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Home FR-4 PCB Board High CTI 600V PCB 2.0mm FR-4 With HASL and Countersunk Holes

High CTI 600V PCB 2.0mm FR-4 With HASL and Countersunk Holes

This is a type of single sided circuit board built on FR-4 substrate with CTI 600V.

  • Item NO.:

    BIC-499-v48.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Introduction:


It is a 2.0mm thick PCB with simple tracks, green solder mask and white silkscreen. The surface finish on pads is hot air leveling, lead free type. There are 3 countersunk holes aligned on a track. The panel contains 12 individual boards.


CTI 600V PCB Board


PCB Specifications:


Item  Description  Value
1. Laminate           Material Type FR-4 CTI 600V
Tg 135℃
Supplier KB
Thickness 1.9-2.0mm
2.Plating thickness       Hole Wall /
Outer copper 41.09µm
Inner Copper /
3.Solder mask                   Material Type TAIYO/ PSR-2000GT600D
Color  Green
Rigidity (Pencil Test) 5H
S/M Thickness 20.11µm
Location Both Sides
4. Component Mark    Material Type IJR-4000 MW300
Color White
Location C/S
6. Identification        UL Mark YES
Date Code 2121 
Mark Location Solder Side
7. Surface Finish Method HASL Lead free
Tin Thickness 6.57µm
8. Normativeness RoHS OK
REACH OK
9.Annular Ring  Min. Line Width (mil) 4.8mil
Min. Spacing (mil) 5.2mil
12. Function                 Electrical Test 100% PASS
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2
Visual Inspection IPC-A-600J &6012D Class 2
Warp and Twist 0.21%
14. Reliability Test Tape Test No Peeling
Solvent Test No Peeling
Solderability Test 265 ±5℃
Thermal Stress Test 288 ±5℃
Ionic Contamination Test 0.56µg/c㎡


Applications:


PDP, LCD , TV

Refrigerator

Power supplier

Washing machine



What is Comparative Tracking Index (CTI)?   

 

Here CTI is a quality item that refers to copper clad laminate which is widely used in home electrical appliance or other high-voltage (110V, 220V) electrical apparatus.It is a simulated condition that the PCB is polluted in its working environment, which result in leakage or short-circuit at the track gap of the PCB surface, being accompanied by heat releasing and charring.


CTI 600V PCB


The way of experiment is that continous 50 drops of 0.1% ammonium chloride solution are dropped between two points on the PCB surface,30 seconds per drop,turning on high voltage AC current to do the test. Firstly trying 300V to generate 1A current. There's ammonium chloride solution on the surface, so after current is switched on it will produce resistance who also bring out heat, then the solution is slowly evaporated. 2nd drop is on and till to 50 drops to see if the PCB has leakage or not. Once the PCB has 0.1A creepage and exceeds 0.5 seconds, it's judged Failure.


The quality of CTI of laminate refers to the externally applied voltage value and without failure of 50 drops. If abovementioned 300V passed, we can increase the voltage to 400V, 500V or 600V till to the high value before failure, that is the data of the laminite CTI.

Bicheng offers high CTI PCB's (high CTI 600V FR-4 and aluminum backed material) which is working in such harsh environment of high voltage, filth and humidity.


IEC 112 standard has 3 degrees as follows :

    

Comparative Tracking Index (in Volts)

Class

600 <= CTI

I

400 <= CTI < 600

II

175 <= CTI < 400

IIIA

100 <= CTI < 175

IIIB


As per the standard of IEC,the smaller a substrate of CTI grade, the better resistance to tracking. Normal FR-4 ranges 175-225V


Data Sheet of FR-4 with CTI 600V:


Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.25D DSC 135
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) 310
T288 IPC-TM-650 2.4.24.1 TMA min 2
T260 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288℃,solder dip s >100
IPC-TM-650 2.4.24 Before Tg ppm/℃ 55
CTE(Z-axis) IPC-TM-650 2.4.24 After Tg ppm/℃ 308
IPC-TM-650 2.4.24 50-260℃ % 4.5
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.5
Loss Tangent (1GHZ) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.017
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 5.0x108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 5.0x107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 126
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.8 [10.28]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 550/450
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.1
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 0 (>600V)
 


Bicheng PCB Capability (FR-4) 2022:


Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4 inclusive of Tg135℃, Tg150℃, High Tg 170℃, High CTI>600V etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--420µm (0.5oz - 12oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger


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