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Home Newly Shipped RF PCB F4BTMS350 PCB 6.35mm Thick F4B DK 3.5 with HASL Circuit Board

F4BTMS350 PCB 6.35mm Thick F4B DK 3.5 with HASL Circuit Board

The F4BTMS350 PCB is an advanced addition to the F4BTMS series, featuring significant advancements in material formulation and manufacturing processes.

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F4BTMS350 PCB 6.35mm ThickF4B DK 3.5 with HASL Circuit Board



The F4BTMS350 PCB is an advanced addition to the F4BTMS series, featuring significant advancements in material formulation and manufacturing processes. This high-reliability PCB is designed for aerospace applications and offers superior performance and reliability. By incorporating ultra-thin glass fiber cloth and a substantial amount of specially engineered nano-ceramics mixed with polytetrafluoroethylene resin, the F4BTMS350 PCB delivers excellent dielectric properties, enhanced dimensional stability, reduced anisotropy, improved electrical strength, and superior thermal conductivity. With its low thermal expansion coefficient and stable dielectric temperature characteristics, this PCB sets a new standard in high-performance materials.



The F4BTMS350 PCB comes with several exceptional features that contribute to its enhanced performance and reliability:


Dielectric Constant (Dk):

The PCB exhibits a dielectric constant of 3.5 at 10GHz, ensuring excellent signal integrity and transmission efficiency.


Dissipation Factor:

With a dissipation factor of 0.0016 at 10GHz, 0.0019 at 20GHz, and 0.0024 at 20GHz, the F4BTMS350 PCB minimizes signal loss and distortion, enabling high-frequency applications to operate with utmost precision.


Coefficient of Thermal Expansion (CTE):

The PCB demonstrates a low CTE of 10 ppm/°C (x-axis), 12 ppm/°C (y-axis), and 20 ppm/°C (z-axis) in the temperature range of -55°C to 288°C. This exceptional thermal stability ensures consistent performance under varying environmental conditions.


Thermal Coefficient of Dk:

The F4BTMS350 PCB exhibits a low thermal coefficient of Dk at -39 ppm/°C in the temperature range of -55°C to 150°C, enabling reliable operation even in demanding thermal environments.


Thermal Conductivity:

With a thermal conductivity of 0.6 W/mk, the F4BTMS350 PCB efficiently dissipates heat, ensuring optimal thermal management in high-power applications.


Moisture Absorption: 

The F4BTMS350 PCB has a moisture absorption rate of only 0.03%, ensuring long-term reliability and stability in humid environments.




PCB Stackup and Construction Details:

The F4B printed circuit board features a 2-layer rigid construction, combining robustness with ease of manufacturing. The stackup consists of the following layers:


Copper Layer 1: 35 μm thickness

F4BTMS350 Core: 6.35 mm (250 mil) thickness

Copper Layer 2: 35 μm thickness


PCB Construction Details


Board Dimensions

76mm x 76mm +/- 0.15mm

Minimum Trace/Space

6/7 mils

Minimum Hole Size


Blind Vias


Finished Board Thickness


Finished Cu Weight

1oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Hot Air Soldering Level (HASL)

Top Silkscreen


Bottom Silkscreen


Top Solder Mask


Bottom Solder Mask


Electrical Test

100% Electrical test used prior to shipment



PCB Statistics:

The F4B DK3.5 PCB is designed to accommodate a variety of applications, with the following statistics:

PCB Statistics




Total Pads


Thru Hole Pads


Top SMT Pads


Bottom SMT Pads








Artwork and Quality Standard:

The F4BTMS350 PCB is manufactured using Gerber RS-274-X artwork, ensuring compatibility and ease of integration with standard design tools and workflows. It adheres to the IPC-Class-2 quality standard, guaranteeing consistent high-quality production and reliability.


Availability and Typical Applications:

The F4BTMS350 PCB is available worldwide, making it easily accessible for various industries and applications. Its exceptional performance and reliability make it suitable for a wide range of uses, including:


1.Aerospace Equipment:

The PCB's robust construction and high-frequency capabilities make it ideal for aerospace applications, including space and cabin equipment.


2.Microwave and RF:

With its low loss and high dielectric constant, the F4BTMS350 PCB enables efficient microwave and RF signal transmission, meeting the demanding requirements of these applications.


3.Radar Systems: 

TheF4BTMS350 PCB is well-suited for radar systems, including military radar, thanks to its excellent dielectric properties and low signal loss.


4.Feed Networks:

The PCB's dimensional stability and low anisotropy make it an excellent choice for feed networks, ensuring reliable and consistent signal distribution.


5.Phase-Sensitive Antennas and Phased Array Antennas:

The F4BTMS350 PCB's high electrical strength and thermal conductivity enhance the performance of phase-sensitive antennas, enabling precise and accurate signal reception and transmission.


6.Satellite Communications:

With its advanced material formulation and superior dielectric properties, the F4BTMS350 PCB is an ideal choice for satellite communications systems, providing reliable and efficient signal processing.


And many more applications where high reliability, excellent signal integrity, and thermal stability are paramount.



In conclusion, the F4BTMS350 6.35mm PCB sets a new standard in high-performance materials. With its technological breakthrough in material formulation and manufacturing processes, it offers enhanced performance, reliability, and versatility. The PCB's exceptional dielectric properties, low signal loss, and thermal stability make it ideal for a wide range of applications, including aerospace equipment, microwave and RF systems, radar systems, feed networks, phase-sensitive antennas, phased array antennas, satellite communications, and more. With its availability worldwide and adherence to IPC-Class-2 quality standards, the F4B material PCB is ready to meet the demands of the most challenging and critical applications.

 University Collaboration


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