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Home FR-4 PCB Board Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

This is a type of heavy copper PCB built on FR-4 substrate with Tg 135°C for the application of UPS systems. 



  • Item NO.:

    BIC-456-v91.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and HASL on pads. The base material is from ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.


1.2 Features and benefits


1. It's Lead free compatible.

2. Excellent wetting during component soldering and it can avoid copper corrosion.

3. Better heat dissipation of high heat generated by large current

4. UL, ISO14001, IATF16949 certified

5. Reliability test, insulation resistance test and ionic contamination test

6. Quick Lead time: 3-5 days

7. Customer complaint rate: <1%


Heavy Copper PCB


1.3 PCB Specifications


PCB SIZE 97 x 99 mm=1PCS
BOARD TYPE Double Sided PCB
Number of Layers 2 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 105 um (3 oz)
FR-4 1.5 mm
copper ------- 105 um (3 oz)
TECHNOLOGY
Minimum Trace and Space: 12 mil / 8 mil
Minimum / Maximum Holes: 0.65mm / 3.175mm
Number of Different Holes: 9
Number of Drill Holes: 87
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: 0
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  FR-4 Tg 135℃, er<5.4.IT-140,  ITEQ 
Final foil external:  3 oz
Final foil internal:  3 oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING
Surface Finish HASL 6.25um
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA plated through hole(PTH)
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


1.4 Applications


Power Inverters

AC to DC Power Converter

UPS Uninterruptible Power Supply

RACk Mount Power Supply

Cosel Power Supply

AC/DC Switching Power Supply

Power Supply Inverter

HVAC systems

DC To DC Converters

5000 Watt Inverter


1.5 Heavy Copper


Generally, the PCB copper foil with a nominal thickness of 105 μm or over is collectively referred to as a thick copper foil (including the surface-treated electrolytic copper foil and rolled copper foil). The PCB and copper foil manufacturing industry domestically and abroad are more accustomed to specifically divide the thick copper foil into three varieties based on its nominal thickness, the one with thickness of 105μm (≥ 3oz) ~ 240μm or over is called thick copper foil; the one with thickness of 300μm or over is called super-thick copper foil; the one with thickness of 600μm and above is referred to as super MAX copper foil.


The thick copper foil and super-thick copper foilbelong to a kind of special PCB copper foil. In addition to its conventional electrolytic copper foil (or rolled copper foil) performance, it also has such special performance as the conducting layer of high current board or the inner core cooling metal layer of the high-current PCB, and other special performance requirements. These special performance requirements are to meet the application conditions, processing conditions and other aspects from its downstream products. The application performance requirements of it is mostly expressed in the characteristics that the conducting circuit of thick copper can stably carry high current, and can better distribute high heat generated by the loaded high current in a substrate.


In recent years, with the expansion of application field of heavy copper printed circuit board, and the increase of production and sales, the production and sales of thick copper foil has also been significantly improved. According to statistics, its production and sales have accounted for 5 ~ 6% of the world's production and sales of electronic copper foil, which is 17,000 ~ 20,000 tons / year.


1.6 More Displays of Heavy Copper PCB


More Heavy Copper PCB

More Heavy Copper PCB

More Heavy Copper PCB

More Heavy Copper PCB

More Heavy Copper PCB



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