Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home FR-4 PCB Board Low Dk / Df FR-4 High Thermal Reliability Printed Circuit Board TU-872 Multilayer PCB

Low Dk / Df FR-4 High Thermal Reliability Printed Circuit Board TU-872 Multilayer PCB

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. 


  • Item NO.:

    BIC-500-v76.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description


TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.


TU-872 SKL Sp PCB


Key Features


1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability


Our PCB Capabilities (TU-872 SLK Sp)


PCB Material: High performance modified epoxy FR-4 resin
Designation: TU-872 SLK Sp
Dielectric constant: < 3.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.


Main Applications


1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers


Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡workshop;

30000㎡output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98% 

Customer complaint rate: <1%


Typical Properties (TU-872 SLK Sp)


Typical Properties for TU-872 SLK Sp Laminate
Typical Values Conditioning IPC-4101 /126
Thermal
Tg (DMA) 220°C
Tg (DSC) 200°C > 170°C
Tg (TMA) 190°C E-2/105
Td (TGA) 340°C > 340°C
CTE x-axis 12~15 ppm/°C N/A
CTE y-axis 12~15 ppm/°C E-2/105 N/A
CTE z-axis 2.30% < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 60 min > 30 min
T288 20 min E-2/105 > 15 min
T300 5 min > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF
Permittivity (RC 50%) @10GHz 3.5
Loss Tangent (RC 50%) @10GHz 0.008
Electrical
Permittivity (RC50%)
1GHz (SPC method/4291B) 3.6/3.4 < 5.2
5GHz (SPC method) 3.5 E-2/105 -
10GHz (SPC method) 3.5 -
Loss Tangent (RC50%)
1GHz (SPC method/4291B) 0.006/0.004
5GHz (SPC method) 0.007 E-2/105 < 0.035
10GHz (SPC method) 0.008
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 kV/mm
Dielectric Breakdown > 50 kV A N/A
Mechanical
Young’s Modulus
Warp Direction 26 GPa A N/A
Fill Direction 24 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 4~7 lb/in A > 4 lb/in
Water Absorption 0.13% E-1/105+D-24/23 < 0.5 %


MANUFACTURING PROCESS:


Process PTH PCB


BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
High CTI 600V FR-4 PCB
High CTI 600V PCB 2.0mm FR-4 With HASL and Countersunk Holes

This is a type of single sided circuit board built on FR-4 substrate with CTI 600V.

Thin 0.2mm FR-4 PCB
Thin PCB 0.2mm FR-4 Printed Circuit Board with White Solder Mask OSP

It’s a very simple board with white solder mask and OSP on pads.

Blind Via FR-4 Tg150℃ PCB
Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of mobile phone with blind via technology.

FR-4 Impedance Controlled 12 Layers PCB
Impedance Controlled 12 Layers High Tg HDI Multilayer FR-4 PCB Board

This is a type of impedance controlled PCB built on FR-4 material with Tg 175°C for the application of Signal transmission.

High Tg FR-4 Double Sided PCB
High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided PCB

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. 

Edge Castellated Half Holes Circuit Boards
Edge Castellated PCB Half Holes Circuit Boards 1.6mm FR-4 With Blue Solder Mask

This is a type of multi-layer PCB built on FR-4 substrate with Tg 135°C for the application of digital receivers.

RT/duroid 6035HTC
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCB

RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

TC350 RF PCB
TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

© Copyright: 2021 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #