4-Layer RT/duroid 5880 + High-TG FR-4 PPPCB Rogers Multilayer Board Immersion Silver
In high-frequency communication, aerospace, and military electronics, PCB performance is critical to system reliability.This 4-Layer RT/duroid 5880 PCB is tailored for high-frequency/broadband applications, leveraging duroid 5880 laminates’exceptional properties to deliver superior electrical uniformity, low signal loss, and strong environmental adaptability. Precision-manufactured to international standards, it is the ideal choice for mission-critical systems.
Core Material Advantage: RT/duroid 5880 Laminates
The Multilayer PCB is built on premium RT5880 substrates, optimized for high-frequency scenarios. This PTFE composite, reinforced with randomly oriented microfibers, ensures excellent dielectric constant (Dk) uniformity—key for signal integrity in broadband applications. With a Dk of 2.20 +/- 0.02 and ultra-low dissipation factor (0.0009 at 10GHz), it minimizes signal attenuation, enabling efficient transmission even at millimeter-wave frequencies.
Beyond electrical performance, Rogers 5880 offers isotropy and low moisture absorption, adapting to harsh environments. Resistant to etching/plating solvents and reagents, it maintains structural stability during manufacturing. As a well-established material, it provides the lowest electrical loss among reinforced PTFE options, ensuring reliable performance for high-demand applications.
PCB Construction Details
The table below summarizes key construction parameters, reflecting our commitment to precision and design compatibility.
|
Parameter
|
Specification
|
|
Layer Count
|
4 Layers
|
|
Base Material
|
RT/duroid 5880 + High-TG FR-4
|
|
Board Dimensions
|
126.0 mm x 63.0 mm
|
|
Min. Trace / Space
|
5 mil / 5 mil
|
|
Min. Finished Hole Size
|
0.20 mm
|
|
Via Pad Size
|
0.50 mm
|
|
Via Type
|
Through-Hole Only
|
|
Finished Board Thickness
|
0.833 mm
|
|
Finished Copper Weight
|
Outer: 1 oz (35 μm) / Inner: 0.5 oz (18 μm)
|
|
Surface Finish
|
Immersion Silver
|
|
Solder Mask (Both Sides)
|
Green
|
|
Silkscreen
|
None
|
PCB Stackup
The 4-layer PCB stackup is meticulously designed for enhanced electrical performance and structural stability. The table below details layer composition and thickness for consistent signal transmission and thermal management.
|
Layer
|
Material
|
Thickness
|
|
L1 (Top)
|
Copper
|
35 μm
|
|
RT/duroid 5880 Core
|
0.254 mm
|
|
|
L2 (Inner1)
|
Copper
|
18 μm
|
|
Prepreg 2116
|
0.120 mm
|
|
|
Prepreg 2116
|
0.120 mm
|
|
|
L3 (Inner2)
|
Copper
|
18 μm
|
|
RT/duroid 5880 Core
|
0.254 mm
|
|
|
L4 (Bottom)
|
Copper
|
35 μm
|
RT/duroid 5880 Date Sheet
|
RT/duroid 5880 Typical Value
|
|
Property
|
RT/duroid 5880
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
2.20
2.20±0.02 spec.
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.2
|
Z
|
N/A
|
8GHz to 40 GHz
|
Differential Phase Length Method
|
|
Dissipation Factor,tanδ
|
0.0004
0.0009
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Thermal Coefficient of ε
|
-125
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
2 x 107
|
Z
|
Mohm cm
|
C/96/35/90
|
ASTM D 257
|
|
Surface Resistivity
|
3 x 107
|
Z
|
Mohm
|
C/96/35/90
|
ASTM D 257
|
|
Specific Heat
|
0.96(0.23）
|
N/A
|
j/g/k
(cal/g/c)
|
N/A
|
Calculated
|
|
Tensile Modulus
|
Test at 23℃
|
Test at 100℃
|
N/A
|
MPa(kpsi)
|
A
|
ASTM D 638
|
|
1070(156)
|
450(65)
|
X
|
|
860(125)
|
380(55)
|
Y
|
|
Ultimate Stress
|
29(4.2)
|
20(2.9)
|
X
|
|
27(3.9）
|
18(2.6)
|
Y
|
|
Ultimate Strain
|
6
|
7.2
|
X
|
%
|
|
4.9
|
5.8
|
Y
|
|
Compressive Modulus
|
710(103)
|
500(73)
|
X
|
MPa(kpsi)
|
A
|
ASTM D 695
|
|
710(103)
|
500(73)
|
Y
|
|
940(136)
|
670(97)
|
Z
|
|
Ultimate Stress
|
27(3.9)
|
22(3.2)
|
X
|
|
29(5.3)
|
21(3.1)
|
Y
|
|
52(7.5)
|
43(6.3)
|
Z
|
|
Ultimate Strain
|
8.5
|
8.4
|
X
|
%
|
|
7.7
|
7.8
|
Y
|
|
12.5
|
17.6
|
Z
|
|
Moisture Absorption
|
0.02
|
N/A
|
%
|
0.62"(1.6mm) D48/50
|
ASTM D 570
|
|
Thermal Conductivity
|
0.2
|
Z
|
W/m/k
|
80℃
|
ASTM C 518
|
|
Coefficient of Thermal Expansion
|
31
48
237
|
X
Y
Z
|
ppm/℃
|
0-100℃
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
N/A
|
℃ TGA
|
N/A
|
ASTM D 3850
|
|
Density
|
2.2
|
N/A
|
gm/cm3
|
N/A
|
ASTM D 792
|
|
Copper Peel
|
31.2(5.5)
|
N/A
|
Pli(N/mm)
|
1oz(35mm)EDC foil
after solder float
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
N/A
|
N/A
|
N/A
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
N/A
|
N/A
|
N/A
|
N/A
|
Key Features & Core Benefits
Integrating advanced materials and precision design, the Rogers RT/duroid 5880 PCB delivers core benefits for critical applications:
- Uniform Electrical Performance: Low Dk and dissipation factor ensure consistent signal transmission across wide frequencies, reducing distortion and loss.
- Environmental Resilience: Low moisture absorption and solvent resistance suit high-moisture/harsh environments, ensuring long-term reliability.
- Easy Manufacturability: Easy to cut, shape, and machine, simplifying custom designs and shortening lead times.
- Structural Stability: Optimized stackup and quality copper layers enhance mechanical strength and thermal conductivity, preventing warpage.
- Proven Reliability: Industry-validated reinforced PTFE material with the lowest electrical loss in its class.
Typical Applications
Its high-frequency performance and environmental adaptability make it suitable for:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Military Radar Systems
- Missile Guidance Systems
- Point-to-Point Digital Radio Antennas
Quality Assurance & Global Availability
We adhere to IPC-Class-2 quality standards, with strict quality control from material sourcing to final inspection. Supporting Gerber RS-274-X artwork format for seamless design integration, we offer global supply to deliver this high-performance PCB to customers worldwide.
In summary,This 4-Layer RT/duroid 5880 multilayer PCB combines premium materials, precision manufacturing, and optimized design for high-reliability high-frequency/mission-critical applications. Ideal for aerospace, military, and commercial communication systems, it delivers exceptional signal integrity and long-term value.
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Email : info@bichengpcb.com
