High CTI 600V PCB Built on 2.0mm FR-4
With HASL and Countersunk Holes
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Introduction:
It is a 2.0mm thick PCB with simple tracks, green solder mask and white
silkscreen. The surface finish on pads is hot air leveling, lead free type.
There are 3 countersunk holes aligned on a track. The panel contains 12
individual boards.
PCB
Specifications:
|
Item
|
Description
|
Value
|
|
1. Laminate
|
Material Type
|
FR-4 CTI 600V
|
|
Tg
|
135℃
|
|
Supplier
|
KB
|
|
Thickness
|
1.9-2.0mm
|
|
2.Plating thickness
|
Hole Wall
|
/
|
|
Outer copper
|
41.09µm
|
|
Inner Copper
|
/
|
|
3.Solder mask
|
Material Type
|
TAIYO/ PSR-2000GT600D
|
|
Color
|
Green
|
|
Rigidity (Pencil Test)
|
5H
|
|
S/M Thickness
|
20.11µm
|
|
Location
|
Both Sides
|
|
4. Component
Mark
|
Material Type
|
IJR-4000 MW300
|
|
Color
|
White
|
|
Location
|
C/S
|
|
6. Identification
|
UL Mark
|
YES
|
|
Date Code
|
2121
|
|
Mark Location
|
Solder Side
|
|
7. Surface Finish
|
Method
|
HASL Lead free
|
|
Tin Thickness
|
6.57µm
|
|
8. Normativeness
|
RoHS
|
OK
|
|
REACH
|
OK
|
|
9.Annular Ring
|
Min. Line Width (mil)
|
4.8mil
|
|
Min. Spacing (mil)
|
5.2mil
|
|
12.
Function
|
Electrical Test
|
100% PASS
|
|
13. Appearance
|
IPC Class Level
|
IPC-A-600J &6012D
Class 2
|
|
Visual Inspection
|
IPC-A-600J &6012D Class 2
|
|
Warp and Twist
|
0.21%
|
|
14. Reliability Test
|
Tape Test
|
No Peeling
|
|
Solvent Test
|
No Peeling
|
|
Solderability Test
|
265 ±5℃
|
|
Thermal Stress Test
|
288 ±5℃
|
|
Ionic Contamination Test
|
0.56µg/c㎡
|
Applications:
PDP,
LCD , TV
Refrigerator
Power
supplier
Washing
machine
What
is Comparative Tracking Index (CTI)?
Here CTI is a quality item that refers to copper clad laminate which is widely used
in home electrical appliance or other high-voltage (110V, 220V) electrical
apparatus.It is a simulated condition that the PCB is polluted in its working
environment, which result in leakage or short-circuit at the track gap of the
PCB surface, being accompanied by heat releasing and charring.
The
way of experiment is that continous 50 drops of 0.1% ammonium chloride solution
are dropped between two points on the PCB surface,30 seconds per drop,turning
on high voltage AC current to do the test. Firstly trying 300V to generate 1A
current. There's ammonium chloride solution on the surface, so after current is
switched on it will produce resistance who also bring out heat, then the
solution is slowly evaporated. 2nd drop is on and till to 50 drops to see if
the PCB has leakage or not. Once the PCB has 0.1A creepage and exceeds 0.5
seconds, it's judged Failure.
The
quality of CTI of laminate refers to the externally applied voltage value and
without failure of 50 drops. If abovementioned 300V passed, we can increase the
voltage to 400V, 500V or 600V till to the high value before failure, that is
the data of the laminite CTI.
Bicheng
offers high CTI PCB's (high CTI 600V FR-4 and aluminum backed material) which
is working in such harsh environment of high voltage, filth and humidity.
