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Home FR-4 PCB Board Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of mobile phone with blind via technology.

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  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
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    7-10 days
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Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description:

It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and Benefits :


1.2.1 Middle Tg FR-4 Shows low Z-CTE and excellent through hole reliability;

1.2.2 Immersion gold has high solderability, no stressing and less contamination;

1.2.3 Multilayer shortened connection between electronic components;

1.2.4 16000㎡workshop and 8000 types of PCB's per month;

1.2.5 Delivery on time: >98% 

1.2.6 No minimum order quantity. 1 piece is available;

Stack up 4 Layer Blind Via

1.3 Applications:

Industrial Computer   

GPS Tracking System

POS Cash Register

Embedded Systems

Data Acquisition System


PC and Notebook

1.4 Parameter and data sheet:

PCB SIZE 119 x 80mm=1PCS
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Core FR-4 0.61mm
copper ------- 35um(1oz) MidLayer 1
Prepreg 0.254mm
copper ------- 35um(1oz) MidLayer 2
Core FR-4 0.61mm
copper -------  18um(0.5oz)+plate BOT layer
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm /3.5 mm
Number of Different Holes: 9
Number of Drill Holes: 415
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy:  FR-4 Tg150℃, er<5.4.IT-158,  ITEQ
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  1.6mm ±0.16
Surface Finish Immersion Gold
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, stamp holes.
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm. Blind Via Top to Inner layer 1, Bottom to Inner layer 2
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

1.5 Composition of Holes:

The blind hole is located on the top and bottom surface of the printed circuit board and has a certain depth for the connection between the surface line and the inner line below. The depth of the hole usually does not exceed a certain ratio (aperture). Buried hole is a connecting hole located in the inner layer of the printed circuit board, which does not extend to the surface of the circuit board.

The above two kinds of holes are located in the inner layer of the circuit board. The formation of through hole process is used before lamination, and several inner layers may be overlapped done during the formation of the through hole.

The third is called a through hole, which passes through the entire circuit board. It can be used to interconnect internally or as an installation location hole for components. Because the through hole is easier to realize and the cost is low, it is used in most printed circuit boards instead of the other two. The following mentioned holes, without special instructions, are considered as through holes.

From the design point of view, a hole is mainly composed of two parts, one is the middle hole (drill hole), the other is the pad area around the hole, see below. The size of these two parts determines the size of the hole. Clearly, in

high-speed, high-density PCB design, designers always want the holes the smaller the better, so that it can leave more wiring space on the board.





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