of copper

R5775G

2.0

0.050

1035*1

H/H

HVLP

R5775G

2.6

0.065

1080*1

H/H

HVLP

R5775G

3.0

0.075

1078*1

1.0/1.0

RTF

R5775G

3.0

0.075

1078*1

H/H

RTF

R5775G

3.0

0.075

1078*1

1.0/1.0

HVLP

R5775G

3.0

0.075

1078*1

H/H

HVLP

R5775G

3.9

0.100

3313*1

H/H

RTF

R5775G

3.9

0.100

3313*1

1.0/1.0

RTF

R5775G

5.9

0.150

1080*2

2.0/2.0

RTF

R5775G

9.8

0.250

2116*2

H/H

RTF



PCB MANUFACTURING PROCESS:



BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:



We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.



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IPv6 network supported

IPv6 network supported

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