High
Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P
Prepreg
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description
TU-768
/ TU-768P laminate / prepreg, these products are suitable for boards that need to survive severe
thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus
CAF resistance property.
Main
Applications
Consumer
Electronics
Server,
workstation
Automotive
Key
Features
Lead
Free process compatible
Excellent
coefficient of thermal expansion
Anti-CAF
property
Superior
chemical and thermal resistance
Fluorescence
for AOI
Moisture
resistance
Our
PCB Capability (TU-768)
|
PCB
Material:
|
High-Tg and
High Thermal Reliability Epoxy Resin
|
|
Designation:
|
TU-768
|
|
Dielectric constant:
|
4.3
|
|
Layer count:
|
Double
Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz
(17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm),
62mil(1.575mm)
|
|
PCB size:
|
≤400mm
X 500mm
|
|
Solder mask:
|
Green,
Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
|
|
Technology:
|
HDI,
Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA,
Countsunk Holes etc.
|
Typical
Properties of TU-768
|
|
Typical Values
|
Conditioning
|
IPC-4101 /126
|
|
Thermal
|
|
|
|
|
Tg
(DMA)
|
190°C
|
|
|
|
Tg
(DSC)
|
180°C
|
|
> 170°C
|
|
Tg
(TMA)
|
170°C
|
E-2/105
|
|
|
Td
(TGA)
|
350°C
|
|
> 340°C
|
|
CTE x-axis
|
11~15 ppm/°C
|
|
N/A
|
|
CTE
y-axis
|
11~15 ppm/°C
|
E-2/105
|
N/A
|
|
CTE
z-axis
|
2.70%
|
|
< 3.0%
|
|
Thermal Stress,Solder Float, 288°C
|
> 60 sec
|
A
|
> 10 sec
|
|
T260
|
> 60 min
|
|
> 30 min
|
|
T288
|
> 20 min
|
E-2/105
|
> 15 min
|
|
T300
|
> 2 min
|
|
> 2 min
|
|
Flammability
|
94V-0
|
E-24/125
|
94V-0
|
|
DK &
DF
|
|
|
|
|
Permittivity
(RC 50%) @10GHz
|
4.3
|
|
|
|
Loss
Tangent (RC 50%) @10GHz
|
0.018
|
|
|
|
Electrical
|
|
|
|
|
Permittivity
(RC50%)
|
|
|
|
|
1GHz
(SPC method/4291B)
|
4.4 / 4.3
|
|
< 5.2
|
|
5GHz
(SPC method)
|
4.3
|
E-2/105
|
N/A
|
|
10GHz
(SPC method)
|
4.3
|
|
N/A
|
|
Loss Tangent (RC50%)
|
|
|
|
|
1GHz
(SPC method/4291B)
|
0.019 /0.018
|
|
< 0.035
|
|
5GHz
(SPC method)
|
0.021
|
E-2/105
|
N/A
|
|
10GHz
(SPC method)
|
0.023
|
|
N/A
|
|
Volume Resistivity
|
> 1010MΩ•cm
|
C-96/35/90
|
> 106MΩ•cm
|
|
Surface
Resistivity
|
> 108MΩ
|
C-96/35/90
|
> 104MΩ
|
|
Electric
Strength
|
> 40 KV/mm
|
A
|
> 30 KV/mm
|
|
Dielectric
Breakdown
|
> 50 kV
|
A
|
> 40 KV
|
|
Mechanical
|
|
|
|
|
Young’s
Modulus
|
|
|
|
|
Warp
Direction
|
25 GPa
|
A
|
N/A
|
|
Fill
Direction
|
22 GPa
|
|
|
|
Flexural Strength
|
|
|
|
|
Lengthwise
|
> 60,000 psi
|
A
|
> 60,000 psi
|
|
Crosswise
|
> 50,000 psi
|
A
|
> 50,000 psi
|
|
Peel Strength, 1.0 oz RTF Cu foil
|
7~9 lb/in
|
A
|
> 4 lb/in
|
|
Water
Absorption
|
0.18%
|
E-1/105+D-24/23
|
< 0.8 %
|
MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
