TP2000 PCB TP Series 6mm Wangling DK20 Substrate Pure Gold Bare Copper

TP2000 PCB TP Series 6mm Wangling DK20 Substrate Pure Gold Bare Copper

TP2000 PCB 6mm Pure Gold, a high-performance 2-layer rigid printed circuit board purpose-built for extreme RF, microwave, aerospace, radar, and satellite communication systems. It combines ultra-high dielectric constant, ultra-low loss, exceptional thermal stability, and robust mechanical integrity in a thick-core, high-reliability construction optimized for compact, high-signal-integrity designs.

1. Product Overview

The TP2000 6mm Pure Gold PCB is a specialized high-frequency rigid circuit board built on a 6mm TP2000 thermoplastic dielectric core, double-clad with 1oz (35μm) electrolytic ductile (ED) copper. Engineered without solder mask or silkscreen, it prioritizes raw radio-frequency performance, dimensional stability, and thermal consistency. The“Pure Gold”designation reflects its premium material formulation, precision fabrication, and noble electrical characteristics rather than a surface plating; the board uses bare copper as the final finish to preserve high-frequency signal transparency and minimize insertion loss.

This DK20 PCB is not a general-purpose commercial board. It is designed for applications where signal purity, miniaturization, wide-temperature resilience, and long-term reliability are non-negotiable. Its 6mm thick core provides exceptional structural rigidity, making it suitable for standalone substrates, antenna radiators, and high-voltage / high-power circuit carriers.

2. PCB Construction

The following table consolidates all mechanical, fabrication, and layout parameters that define the board’s physical build.

3. PCB Stackup

This symmetric 2-layer stackup delivers balanced electrical performance, mechanical stability, and low warpage under thermal cycling.

4. PCB Layout Statistics

This table quantifies component, pad, via, and net complexity for design verification and assembly planning.

TP2000 Copper-Clad Laminate (CCL)–Complete Material Knowledge Base

This section is fully separated from the WanglingTP2000 PCB description and provides in-depth material science, specifications, and application guidance for TP2000 high-frequency CCL.

1. Material Introduction

TP2000 is a proprietary high-frequency thermoplastic copper-clad laminate designed specifically for RF, microwave, and millimeter-wave circuits. Its dielectric layer consists of a ceramic-filled polyphenylene oxide (PPO) resin matrix with no fiberglass reinforcement, enabling exceptional dielectric uniformity, low loss, and precise Dk control. By adjusting the ceramic-to-resin ratio, manufacturers can customize Dk from 3.0 to 25; the standard TP2000 grade is fixed at Dk = 20±0.8 for extreme miniaturization.

Unlike ceramic substrates, TP2000PCB substrate offers superior mechanical toughness, easier machining, and lower cost. Unlike PTFE-based materials, it features better dimensional stability, stronger copper adhesion, and compatibility with standard PCB fabrication processes. It carries UL 94-V0 flammability rating, ensuring safety in enclosed electronic systems.

The TP series includes:

• TP–uncld (bare dielectric sheet)
• TP-1–single-side copper clad
• TP-2–double-side copper clad (standard for PCBs)

2.Datasheet Table–TP2000 CCL

3.Key Material Advantages

1)Ultra-High Dk for Extreme Miniaturization: Dk=20 allows antenna and passive component sizes to be reduced dramatically compared to standard Dk=3–6 materials.

2)Ultra-Low Loss Across Wide Bandwidth: Df remains stable below 10GHz, supporting broadband systems.

3)Excellent Thermal Stability: TCDK and controlled CTE preserve electrical and mechanical performance under thermal shock.

4)Superior Radiation Resistance & Low Outgassing: Ideal for space, avionics, and military systems.

5)Strong Copper Adhesion: More reliable than vacuum-deposited coatings on ceramic substrates.

6)Ease of Machining: Drills, mills, and cuts cleanly without chipping—unlike brittle ceramics.

7)Cost Efficiency: Lower fabrication cost than ceramic substrates while exceeding performance of many thermoset materials.

4.Processing & Assembly Guidelines

1)Multilayer Design: Generally not recommended due to thermoplastic behavior; if required, use low-temperature bonding films with full feasibility validation.

2)Soldering: Avoid wave solder and standard reflow (260°C). Use manual constant-temp soldering. If reflow is mandatory, limit peak temperature to≤200°C.

3)Etching & Plating: Compatible with standard PCB processes; ensure thermal profiles remain within material limits.

4)Testing: Supports IPC-TM-650 and GB/T test methods for dielectric, mechanical, and thermal validation.

5)Thickness Range: Standard 0.5mm–12.0mm; 6.0mm with tight tolerance available.

6)Standard Sizes: 150×150, 160×160, 200×200, 170×240mm; custom sizes available.

5.Typical Applications

TP2000 PCB laminate is the material of choice for:

• High-frequency RF and microwave transceivers
• Phased-array antennas and satellite communications
• Automotive, aerospace, and defense radar systems
• High-power RF amplifiers and filter modules
• Precision test and measurement instrumentation
• Beidou / GNSS terminals, missile-borne electronics, fuzes
• Space-constrained, high-reliability miniaturized systems

Conclusion

The TP2000 high frequency PCB 6mm Pure Gold represents a specialized, high-reliability product for engineers who require extreme electrical performance in a mechanically robust format. The combination of a 6 mm thick ceramic-filled core, pure gold finish, and ultra-low loss tangent makes it unmatched for compact, high-frequency systems operating in harsh environments. The companion TP2000 PCB material offers a versatile, machinable alternative to brittle ceramic substrates while maintaining superior dielectric stability from -100°C to +150°C.