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The RF-35 2-layer 20mil PCB is a high-performance, cost-effective solution for RF and microwave applications.
Item NO.:
BIC-363-v46.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Taconic RF-35 PCB 2-layer 20mil 0.508mm Substrate ENIG High Frequency Circuit Board
Introduction
The RF-35 PCB (2-layer, 20mil thickness) is a high-performance printed circuit board designed for radio frequency (RF) and microwave applications. Manufactured using Taconic RF-35 organic-ceramic laminate, this20milRF-35 PCB offers exceptional electrical performance, low signal loss, and high reliability—making it ideal for commercial wireless, telecommunications, and high-frequency electronics.
This product description provides an in-depth analysis of the PCB construction, stackup, material properties, key features, benefits, and applications, ensuring engineers and procurement specialists have all necessary technical details for seamless integration into their projects.
PCB Construction Details
Below is a detailed breakdown of the 20mil RF-35 substrate PCB’s construction parameters, including material specifications, dimensional tolerances, and manufacturing standards.
Parameter |
Specification |
Base Material |
RF-35 (Taconic organic-ceramic laminate) |
Layer Count |
2-layer rigid PCB |
Board Dimensions |
239.5mm x 130mm (±0.15mm) |
Minimum Trace/Space |
5/7 mils |
Minimum Hole Size |
0.3mm |
Blind/Buried Vias |
No |
Finished Thickness |
0.6mm (20mil core + 35µm Cu layers) |
Copper Weight (Outer) |
1oz (35µm) |
Via Plating Thickness |
25µm |
Surface Finish |
Electroless Nickel Immersion Gold (ENIG) |
Silkscreen (Top/Bottom) |
No |
Solder Mask (Top/Bottom) |
No |
Electrical Testing |
100% tested prior to shipment |
PCB Stackup (2-Layer Rigid Structure)
The stackup configuration ensures optimal signal integrity and mechanical stability for high-frequency applications.
Layer |
Material/Thickness |
Top Layer |
Copper (35µm / 1oz) |
Core |
RF-35 Laminate (20mil / 0.508mm) |
Bottom Layer |
Copper (35µm / 1oz) |
PCB Statistics
The following table summarizes the component and connectivity details of the RF-35 Taconic PCB design.
Parameter |
Value |
Components |
18 |
Total Pads |
98 |
Thru-Hole Pads |
72 |
Top SMT Pads |
26 |
Bottom SMT Pads |
0 |
Vias |
32 |
Nets |
2 |
Key Features of RF-35 Material
The Taconic RF-35 laminate is engineered for high-frequency performance with the following characteristics:
-Dielectric Constant (Dk) @ 1.9GHz: 3.5 (stable across frequencies)
-Dissipation Factor (Df) @ 1.9GHz: 0.0018 (ultra-low signal loss)
-Dielectric Breakdown Voltage: 41 kV (high voltage resistance)
-CTE (Coefficient of Thermal Expansion):
-Flammability Rating: UL-94 V0 (self-extinguishing)
Benefits of RF-35 PCB
Applications
The RF-35 Taconic High Frequency PCB is ideal for:
- Power amplifiers
- Filters and couplers
- Passive components
Manufacturing & Quality Assurance
Conclusion
The RF-35 2-layer 20mil PCB is a high-performance, cost-effective solution for RF and microwave applications. With low signal loss, excellent thermal stability, and superior peel strength, it is an optimal choice for wireless communications, power amplifiers, and passive RF components.
For engineers seeking a reliable, high-frequency PCB with stringent manufacturing tolerances, the RF-35 Taconic PCB Materials design ensures consistent performance and durability in demanding environments.
Contact us today for pricing, lead times, and custom configurations!
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