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Home Multilayer PCB Board High Tg Lead Free Multi-layer PCB Built on TU-768 Core and TU-768P Prepreg

High Tg Lead Free Multi-layer PCB Built on TU-768 Core and TU-768P Prepreg

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process.

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  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
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    7-10 days
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High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

TU-768 / TU-768P laminate / prepreg, these products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

TU-768 PCB

Main Applications

Consumer Electronics

Server, workstation


Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

Our PCB Capability (TU-768)

PCB Material: High-Tg and High Thermal Reliability Epoxy Resin 
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

High Tg TU-768 PCB

Typical Properties of TU-768

Typical Values Conditioning IPC-4101 /126
Tg (DMA) 190°C
Tg (DSC) 180°C > 170°C
Tg (TMA) 170°C E-2/105
Td (TGA) 350°C > 340°C
CTE x-axis 11~15 ppm/°C N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70% < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min > 2 min
Flammability 94V-0 E-24/125 94V-0
Permittivity (RC 50%) @10GHz 4.3
Loss Tangent (RC 50%) @10GHz 0.018
Permittivity (RC50%)
1GHz (SPC method/4291B) 4.4 / 4.3 < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3 N/A
Loss Tangent (RC50%)
1GHz (SPC method/4291B) 0.019 /0.018 < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023 N/A
Volume Resistivity > 1010MΩ•cm C-96/35/90 > 106MΩ•cm
Surface Resistivity > 108MΩ C-96/35/90 > 104MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Young’s Modulus
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %


Process PTH PCB




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