Panasonic Megtron6 M6 High Speed Low Loss 6-Layer PCB 1.4mm Thick
Introduction
In today’s fast-evolving electronics industry, the demand for high-speed, low-loss printed circuit boards (PCBs) is surging, driven by applications in 5G, automotive radar, data centers, and advanced computing. Our M6 High-Speed Low-Loss 6-Layer PCB is engineered to meet these stringent requirements, leveragingPanasonic Megtron6 (M6)R-5775G material for superior signal integrity, thermal stability, and reliability.
This Megtron6 PCB is designed for high-frequency, high-speed digital, and RF applications, ensuring minimal signal loss and consistent performance even in demanding environments. With a 1.4mm thickness, 1oz/0.5oz copper distribution, and ENEPIG surface finish, it delivers exceptional electrical performance while maintaining robust mechanical durability.
PCB Construction
This 6-layer stack-up PCB uses Panasonic Megtron6 (M6) R5775G (HVLP) laminate for high-frequency applications, featuring ENEPIG surface finish and precise manufacturing tolerances.
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Parameter
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Specification
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Base Material
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Megtron6 (M6) – R5775G (HVLP)
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Layer Count
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6-layer rigid
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Board Dimensions
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81.9 mm × 53.7 mm (±0.15mm)
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Minimum Trace/Space
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4/5 mils
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Minimum Hole Size
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0.3mm
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Via Type
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Through-hole only (no blind vias)
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Board Thickness
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1.4mm
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Copper Weight (Outer)
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1oz (35µm)
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Copper Weight (Inner)
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0.5oz (17µm)
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Via Plating Thickness
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25µm
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Via Filling
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0.3mm vias resin-filled & capped
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Surface Finish
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ENEPIG
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Solder Mask (Top/Bottom)
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Matte Black
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Silkscreen (Top/Bottom)
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White
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Electrical Test
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100% tested (IPC-Class-2)
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PCB Stackup
Optimized 6-layer design ensures signal integrity and power distribution.
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Layer
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Material
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Thickness
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Top Layer (L1)
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Copper (35µm)
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-
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Prepreg
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R-5670(G) 1080
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85.1µm
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Inner Layer 1 (L2)
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Copper (17µm)
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-
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Core
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M6 R5775G (HVLP)
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500µm
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Inner Layer 2 (L3)
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Copper (17µm)
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-
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Prepreg
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R-5670(G) 3313
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99.4µm
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Inner Layer 3 (L4)
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Copper (17µm)
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-
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Core
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M6 R5775G (HVLP)
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500µm
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Inner Layer 4 (L5)
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Copper (17µm)
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-
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Prepreg
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R-5670(G) 1080
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85.1µm
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Bottom Layer (L6)
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Copper (35µm)
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-
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PCB Statistics
Designed for complex circuit requirements.
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Component
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Quantity
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Total Components
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108
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Pads
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247
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Through-Hole Pads
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125
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SMT Pads (Top)
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98
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SMT Pads (Bottom)
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24
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Vias
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412
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Nets
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8
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Megtron6 (M6) R-5775 introduction
At the heart of our M6 High Speed Low Loss PCB lies the revolutionary Megtron6 R-5775 material, renowned for its superior performance in high-frequency applications. Boasting a low dielectric loss, stable dielectric constant, and exceptional thermal reliability, the M6 material PCB is tailor-made to meet the stringent requirements of 5G communication, millimeter-wave radar, and cutting-edge computing technologies.
Megtron6 Material Properties
Critical electrical and thermal characteristics of the base laminate.
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Property
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Value
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Dk @ 1GHz/23°C
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3.4
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Dk @ 13GHz
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3.34
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Df @ 1GHz/23°C
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0.002
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Df @ 13GHz
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0.0037
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CTE (X/Y)
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16 ppm/°C
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CTE (Z)
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45 ppm/°C
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Tg (DSC)
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>185°C
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Tg (DMA)
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210°C
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Td (TGA)
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410°C
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Flammability Rating
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UL 94V-0
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RoHS Compliance
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Yes
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Applications
6-Layer Megtron 6 PCB finds applications across various industries, including:
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- 5G Communication Base Stations: Millimeter-wave antennas, radio - frequency front - ends of AAU (Active Antenna Unit).
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- Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver - Assistance Systems).
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- Data Centers: High-speed server motherboards, 400G/800G optical module PCBs.
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- Aerospace: High-frequency circuit boards for satellite communication and radar systems.
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- Consumer Electronics: High-frequency Wi-Fi 6E/7 routers, AR/VR devices.
Ordering Information
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Artwork Format: Gerber RS-274-X
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Quality Standard: IPC-Class-2
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Lead Time: Standard production lead times apply (contact for details).
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Customization: Available upon request (different thicknesses, materials, finishes).
Conclusion
Our M6 High-Speed Low-Loss 6-Layer PCB is engineered for high-frequency, high-speed, and high-reliability applications, making it an ideal choice for 5G, automotive radar, data centers, and aerospace systems. With Megtron6 material, ENEPIG finish, and resin-filled vias, it delivers exceptional signal integrity, thermal performance, and long-term reliability.
Contact us today to discuss how this PCB can enhance your next high-performance electronic design!
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