Low
Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872
Multilayer PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description
TU-872 SLK Sp material is suitable for environmental
protection lead free process and also compatible with FR-4 processes. TU-872
SLK Sp laminates also exhibit excellent CTE, superior chemical resistance,
moisture resistance, thermal stability, CAF resistance and toughness enhanced
by an allyl network forming compound.
Key
Features
1.
Excellent electrical properties
2.
Dielectric constant less than 3.5
3.
Dissipation factor less than 0.010
4.
Excellent, stable and flat Dk/Df performance
5.
Compatible with most FR-4 processes
6.
Lead free process compatible
7.
Improved z-axis thermal expansion
8.
Anti-CAF capability
9.
Superior dimensional stability, thickness uniformity and flatness
10.
Excellent through-hole and soldering reliability
Our
PCB Capabilities (TU-872 SLK Sp)
|
PCB
Material:
|
High
performance modified epoxy FR-4 resin
|
|
Designation:
|
TU-872
SLK Sp
|
|
Dielectric constant:
|
<
3.5
|
|
Layer count:
|
Double
Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz
(17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm),
60mil(1.524mm)
|
|
PCB size:
|
≤400mm
X 500mm
|
|
Solder mask:
|
Green,
Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
|
|
Technology:
|
HDI,
Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA,
Countsunk Holes etc.
|
Main
Applications
1.
Radio Frequency
2.
Backpanel, High performance computing
3.
Line cards, Storage
4.
Servers, Telecom, Base station
5.
Office Routers
Our
Advantages
ISO9001,
ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡workshop;
30000㎡output capability per month;
Prototype
to large volume production capability
IPC
Class 2 / IPC Class 3;
Any
layer HDI PCBs;
Delivery
on time: >98%
Customer
complaint rate: <1%
Typical
Properties (TU-872 SLK Sp)
|
Typical
Properties for TU-872 SLK Sp Laminate
|
|
|
Typical Values
|
Conditioning
|
IPC-4101 /126
|
|
Thermal
|
|
|
|
|
Tg
(DMA)
|
220°C
|
|
|
|
Tg
(DSC)
|
200°C
|
|
> 170°C
|
|
Tg
(TMA)
|
190°C
|
E-2/105
|
|
|
Td
(TGA)
|
340°C
|
|
> 340°C
|
|
CTE x-axis
|
12~15 ppm/°C
|
|
N/A
|
|
CTE
y-axis
|
12~15 ppm/°C
|
E-2/105
|
N/A
|
|
CTE
z-axis
|
2.30%
|
|
< 3.0%
|
|
Thermal Stress,Solder Float, 288°C
|
> 60 sec
|
A
|
> 10 sec
|
|
T260
|
60 min
|
|
> 30 min
|
|
T288
|
20 min
|
E-2/105
|
> 15 min
|
|
T300
|
5 min
|
|
> 2 min
|
|
Flammability
|
94V-0
|
E-24/125
|
94V-0
|
|
DK &
DF
|
|
|
|
|
Permittivity
(RC 50%) @10GHz
|
3.5
|
|
|
|
Loss
Tangent (RC 50%) @10GHz
|
0.008
|
|
|
|
Electrical
|
|
|
|
|
Permittivity
(RC50%)
|
|
|
|
|
1GHz
(SPC method/4291B)
|
3.6/3.4
|
|
< 5.2
|
|
5GHz
(SPC method)
|
3.5
|
E-2/105
|
-
|
|
10GHz
(SPC method)
|
3.5
|
|
-
|
|
Loss Tangent (RC50%)
|
|
|
|
|
1GHz
(SPC method/4291B)
|
0.006/0.004
|
|
|
|
5GHz
(SPC method)
|
0.007
|
E-2/105
|
< 0.035
|
|
10GHz
(SPC method)
|
0.008
|
|
|
|
Volume Resistivity
|
> 1010 MΩ•cm
|
C-96/35/90
|
> 106 MΩ•cm
|
|
Surface
Resistivity
|
> 108 MΩ
|
C-96/35/90
|
> 104 MΩ
|
|
Electric
Strength
|
> 40 KV/mm
|
A
|
> 30 kV/mm
|
|
Dielectric
Breakdown
|
> 50 kV
|
A
|
N/A
|
|
Mechanical
|
|
|
|
|
Young’s
Modulus
|
|
|
|
|
Warp
Direction
|
26 GPa
|
A
|
N/A
|
|
Fill
Direction
|
24 GPa
|
|
|
|
Flexural Strength
|
|
|
|
|
Lengthwise
|
> 60,000 psi
|
A
|
> 60,000 psi
|
|
Crosswise
|
> 50,000 psi
|
A
|
> 50,000 psi
|
|
Peel Strength, 1.0 oz RTF Cu foil
|
4~7 lb/in
|
A
|
> 4 lb/in
|
|
Water
Absorption
|
0.13%
|
E-1/105+D-24/23
|
< 0.5 %
|
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