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This is a type of standard double sided high
temperature PCB which is built on ITEQ’s IT-180ATC laminate.
Item NO.:
BIC-507-v83.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysHigh Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.
Applications
Automotive (Engine room ECU)
Backplanes
Data Storage
Server and Networking
Telecommunications
PCB Parameters
Item | Description | Requirement | Actual | Result |
1. Laminate | Material Type | FR-4 IT-180ATC | FR-4 IT-180ATC | ACC |
Tg | 170℃ | 170℃ | ACC | |
Supplier | ITEQ | ITEQ | ACC | |
Thickness | 1.6±10% mm | 1.63-1.68mm | ACC | |
2.Plating thickness | Hole Wall | ≥25µm | 26.51µm | ACC |
Outer copper | 35µm | 41.09µm | ACC | |
Inner Copper | ||||
3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | TAIYO/ PSR-2000GT600D | ACC |
Color | Green | Green | ACC | |
Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
S/M Thickness | ≥10 µm | 20.11µm | ACC | |
Location | Both Sides | Both Sides | ACC | |
4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC |
Color | White | White | ACC | |
Location | C/S | C/S | ACC | |
5. Peelable Solder Mask | Material Type | |||
Thickness | ||||
Location | ||||
6. Identification | UL Mark | YES | YES | ACC |
Date Code | WWYY | 2121 | ACC | |
Mark Location | Solder Side | Solder Side | ACC | |
7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC |
Tin Thickness | ||||
Nickel Thickness | 3-6µm | 4.06µm | ACC | |
Gold Thickness | 0.05µm | 0.056µm | ACC | |
8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC |
REACH | Directive 1907 /2006 | OK | ACC | |
9.Annular Ring | Min. Line Width (mil) | 5mil | 4.8mil | ACC |
Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
10.V-groove | Angle | 30º | 30º | ACC |
Residual thickness | 0.4±0.1mm | 0.43mm | ACC | |
11. Beveling | Angle | |||
Height | ||||
12. Function | Electrical Test | 100% PASS | 100% PASS | ACC |
13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC |
Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
Warp and Twist | ≦0.7% | 0.21% | ACC | |
14. Reliability Test | Tape Test | No Peeling | OK | ACC |
Solvent Test | No Peeling | OK | ACC | |
Solderability Test | 265 ±5℃ | OK | ACC | |
Thermal Stress Test | 288 ±5℃ | OK | ACC | |
Ionic Contamination Test | ≦1.56µg/c㎡ | 0.56µg/c㎡ | ACC |
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
Hole Code | PTH | Required | Actual value | Result | |||
1 | Y | 0.400 | 0.400 | 0.425 | 0.425 | 0.400 | ACC |
2 | Y | 0.450 | 0.450 | 0.500 | 0.475 | 0.450 | ACC |
3 | Y | 0.600 | 0.600 | 0.650 | 0.625 | 0.600 | ACC |
4 | Y | 0.725 | 0.750 | 0.775 | 0.775 | 0.750 | ACC |
5 | Y | 0.850 | 0.850 | 0.825 | 0.850 | 0.825 | ACC |
MANUFACTURING PROCESS:
BICHENG MAIN COURIERS:
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Low Dk / Df FR-4 High Thermal Reliability Printed Circuit Board TU-872 Multilayer PCBNext:
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