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Home FR-4 PCB Board High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided PCB

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided PCB

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. 

  • Item NO.:

    BIC-507-v83.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.


Applications


Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications


2-Layer IT-180 PCB


PCB Parameters


Item  Description  Requirement Actual Result
1. Laminate           Material Type  FR-4 IT-180ATC FR-4 IT-180ATC ACC
Tg 170℃ 170℃ ACC
Supplier ITEQ ITEQ ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness       Hole Wall ≥25µm 26.51µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper
3.Solder mask                   Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color  Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark    Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask  Material Type
Thickness
Location
6. Identification        UL Mark  YES YES ACC
Date Code WWYY 2121  ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness
Nickel Thickness 3-6µm 4.06µm ACC
Gold Thickness 0.05µm 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring  Min. Line Width (mil) 5mil 4.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove  Angle 30º 30º ACC
Residual thickness 0.4±0.1mm 0.43mm ACC
11. Beveling  Angle
Height
12. Function                 Electrical Test 100% PASS 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦1.56µg/c㎡ 0.56µg/c㎡ ACC


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05


Hole Code PTH Required Actual value Result
1 Y 0.400 0.400 0.425 0.425 0.400 ACC
2 Y 0.450 0.450 0.500 0.475 0.450 ACC
3 Y 0.600 0.600 0.650 0.625 0.600 ACC
4 Y 0.725 0.750 0.775 0.775 0.750 ACC
5 Y 0.850 0.850 0.825 0.850 0.825 ACC



MANUFACTURING PROCESS:


Process PTH PCB


BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



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