IEC
112 standard has 3 degrees as follows :
|
Comparative Tracking Index (in Volts)
|
Class
|
|
600 <= CTI
|
I
|
|
400 <= CTI < 600
|
II
|
|
175 <= CTI < 400
|
IIIA
|
|
100 <= CTI < 175
|
IIIB
|
As
per the standard of IEC,the smaller a substrate of CTI grade, the better
resistance to tracking. Normal FR-4 ranges 175-225V
Data
Sheet of FR-4 with CTI 600V:
|
Test
Items
|
Test Method
|
Test Condition
|
Unit
|
Typical Value
|
|
Tg
|
IPC-TM-650 2.4.25D
|
DSC
|
℃
|
135
|
|
Td
|
IPC-TM-650 2.4.24.6
|
TGA (5% W.L)
|
℃
|
310
|
|
T288
|
IPC-TM-650 2.4.24.1
|
TMA
|
min
|
2
|
|
T260
|
IPC-TM-650 2.4.24.1
|
TMA
|
min
|
15
|
|
Thermal
Stress
|
IPC-TM-650 2.4.13.1
|
288℃,solder dip
|
s
|
>100
|
|
|
IPC-TM-650 2.4.24
|
Before Tg
|
ppm/℃
|
55
|
|
CTE(Z-axis)
|
IPC-TM-650 2.4.24
|
After Tg
|
ppm/℃
|
308
|
|
|
IPC-TM-650 2.4.24
|
50-260℃
|
%
|
4.5
|
|
Permittivity
(1GHz)
|
IPC-TM-650 2.5.5.9
|
C-24/23/50
|
-
|
4.5
|
|
Loss
Tangent (1GHZ)
|
IPC-TM-650 2.5.5.9
|
C-24/23/50
|
-
|
0.017
|
|
Volume
Resistivity
|
IPC-TM-650 2.5.17.1
|
C-96/35/90
|
MΩ-cm
|
5.0x108
|
|
Surface
Resistivity
|
IPC-TM-650 2.5.17.1
|
C-96/35/90
|
MΩ
|
5.0x107
|
|
Arc
Resistance
|
IPC-TM-650 2.5.1
|
D-48/50+D-0.5/23
|
s
|
126
|
|
Dielectric
Breakdown
|
IPC-TM-650 2.5.6
|
D-48/50+D-0.5/23
|
kV
|
>45
|
|
Peel
Strength (1oz)
|
IPC-TM-650 2.4.8
|
288℃/10s
|
N/mm [lb/in]
|
1.8 [10.28]
|
|
Flexural
Strength (LW/CW)
|
IPC-TM-650 2.4.4
|
A
|
Mpa
|
550/450
|
|
Water
Absorption
|
IPC-TM-650 2.6.2.1
|
D-24/23
|
%
|
0.1
|
|
Flammability
|
UL94
|
C-48/23/50
|
Rating
|
V-0
|
|
CTI
|
IEC60112
|
A
|
Rating
|
PLC 0 (>600V)
|
|
|
|
|
|
|
Bicheng
PCB Capability (FR-4) 2022:
|
Parameter
|
Value
|
|
Layer Counts
|
1-32
|
|
Substrate Material
|
FR-4
inclusive of Tg135℃, Tg150℃, High Tg 170℃, High CTI>600V etc.
|
|
Maximum Size
|
Flying test: 900*600mm, Fixture
test 460*380mm, No test 1100*600mm
|
|
Board Outline Tolerance
|
±0.0059"
(0.15mm)
|
|
PCB Thickness
|
0.0157"
- 0.3937" (0.40mm--10.00mm)
|
|
Thickness Tolerance(T≥0.8mm)
|
±8%
|
|
Thickness Tolerance(t＜0.8mm)
|
±10%
|
|
Insulation Layer Thickness
|
0.00295"
- 0.1969" (0.075mm--5.00mm)
|
|
Minimum Track
|
0.003"
(0.075mm)
|
|
Minimum Space
|
0.003" (0.075mm)
|
|
Outer Copper Thickness
|
35µm--420µm (1oz-12oz)
|
|
Inner Copper Thickness
|
17µm--420µm (0.5oz - 12oz)
|
|
Drill Hole(Mechanical)
|
0.0059"
- 0.25" (0.15mm--6.35mm)
|
|
Finished Hole(Mechanical)
|
0.0039"-0.248"
(0.10mm--6.30mm)
|
|
DiameterTolerance(Mechanical)
|
0.00295"
(0.075mm)
|
|
Registration (Mechanical)
|
0.00197"
(0.05mm)
|
|
Aspect Ratio
|
12:1
|
|
Solder Mask Type
|
LPI
|
|
Min Soldermask Bridge
|
0.00315"
(0.08mm)
|
|
Min Soldermask Clearance
|
0.00197"
(0.05mm)
|
|
Plug via Diameter
|
0.0098"
- 0.0236" (0.25mm--0.60mm)
|
|
Impedance Control Tolerance
|
±10%
|
|
Surface Finish
|
HASL,HASL
LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
|
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