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Home FR-4 PCB Board Impedance Controlled 12 Layers High Tg HDI Multilayer FR-4 PCB Board

Impedance Controlled 12 Layers High Tg HDI Multilayer FR-4 PCB Board

This is a type of impedance controlled PCB built on FR-4 material with Tg 175°C for the application of Signal transmission.



  • Item NO.:

    BIC-476-v74.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's a 12-layer board with 2.0 mm thick. It contains 2+N+2 HDI vias (see the stackup & vias). White silkscreens (Taiyo) are on green solder mask (Taiyo) and immersion gold on pads. Both Signal trace impedance and differential pairs impedance are controlled on layers. See the drawing below. The base material is from ITEQ. Entire panel is supplying with single up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.


Signal Trace Impedance Control
Trace Layer Trace Width (mil) Trace Impedance (Ohm) Precision Reference Layer
Top Layer 4 50 ±10% Mid-Layer 1
L03, Mid-Layer 2 4 50 ±10% Mid-Layer 1
L10, Mid-Layer 9 4 50 ±10% Mid-Layer 7,           Mid-Layer 10
Bottom Layer 4 50 ±10% Mid-Layer 10
Differential Pairs Impedance Control
Layer Trace Width / Space (Mil) Trace Impedance (Ohm) Precision Frequency (MHz)
Top Layer 3.1 / 5.5 100 ±10% Mid-Layer 1
Top Layer 4.0 / 5.1 90 ±10% Mid-Layer 1
L03, Mid-Layer 2 3.1 / 5.9 100 ±10% Mid-Layer 1,           Mid-Layer 4
L06, Mid-Layer 5 4.0 / 7.4 100 ±10% Mid-Layer 4,            Mid-Layer 6
L06, Mid-Layer 5 4.0 / 4.7 90 ±10% Mid-Layer 4,           Mid-Layer 6
L07, ,Mid-Layer 6 4.0 / 7.4 100 ±10% Mid-Layer 5,           Mid-Layer 7
L07, ,Mid-Layer 6 4.0 / 4.7 90 ±10% Mid-Layer 5,            Mid-Layer 7
L10, Mid-Layer 9 3.1 / 5.9 100 ±10% Mid-Layer 7,           Mid-Layer 10
Bottom Layer 4.0 / 5.5 100 ±10% Mid-Layer 10
Bottom Layer 4.0 / 5.1 90 ±10% Mid-Layer 10


1.2 Features and benefits  

   

Lead free assemblies with a maximum reflow temperature of 260℃.

Long storage time ( It can be stored for more than 1 year in vacuum bag)

Improved the speed of signal transmission

PCB manufacturing on required specifications.

Quick and on-time delivery

UL recognized and RoHS Directive-compliant

Prototype PCB capability


12-layer Impedance PCB


1.3 Applications


Dsl Modem

Solar Battery Charger

Vehicle Tracker

GPS Receiver

Wi Fi Antenna

Bluetooth USB Hub

USB Wireless Router

SMS Modem

Multicoupler Antenna

Phone systems


1.4 Parameter and data sheet


PCB SIZE 257 x 171.5mm=1PCS=1design
BOARD TYPE Multilayer PCB
Number of Layers 12 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- TOP   17um(1oz)+plate 25um
130 um prepreg 1080 x 2
copper ------- L02   32um(1oz)
150um core FR-4
copper ------- L03   18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L04   18um(0.5oz)
150um core FR-4
copper ------- L05   18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L06   18um(0.5oz)
813um core FR-4
copper ------- L07   18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L08   18um(0.5oz)
150um core FR-4
copper ------- L09   18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L10   18um(0.5oz)
150um core FR-4
copper ------- L11   35um(1oz)
130 um prepreg 1080 x 2
copper ------- BOT   17um(0.5oz)+plate 25um
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.25 mm / 3.0 mm
Number of Different Holes: 26
Number of Drill Holes: 4013
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control Single Signal Impedance and Differential Pairs Impedance
BOARD MATERIAL
Glass Epoxy:  FR-4, ITEQ IT-180, Tg>175℃, er<5.4
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  2.0mm ±10%
PLATING AND COATING
Surface Finish Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo supplied. 
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH),  via tented. Vin in pad under BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


12-layer stackup & vias


1.5 Impedance PCB and Impedance Match


The characteristic impedance of the conductor on the printed circuit board is an important indicator of the circuit design, especially in the PCB design of high frequency circuit. Whether the characteristic impedance of the conductor is consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two concepts in reliability design of PCB design must be paid attention.

      

There will be a variety of signal transmission in the conductor of circuit board. To increase the rate of transmission, it must increase its frequency. Due to the factors of the circuit itself such as etching, stack thickness, track width and so on are different, it will cause changes of the impedance value, resulting in its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as the "impedance control". The factors that affect the impedance of the PCB wiring are mainly the width of the copper track, the thickness of the copper track, the dielectric constant of the dielectric, the thickness of the dielectric, the thickness of the pad, the path of the ground layer, the wires around the wiring, etc. So the impedance of the wiring on the board must be controlled in the design of the PCB to avoid signal reflection and other electromagnetic interference and signal integrity issues as far as possible, to guarantee the stability of the actual use of the PCB board. You can refer to the corresponding empirical formula for the calculation method of micro-strip line and strip line impedance on PCB board.



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