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Home Newly Shipped RF PCB F4BTM High Frequency PCB DK 3.0 F4BTM 1.524mm Substrate HASL Surface Finishes

F4BTM High Frequency PCB DK 3.0 F4BTM 1.524mm Substrate HASL Surface Finishes

The F4BM series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.




  • Item NO.:

    BIC-232-v297.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



F4BTM High Frequency PCB DK 3.0F4BTM 1.524mm Substrate HASL Surface Finishes


Introduction

This F4BTM series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.

 

F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, suitable for applications without PIM requirements, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.

 

Features & Benefits

-DK range from 2.98 to3.5 is available

- Addition of ceramics enhances the performance.

-F4BTME exhibits excellent PIM performance,

- Comes in various thicknesses and sizes, offers cost savings

- Commercialization, large-scale production, and high cost-effectiveness.

- Radiation-resistant and low out-gassing properties

 

Models & Data Sheet


Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350
Dielectric Constant (Typical) 10GHz / 2.98  3.0  3.2  3.5 
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018  0.0018  0.0020  0.0025 
20GHz / 0.0023  0.0023  0.0026  0.0035 
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78  -75  -75  -60 
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity  Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion   XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78  72  58  51 
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25  2.25  2.20  2.20 
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.42  0.42  0.50  0.54 
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

 

Our PCB Capability (F4BTM)


PCB Capability (F4BTM) 
PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation                        (F4BTM ) F4BTM DK (10GHz) DF (10 GHz)
F4BTM298 2.98±0.06 0.0018 
F4BTM300 3.0±0.06 0.0018 
F4BTM320 3.2±0.06 0.0020 
F4BTM350 3.5±0.07 0.0025 
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness               (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

F4BTM PCB and Applications

The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.

 

This type of F4BTM high frequency PCB is utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, Beidou, Missile-borne, Power Amplifier, and Radio Frequency.


F4BTM300 PCB

 

Final(F4BTM series aluminum-based/copper-based substrates)

F4BTM series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side of the dielectric layer is covered with either aluminum-based orcopper-based material. This arrangement serves the purpose of shielding or heat dissipation.

 

For examples, F4BTM300-AL represents F4BTM300 with aluminum-based substrate.

 

 




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