
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
TU-872 SLK Sp is based on a high performance
modified epoxy FR-4 resin. This material is reinforced with novel woven glass
and designed with extra low dielectric constant and low dissipation factor for
high speed low loss and high frequency circuit board application.
Item NO.:
BIC-500-v76.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysLow Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.
Key Features
1. Excellent electrical properties
2. Dielectric constant less than 3.5
3. Dissipation factor less than 0.010
4. Excellent, stable and flat Dk/Df performance
5. Compatible with most FR-4 processes
6. Lead free process compatible
7. Improved z-axis thermal expansion
8. Anti-CAF capability
9. Superior dimensional stability, thickness uniformity and flatness
10. Excellent through-hole and soldering reliability
Our PCB Capabilities (TU-872 SLK Sp)
PCB Material: | High performance modified epoxy FR-4 resin |
Designation: | TU-872 SLK Sp |
Dielectric constant: | < 3.5 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Main Applications
1. Radio Frequency
2. Backpanel, High performance computing
3. Line cards, Storage
4. Servers, Telecom, Base station
5. Office Routers
Our Advantages
ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡workshop;
30000㎡output capability per month;
Prototype to large volume production capability
IPC Class 2 / IPC Class 3;
Any layer HDI PCBs;
Delivery on time: >98%
Customer complaint rate: <1%
Typical Properties (TU-872 SLK Sp)
Typical Properties for TU-872 SLK Sp Laminate | |||
Typical Values | Conditioning | IPC-4101 /126 | |
Thermal | |||
Tg (DMA) | 220°C | ||
Tg (DSC) | 200°C | > 170°C | |
Tg (TMA) | 190°C | E-2/105 | |
Td (TGA) | 340°C | > 340°C | |
CTE x-axis | 12~15 ppm/°C | N/A | |
CTE y-axis | 12~15 ppm/°C | E-2/105 | N/A |
CTE z-axis | 2.30% | < 3.0% | |
Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
T260 | 60 min | > 30 min | |
T288 | 20 min | E-2/105 | > 15 min |
T300 | 5 min | > 2 min | |
Flammability | 94V-0 | E-24/125 | 94V-0 |
DK & DF | |||
Permittivity (RC 50%) @10GHz | 3.5 | ||
Loss Tangent (RC 50%) @10GHz | 0.008 | ||
Electrical | |||
Permittivity (RC50%) | |||
1GHz (SPC method/4291B) | 3.6/3.4 | < 5.2 | |
5GHz (SPC method) | 3.5 | E-2/105 | - |
10GHz (SPC method) | 3.5 | - | |
Loss Tangent (RC50%) | |||
1GHz (SPC method/4291B) | 0.006/0.004 | ||
5GHz (SPC method) | 0.007 | E-2/105 | < 0.035 |
10GHz (SPC method) | 0.008 | ||
Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
Electric Strength | > 40 KV/mm | A | > 30 kV/mm |
Dielectric Breakdown | > 50 kV | A | N/A |
Mechanical | |||
Young’s Modulus | |||
Warp Direction | 26 GPa | A | N/A |
Fill Direction | 24 GPa | ||
Flexural Strength | |||
Lengthwise | > 60,000 psi | A | > 60,000 psi |
Crosswise | > 50,000 psi | A | > 50,000 psi |
Peel Strength, 1.0 oz RTF Cu foil | 4~7 lb/in | A | > 4 lb/in |
Water Absorption | 0.13% | E-1/105+D-24/23 | < 0.5 % |
MANUFACTURING PROCESS:
BICHENG MAIN COURIERS:
Previous:
Impedance Controlled 12 Layers High Tg HDI Multilayer FR-4 PCB BoardNext:
High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided PCBIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rogers 40mil CLTE-XT 1.016mm High Frequency PCB CLTE Woven Glass Reinforced PTFE Microwave PCB
Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
Microwave RF PCB Rogers 20mil 30mil 60mil AD250C Antenna Material Dielectric Constant (DK) of 2.50
IsoClad 917 High Frequency PCB on 20mil (0.508mm) Substrate with Immersion Gold and Green Solder Mask
High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials
Hybrid PCB Built on SCGA-500 GF265 High Frequency Material and High Tg FR-4 With Immersion Gold
High Frequency PCB Built on Shengyi SCGA-500 GF265 PTFE Glass Reinforced RF Circuit Materials
Rogers DiClad 880 High Frequency PCB Double Layer 20mil 0.508mm With Immersion Gold
© Copyright: 2023 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported