
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
TU-872 SLK Sp is based on a high performance
modified epoxy FR-4 resin. This material is reinforced with novel woven glass
and designed with extra low dielectric constant and low dissipation factor for
high speed low loss and high frequency circuit board application.
Item NO.:
BIC-500-v76.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysLow Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.
Key Features
1. Excellent electrical properties
2. Dielectric constant less than 3.5
3. Dissipation factor less than 0.010
4. Excellent, stable and flat Dk/Df performance
5. Compatible with most FR-4 processes
6. Lead free process compatible
7. Improved z-axis thermal expansion
8. Anti-CAF capability
9. Superior dimensional stability, thickness uniformity and flatness
10. Excellent through-hole and soldering reliability
Our PCB Capabilities (TU-872 SLK Sp)
PCB Material: | High performance modified epoxy FR-4 resin |
Designation: | TU-872 SLK Sp |
Dielectric constant: | < 3.5 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Main Applications
1. Radio Frequency
2. Backpanel, High performance computing
3. Line cards, Storage
4. Servers, Telecom, Base station
5. Office Routers
Our Advantages
ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡workshop;
30000㎡output capability per month;
Prototype to large volume production capability
IPC Class 2 / IPC Class 3;
Any layer HDI PCBs;
Delivery on time: >98%
Customer complaint rate: <1%
Typical Properties (TU-872 SLK Sp)
Typical Properties for TU-872 SLK Sp Laminate | |||
Typical Values | Conditioning | IPC-4101 /126 | |
Thermal | |||
Tg (DMA) | 220°C | ||
Tg (DSC) | 200°C | > 170°C | |
Tg (TMA) | 190°C | E-2/105 | |
Td (TGA) | 340°C | > 340°C | |
CTE x-axis | 12~15 ppm/°C | N/A | |
CTE y-axis | 12~15 ppm/°C | E-2/105 | N/A |
CTE z-axis | 2.30% | < 3.0% | |
Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
T260 | 60 min | > 30 min | |
T288 | 20 min | E-2/105 | > 15 min |
T300 | 5 min | > 2 min | |
Flammability | 94V-0 | E-24/125 | 94V-0 |
DK & DF | |||
Permittivity (RC 50%) @10GHz | 3.5 | ||
Loss Tangent (RC 50%) @10GHz | 0.008 | ||
Electrical | |||
Permittivity (RC50%) | |||
1GHz (SPC method/4291B) | 3.6/3.4 | < 5.2 | |
5GHz (SPC method) | 3.5 | E-2/105 | - |
10GHz (SPC method) | 3.5 | - | |
Loss Tangent (RC50%) | |||
1GHz (SPC method/4291B) | 0.006/0.004 | ||
5GHz (SPC method) | 0.007 | E-2/105 | < 0.035 |
10GHz (SPC method) | 0.008 | ||
Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
Electric Strength | > 40 KV/mm | A | > 30 kV/mm |
Dielectric Breakdown | > 50 kV | A | N/A |
Mechanical | |||
Young’s Modulus | |||
Warp Direction | 26 GPa | A | N/A |
Fill Direction | 24 GPa | ||
Flexural Strength | |||
Lengthwise | > 60,000 psi | A | > 60,000 psi |
Crosswise | > 50,000 psi | A | > 50,000 psi |
Peel Strength, 1.0 oz RTF Cu foil | 4~7 lb/in | A | > 4 lb/in |
Water Absorption | 0.13% | E-1/105+D-24/23 | < 0.5 % |
MANUFACTURING PROCESS:
BICHENG MAIN COURIERS:
Previous:
Impedance Controlled 12 Layers High Tg HDI Multilayer FR-4 PCB BoardNext:
High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided PCBIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rogers DiClad 880 High Frequency PCB Double Layer 20mil 0.508mm With Immersion Gold
Rogers DiClad 880 High Frequency PCB 20mil 30mil 60mil with Gold, Tin and Silver
Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper
AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil Thickness With Immersion Gold, Immersion Silver
TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness High Frequency PCB with Immersion Silver
Rogers TMM13i High Frequency 15mil 20mil 25mil 60mil High DK 12.85 RF PCB Immersion Gold
Rogers 5880LZ High Frequency RT/duroid 5880LZ 50mil 1.27mm 2-Layer Immersion Gold PCB
Rogers RT/duroid 5880LZ High Frequency PCB 10mil 20mil 50mil 100mil RT5880LZ PCB
© Copyright: 2022 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported